TW565916B - Chip module for a smart card and method of making the same - Google Patents
Chip module for a smart card and method of making the same Download PDFInfo
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- TW565916B TW565916B TW091113716A TW91113716A TW565916B TW 565916 B TW565916 B TW 565916B TW 091113716 A TW091113716 A TW 091113716A TW 91113716 A TW91113716 A TW 91113716A TW 565916 B TW565916 B TW 565916B
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- smart card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
565916 --m 91113716 年 胃 B —條正 五、發明說明（1) ~ ----- 【發明領域】 本發明係有關於一種供裝設於一智慧卡〔smart card〕之晶片模組，特別係有關於一種具 晶片模組，以適用於捲帶傳輪〔reel_t"有J撓== 程。 〇丨 【先前技術】 智慧卡〔smart card〕係在塑膠卡片上裝設一晶片模 、、且 $知晶片模組係具有運算與記憶能力，而能產生多種 ^能，運用於各種場合，例如辨識持卡人之身份、以電子 資料方式儲存與處理金額，而成為電信卡、Ic健保卡、金 融卡、信用卡或GSM卡。 在美國專利第6, 049, 055號中，其係揭示一種智慧1卡 之製造方法，其晶片模組係具有外露於智慧卡之接點，接 點表面形成有複合金屬層，利用雷射光〔laser beam〕照 射该複合金屬層’以形成圖案狀之合金層，可作為不可被 更改之序號或圖案標記，但未述及該晶片模組及其製造方 法。 ' 中華民國專利第484222號係揭示一種導線架式半導體 封装結構，其晶片組係適用於一多媒體卡，該封裝結構係 以一導線架承載一晶片，導線架具有一以彎折連桿連接之| 下沉晶片座及多個彎折下沉之内導腳，由於該導線架之多 處彎折，在製作及儲放時佔用較大空間且無法捲收於一捲 輪，故導線架僅能以條狀方式封裝一晶片且無法疊放，此 外’習知之導線架厚度係在0.2〜0·4πιιη ’不適用於捲帶傳565916 --m 91113716 Years Stomach B-Article 5: Description of Invention (1) ~ ----- [Field of Invention] The present invention relates to a chip module for installation on a smart card. In particular, it relates to a module with a chip, which is suitable for a reel transfer wheel [reel_t " 有 J 歪 == 程. 〇 丨 [Previous technology] Smart card [smart card] is equipped with a chip mold on a plastic card, and the chip module has computing and memory capabilities, and can generate a variety of energy, and is used in various situations, such as Identifies the identity of the cardholder, stores and processes the amount in electronic data, and becomes a telecommunications card, Ic health card, financial card, credit card or GSM card. In U.S. Patent No. 6,049,055, it discloses a method for manufacturing a smart card. The chip module has contacts exposed on the smart card, a composite metal layer is formed on the surface of the contact, and laser light is used. laser beam] irradiates the composite metal layer to form a patterned alloy layer, which can be used as a serial number or pattern mark that cannot be changed, but the chip module and its manufacturing method are not described. '' The Republic of China Patent No. 484222 discloses a lead frame type semiconductor package structure. The chip set is suitable for a multimedia card. The package structure uses a lead frame to carry a chip, and the lead frame has a connecting rod connected by a bending link. | Sinking wafer base and multiple bent and sunken inner guide feet. Due to the multiple bends of the lead frame, it takes up a lot of space during production and storage and cannot be rolled up on a reel, so the lead frame is only A chip can be packaged in a stripe manner and cannot be stacked. In addition, 'the thickness of the conventional lead frame is 0.2 ~ 0 · 4πιιη' is not suitable for tape transfer
565916 曰 i正 案號 91113716 五、發明說明（2) 輪〔reel-to-reel〕之製作流程。 -導圖所不’一習知智慧卡之晶片模組70係包含有 〔封膠體73，該封膠體73係用以密封-晶片 ==接二延伸在封膠體73外部之導線㈣係= 點 乍為瀘日曰片模組7 0之外部電性接 ^ ’此一封膠體73係容易在四周邊形， 接 膠模具之排氣孔〔圖未綠出〕==?7二ί係由封 ”，影響該連接面72之=;所= 該連接面 部結合與電性連接。 度判於該晶片模組70之外 【發明目的及概要】 ^明t主要目的係在於提供一種智慧卡之晶 :翼=!f之溢膠區係預設於一可撓性基板之相鄰延 度，以供平整而良好地結合於一智慧卡。 整 之次一g的係在於提供」種智慧卡之晶片模 。其：，基板具有一不大於015mffl之厚度並具有延伸 忒可撓性基板之上表面之封膠體係不覆蓋延伸 =夕連接部之上表面，以供捲帶式線上連續生產。 β制i ί明之再一目的係在於提供一種智慧卡之晶片模組 Ά ^法，在壓模過程時，模具之排氣孔係設於可撓性 ^，相鄰延伸翼片之外連接部之間，以控制封膠體之溢 區域内，冑免影響外連接部之上表面，以供平整 而良好地結合於一智慧卡。 …， 依本發明之智慧卡之晶片模組其主要包含有一可撓565916, i-form No. 91113716 V. Description of the invention (2) Production process of reel-to-reel. -The map module 70 of the conventional smart card does not contain a sealant [73], which is used to seal-chip == two wires extending outside the sealant 73 = point At first glance, the external electrical connection of the chip module 7 0 the next day ^ 'This piece of gel 73 is easy to be shaped in the four perimeters, and the vent hole of the plastic mold [not shown in green] ==? 