CN107068403B - 电子部件的制造方法 - Google Patents
电子部件的制造方法 Download PDFInfo
- Publication number
- CN107068403B CN107068403B CN201710055494.7A CN201710055494A CN107068403B CN 107068403 B CN107068403 B CN 107068403B CN 201710055494 A CN201710055494 A CN 201710055494A CN 107068403 B CN107068403 B CN 107068403B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- laminated ceramic
- ceramic capacitor
- roughening treatment
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000007788 roughening Methods 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000007664 blowing Methods 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 34
- 239000003990 capacitor Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 10
- 239000003985 ceramic capacitor Substances 0.000 description 63
- 239000000919 ceramic Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 7
- 230000005611 electricity Effects 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910002971 CaTiO3 Inorganic materials 0.000 description 1
- 229910002976 CaZrO3 Inorganic materials 0.000 description 1
- 229910002370 SrTiO3 Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- -1 rare-earth compounds Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-020097 | 2016-02-04 | ||
| JP2016020097A JP6877880B2 (ja) | 2016-02-04 | 2016-02-04 | 電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107068403A CN107068403A (zh) | 2017-08-18 |
| CN107068403B true CN107068403B (zh) | 2019-11-26 |
Family
ID=59566922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710055494.7A Active CN107068403B (zh) | 2016-02-04 | 2017-01-24 | 电子部件的制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6877880B2 (ko) |
| KR (1) | KR102028387B1 (ko) |
| CN (1) | CN107068403B (ko) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87101108A (zh) * | 1987-09-29 | 1988-03-30 | 中国科学院上海冶金研究所 | 热喷涂法制备陶瓷固体器件的电极 |
| JPH0732890B2 (ja) * | 1987-10-31 | 1995-04-12 | 松下電器産業株式会社 | 液体物質連続塗布装置 |
| JP2002271034A (ja) * | 2001-03-13 | 2002-09-20 | Ibiden Co Ltd | プリント配線板及びプリント配線板の製造方法 |
| CN101232779A (zh) * | 1999-09-02 | 2008-07-30 | 伊比登株式会社 | 印刷布线板及其制造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5913075A (ja) * | 1982-07-12 | 1984-01-23 | Nippon Light Metal Co Ltd | 均一皮膜を形成する方法 |
| JPH06251334A (ja) * | 1993-03-01 | 1994-09-09 | Matsushita Electric Ind Co Ltd | 浮動型薄膜磁気ヘッドの製造方法 |
| JP3654785B2 (ja) * | 1999-02-04 | 2005-06-02 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
| JP4000733B2 (ja) * | 1999-06-30 | 2007-10-31 | セイコーエプソン株式会社 | 水晶振動片のエッチング方法とエッチング装置及びエッチング用の水晶片の収容器 |
| JP2001291725A (ja) * | 2000-04-05 | 2001-10-19 | Ibiden Co Ltd | 電子部品搭載用基板及びその製造方法 |
| JP4721085B2 (ja) * | 2001-04-05 | 2011-07-13 | 新東工業株式会社 | 補助タンブラー及び補助タンブラーによるセラミックス部品のバリ取り方法 |
| JP2003204235A (ja) * | 2002-01-08 | 2003-07-18 | Seiko Epson Corp | 圧電振動片の収容器、圧電振動片のエッチング装置及び圧電振動片のエッチング方法 |
| US20080057195A1 (en) * | 2006-08-31 | 2008-03-06 | United Technologies Corporation | Non-line of sight coating technique |
| KR101104016B1 (ko) * | 2008-11-04 | 