2 Sealing ", which affects the connection surface 72; so = the connection surface is combined with electrical connection. It is judged outside the chip module 70 [Objective and Summary of Invention] The main purpose is to provide a smart card. Crystal: Wing =! F The overflow area is preset to the adjacent extension of a flexible substrate for smooth and good integration into a smart card. The next whole g is to provide "types of smart cards" Wafer die. Its: the substrate has a thickness of not more than 015mffl and has an extension. The sealant system on the upper surface of the flexible substrate does not cover the upper surface of the extension = evening connection part for continuous production on a tape-and-reel line. Another purpose of the beta system is to provide a smart card chip module. During the compression molding process, the vent holes of the mold are set to be flexible, and the connecting portions outside the adjacent extension fins In order to control the inside of the overflow area of the sealing gel and avoid affecting the upper surface of the external connection part, it can be smoothly and well combined in a smart card. ..., the chip module of the smart card according to the present invention mainly includes a flexible
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不大於0. 15mm並包 該黏晶座之上表面 有一内結合部及一 片之電性連接，而 一封膠體係形成於 結合部之上表面， 相鄰延伸翼片之外 連接部之表面，較 連接部之間係形成 進延伸翼片之結合 慧卡之晶片模組之 兩側具有鏈孔，在 ’每一可撓性基板 每一延伸翼片係包 晶片係黏設至該些 該些延伸翼片之内 之上表面形成一封 上表面與該些延伸 充於一壓模模具之 應可撓性基板之相 設於外連接部與黏 該封膠體在排氣孔 外連接部之上表面 性基板，其厚度係 個延伸翼片，其中 每一延伸翼片係具 部之上表面係供晶 接至一智慧卡，而 該些延伸翼片之内 一溢膠區，形成於 影響延伸翼片之外 片之内結合部與外 膠體所填充，以增 依本發明之智 一捲帶，該捲帶之 複數個可撓性基板 個延伸翼片，其中 外連接部，複數個 性連接該些晶片至 在每一可撓性基板 成於每一黏晶座之 表面，當封膠體填 之排氣孔係設於對 部之間，較佳地係 合部之周邊，使得 會影響延伸翼片之 【發明詳細說明】 含有一黏晶座與複數 係黏設有一晶片，且 外連接部，該内結合 外連接部係供外部連 該黏晶座之上表面與 該封膠體係具有至少 連接部之間，以避免 佳地，在每一延伸翼 有槽孔’其係被該封 性。 製造方法，首先提供 兩側鏈孔之間係具有 具有一黏晶座與複數 含有一内結合部及一 黏晶座之上表面並電 結合部，以壓模方式 膠體，該封膠體係形 翼片之内結合部之上 模穴時，該壓模模具 鄰延伸翼片之外i接 晶座之間或設於内結 處形成之溢膠區係不No more than 0.15mm and the upper surface of the stick crystal base has an inner joint and a piece of electrical connection, and a glue system is formed on the upper surface of the joint, and the surface of the outer joint of the adjacent extension wing, There are chain holes on both sides of the chip module of the combined HC card which is formed into the extension fins between the connecting parts. Each extension fin of each flexible substrate is packaged to the extensions. An upper surface of the inner surface of the wing forms an upper surface and the phases of the flexible substrates which are filled in a compression mold. The upper surface is provided on the outer connection portion and the upper surface of the outer connection portion of the sealant is adhered to the sealant. The thickness of the extension substrate is an extension wing, wherein the upper surface of each extension wing is provided for crystal connection to a smart card, and an overflow area inside the extension fins is formed to affect the extension wing. The inner joint portion of the outer sheet and the outer colloid are filled to add a tape according to the present invention, the flexible substrate has a plurality of flexible substrates and extension wings, and the outer connecting portion is connected to the chips with a plurality of individualities. To be formed on each flexible substrate On the surface of a viscous crystal base, when the exhaust hole filled by the sealing compound is arranged between the opposite parts, preferably the periphery of the joint part, so that it will affect the extension wing. [Detailed description of the invention] A plurality of systems are provided with a chip and an external connection portion. The internal and external connection portions are provided for external connection between the upper surface of the sticky crystal holder and the sealant system with at least a connection portion, so as to avoid a good situation, The wings have slots' which are sealed by this. The manufacturing method includes firstly providing a viscous crystal base with a plurality of internal bonding portions and an upper surface of the viscous crystal base and electrical bonding portions between the chain holes on both sides. When the die cavity is above the inner joint of the sheet, the rubber mold overflow area formed between the die pad adjacent to the extension fin and the die seat is located at the inner junction.
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五、發明說明（4) 凊參閱所附圖式，本發明將列舉以下之實施例說明：V. Description of the invention (4) 凊 With reference to the attached drawings, the present invention will enumerate the following embodiments:
依本發明之智慧卡之晶片模組，如第1至3圖所示，該 ，晶片模組係主要包含有一晶片i 〇、一可撓性基板2〇及一封 膠體40，該可撓性基板20係為金屬薄膜〔metai Π1ιη〕或 軟性電路板〔flexible printe(i Circuit board〕，其厚 度係小於0· 15_，以適用於捲帶傳輸〔reel — t〇 —reel〕之 製作流程，在本實施例中，該可撓性基板2〇係為一銅質之 金屬薄膜’其表面電鑛有銀、錫、鎳、金或其合拿，該可 撓性基板2 0係包含有一黏晶座21與複數個延伸翼；片2 2 ,其 中該黏晶座2 1具有一上表面211 ’其係黏設有該晶片i 〇 〔如第3圖所示〕，且每一延伸翼片22係具有一内結合部 23及一外連接部24，在内結合部23與外連接部24之間係形 成有槽孔25 ’而如金線之焊線〔bonding wire〕或捲帶自 動接合引才曰〔Tape Automated Bonding Lead〕等電性連 接裝置3 0係連接晶片1 〇之焊墊11與延伸翼片2 2之内結合部 之上表面231，一以壓模〔m〇iding〕形成之封膠體4〇係 形成於黏晶座21之上表面211與該些延伸翼片22之内結合 23之上表面231，並顯露該些延伸翼片22之外連接部24 之上表面241，作為非接觸式智慧卡〔c〇ntactless smartAccording to the chip module of the smart card according to the present invention, as shown in FIGS. 1 to 3, the chip module mainly includes a chip i 0, a flexible substrate 20, and a colloid 40. The flexibility The substrate 20 is a metal thin film [Mei Π1ιη] or a flexible circuit board [Flexible printe (i Circuit board)], and its thickness is less than 0. 15_, which is suitable for the production process of tape and reel [reel — t〇 — reel]. In this embodiment, the flexible substrate 20 is a copper metal film. The surface of the flexible substrate 20 is silver, tin, nickel, gold, or a combination thereof. The flexible substrate 20 includes a sticky crystal. A base 21 and a plurality of extending wings; a sheet 2 2, wherein the sticky crystal base 21 has an upper surface 211 ′, which is provided with the wafer i 〇 (as shown in FIG. 3), and each of the extending wings 22 It has an inner joint portion 23 and an outer joint portion 24, and a slot 25 'is formed between the inner joint portion 23 and the outer joint portion 24, such as a gold wire bonding wire (bonding wire) or a tape automatic joining guide. Cai Yue [Tape Automated Bonding Lead] and other electrical connection devices 30 are connected to the pads 10 of the wafer 10 and the extension wings The upper surface 231 of the inner joint portion 2 is formed by a molding compound 40 formed on the upper surface 211 of the viscous crystal holder 21 and the inner joint 23 of the extended wings 22 The surface 231 and the upper surface 241 of the connecting portions 24 outside the extended wings 22 are exposed as a contactless smart card [c〇ntactless smart
card〕之連接端，該封膠體40係具有至少一溢膠區41、乜 〔如第1圖所示〕，其係由封膠模具之排氣孔所形成並形 成於相鄰延伸翼片2 2之外連接部2 4之間，以避免影響延伸 翼片22之外連接部24 ’使得外連接部24之上表面241不致 被污染，較佳地，溢膠區41、42係位於晶片模組^緣之切card] connection end, the sealant 40 has at least one glue overflow area 41, 乜 [as shown in Figure 1], which is formed by the exhaust hole of the sealant mold and is formed on the adjacent extension wing 2 2 between the outer connecting portions 24 and 4 to avoid affecting the outer connecting portion 24 ′ of the extension fin 22 so that the upper surface 241 of the outer connecting portion 24 is not contaminated. Preferably, the glue overflow areas 41 and 42 are located on the wafer mold. Group ^
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=道26〔如第4C圖所示〕，以供切割時一併被切除，在本 、施例中’如第2圖所示’封膠體4 〇係填充於槽孔2 5，以 ，進對延伸翼片22之結合性，且封膠體4〇之溢膠區41係形 成於外連接部2 4與黏晶座2 1之間，而溢膠區4 2係形成於内 結合部23周邊。 、 ^ 在上述之智慧卡之晶片模組中，由於溢膠區4 1、4 2係 口又於相鄰延伸翼片2 2之外連接部2 4之間，外連接部2 4之上 表面2 41對智慧卡有良好之連接，不致有殘留之封膠體4 〇 於外連接部24之上表面241上，確保晶片模組能平整而良 好地結合於智慧卡内，並且，該可撓性基板2〇係可適用於 捲帶傳輸〔reel-to-reel〕之製作流程，可供連續性之線 上生產。= Road 26 (as shown in FIG. 4C), which will be cut off at the same time when cutting. In this and the examples, the “sealing colloid 4” shown in FIG. 2 is filled in the slot 25. The adhesiveness to the extended fins 22, and the overflow region 41 of the sealing compound 40 is formed between the outer connecting portion 24 and the viscous crystal holder 21, and the overflow region 4 2 is formed around the inner joint portion 23. . ^ In the chip module of the smart card mentioned above, since the overflow area 4 1 and 4 2 are between the outer connecting portion 2 4 and the upper surface of the outer connecting portion 2 4 of the adjacent extension flap 2 2. 2 41 has a good connection to the smart card, and there is no residual sealing gel 4 0 on the upper surface 241 of the external connection portion 24, to ensure that the chip module can be smoothly and well integrated into the smart card, and the flexibility The substrate 20 is suitable for a reel-to-reel production process and can be produced on a continuous line.
關於該智慧卡之晶片模組之製造方法請參照第4 A至4 c 圖，如第4A圖所示，首先提供一厚度不大於〇15mm之捲帶 50 ’其係為一金屬薄膜，可捲收於一捲輪〔reel〕内，該 捲帶50之兩側分別具有鏈孔51〔spr〇cket h〇le〕，以將 捲帶5 0自一捲輪導出，在兩側鏈孔51之間係具有複數個可 撓性基板2 0 ’其係為對應於每一晶片1 〇之模組單元，每一 可撓性基板20具有一黏晶座21與複數個延伸翼片22，其中 每延伸翼片2 2係包含有一内結合部2 3及一外連接部2 4 , 上述之黏晶座21與延伸翼片22係一體形成於該捲帶5〇 ,如 第4B圓所示，在導出捲帶5〇後，結合複數個晶片1〇至該捲 帶50 ’其係以銀膠〔si iver giue〕或膠帶將晶片1〇黏設 於該些黏晶座21之上表面211，之後以打線方式將焊線之For the method of manufacturing the smart card chip module, please refer to Figures 4A to 4c. As shown in Figure 4A, first provide a tape 50 'with a thickness not greater than 0.15mm, which is a metal film that can be rolled. Closed in a reel, the reel 50 has chain holes 51 (sprOcket hole) on each side of the reel 50 to lead the reel 50 from a reel, and the chain holes 51 on both sides The system has a plurality of flexible substrates 2 0 ′, which are module units corresponding to each wafer 10, and each flexible substrate 20 has a sticky crystal holder 21 and a plurality of extension wings 22, each of which The extension wing 2 2 includes an inner joint portion 23 and an outer connection portion 2 4. The above-mentioned stick crystal holder 21 and the extension wing 22 are integrally formed on the reel 50, as shown by circle 4B. After the tape 50 is led out, a plurality of wafers 10 are combined to the tape 50 ′, and the wafer 10 is bonded to the upper surface 211 of the sticky crystal bases 21 with silver glue or tape. Wire bonding
第9頁 565916 --91113716 车月日 條正 五、發明說明（6) 電性連接裝置3 0電性連接晶片1 〇與該些延伸翼片2 2之内結 合部23之上表面231，之後如第4C圖所示，對應於每一可 $性基板20形成一封膠體4〇，其係以壓模〔m〇lding〕技 術該封膠體4 0係形成於每一黏晶座21之上表面211與該些 L伸翼片22之内結合部23之上表面231，如第5圖所示，而 壓模之上模具60係具有複數個用以使封膠體4〇成形之模穴 61 ’且该上模具60在每一模穴61連通有一注膠口 63及對應 之排氣孔62，當可撓性基板2〇被上模具60與下模具壓合 〔圖未緣出〕時，該些排氣孔62係設於可撓性基板2〇之兩 延伸翼片2 2之外連接部2 4之間，在本實施例中，一排氣孔 62係設於該延伸翼片22之内結合部23周邊，另一排氣孔62 係設於該延伸翼片22之外連接部24與黏晶座21之間，因 此，當封膠體40係填充於該模穴61時，封膠體4〇之溢膠區 41、42將有效局限在上述排氣孔62 ,不會影響至延伸翼片 22之外連接部24，再將每一可撓性基板2〇沿切割道26自捲 帶50切離〔如第4C圖所示〕，即可得到一智慧卡之晶片模 組，部份之溢膠區4 1、4 2係被切除，而其延伸翼片2 2之外 連接。卩24之上表面241係能平整而良好地結合於一非接觸 式智慧卡〔contactless smart card〕。 、故本發明之保護範圍當視後附之申請專利範圍所界定· 者為準，任何熟知此項技藝者，在不脫離本發明之精神和 範圍内所作之任何變化與修改，均屬於本發明之保護範Page 9 565916 --91113716 Car Moon Date Article 5. Description of the Invention (6) Electrical connection device 3 0 electrically connects the chip 1 〇 and the upper surface 231 of the joint portion 23 within the extended wings 22 As shown in FIG. 4C, a colloid 40 is formed corresponding to each flexible substrate 20, and the sealing colloid 40 is formed on each of the viscous crystal bases 21 by a stamping technique. The surface 211 and the upper surface 231 of the inner joint portion 23 of the L-shaped fins 22 are shown in FIG. 5, and the mold 60 on the compression mold has a plurality of mold cavities 61 for forming the sealant 40. 'And the upper mold 60 communicates with an injection port 63 and a corresponding exhaust hole 62 in each cavity 61. When the flexible substrate 20 is pressed by the upper mold 60 and the lower mold (not shown in the figure), The exhaust holes 62 are provided between the outer connecting portions 24 of the two extending wings 22 of the flexible substrate 20. In this embodiment, an exhaust hole 62 is provided in the extending wings 22. Around the inner joint portion 23, another exhaust hole 62 is provided between the outer connecting portion 24 of the extension fin 22 and the viscous crystal holder 21. Therefore, when the sealing compound 40 is filled in the cavity 61, the sealing gum The overflow area 41, 42 of the body 40 will be effectively limited to the above-mentioned exhaust hole 62, and will not affect the connecting portion 24 outside the extension wing 22, and then each flexible substrate 20 will be rolled up along the cutting path 26 With 50 cuts off (as shown in Figure 4C), a chip module for a smart card can be obtained. Part of the overflow area 4 1 and 4 2 are cut off, and the extension wings 22 are connected outside. The upper surface 241 of the 卩 24 can be smoothly and smoothly combined with a contactless smart card. 2. Therefore, the scope of protection of the present invention shall be defined by the scope of the attached patent application. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention belong to the present invention. Range of protection
第10頁 565916 __索號911137ϋ 车月 fi 倏正___ 圖式簡單說明 【圖式說明】 第 1 圖：依照本發明，一智慧卡之晶片模組之上視 圖； 第 2 圖：依照本發明，該智慧卡之晶片模組之底視 圖； 第 3 圖··依照本發明，該智慧卡之晶片模組之截面 圖； 第4A至4C圖：依照本發明，在該晶片模組之捲帶式製造過 程中該捲帶之示意圖； 第 圖：依照本發明，封裝該晶片模組之上模具示意 圖；及 第 6 圖：習 【圖號說明】 10 晶片 20 可撓性基板 22 延伸翼片 2 4 外連接部 26 切割道 30 電性連接跤 42 溢膠區 50 捲帶 6 0 上模具 63 注膠口 7 0 晶片模組 智慧卡之晶片才 11 焊墊 21 黏晶座 23内結合部 2 4 1上表面 40 封膠體 51 鏈孔 61 模穴 71導線架 組之上視圖。 211上表面 2 3 1上表面 25 槽孔 41 溢膠區 62 排氣孔 72 連接面Page 10 565916 __ 索 号 911137ϋ 车 月 fi 倏 正 ___ Schematic description [Schematic description] Figure 1: Top view of a smart card chip module according to the present invention; Figure 2: According to this The invention, the bottom view of the chip module of the smart card; Fig. 3 ... According to the present invention, the cross-sectional view of the chip module of the smart card; Figs. 4A to 4C: According to the present invention, in the roll of the chip module Schematic diagram of the tape during the tape manufacturing process; Figure 1: Schematic diagram of the mold on which the wafer module is packaged according to the present invention; and Figure 6: Xi [Illustration of the drawing number] 10 Wafer 20 Flexible substrate 22 Extension wing 2 4 Outer connection part 26 Cutting path 30 Electrical connection wrestling 42 Overfill area 50 Tape and reel 6 0 Upper mold 63 Injection port 7 0 Wafer module for smart card of chip module 11 Solder pad 21 Adhesive base 23 Inner joint 2 4 1 Upper surface 40 Sealing gel 51 Chain hole 61 Mold cavity 71 Top view of lead frame group. 211 upper surface 2 3 1 upper surface 25 slot hole 41 overflow area 62 exhaust hole 72 connection surface
$ 11頁 565916 案號 91113716 年月曰 修正 圖式簡單說明 73 封膠體 74 溢膠$ 11 pages 565916 Case No. 91113716 Amendments Brief description of drawings 73 Sealant 74 Overfill
第12頁Page 12
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW091113716A TW565916B (en) | 2002-06-20 | 2002-06-20 | Chip module for a smart card and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW091113716A TW565916B (en) | 2002-06-20 | 2002-06-20 | Chip module for a smart card and method of making the same |
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| Publication Number | Publication Date |
|---|---|
| TW565916B true TW565916B (en) | 2003-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091113716A TW565916B (en) | 2002-06-20 | 2002-06-20 | Chip module for a smart card and method of making the same |
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| Country | Link |
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| TW (1) | TW565916B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI405129B (en) * | 2005-11-14 | 2013-08-11 | Tyco Electronics France Sas | Smart card body, smart card and manufacturing process for same |
| TWI452523B (en) * | 2007-04-24 | 2014-09-11 | Smartrac Ip Bv | Electronic interface apparatus and method and system for manufacturing same |
| TWI506561B (en) * | 2008-11-19 | 2015-11-01 | Internat Frontier Tech Lab Inc | Embossed hologram chip and its manufacturing method |
| TWI625675B (en) * | 2015-02-20 | 2018-06-01 | 賀利氏德國有限兩合公司 | Ribbon-shaped substrate for manufacturing chip card modules, chip card module, electronic device with such a chip card module and method for manufacturing a substrate |
-
2002
- 2002-06-20 TW TW091113716A patent/TW565916B/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI405129B (en) * | 2005-11-14 | 2013-08-11 | Tyco Electronics France Sas | Smart card body, smart card and manufacturing process for same |
| TWI452523B (en) * | 2007-04-24 | 2014-09-11 | Smartrac Ip Bv | Electronic interface apparatus and method and system for manufacturing same |
| US9038913B2 (en) | 2007-04-24 | 2015-05-26 | Smartrac Ip B.V. | Electronic interface apparatus and method and system for manufacturing same |
| US9773201B2 (en) | 2007-04-24 | 2017-09-26 | Smartrac Ip B.V. | Electronic interface apparatus and method and system for manufacturing same |
| TWI506561B (en) * | 2008-11-19 | 2015-11-01 | Internat Frontier Tech Lab Inc | Embossed hologram chip and its manufacturing method |
| TWI625675B (en) * | 2015-02-20 | 2018-06-01 | 賀利氏德國有限兩合公司 | Ribbon-shaped substrate for manufacturing chip card modules, chip card module, electronic device with such a chip card module and method for manufacturing a substrate |
| US10176420B2 (en) | 2015-02-20 | 2019-01-08 | Heraeus Deutschland GmbH & Co. KG | Strip-type substrate for producing chip card modules |
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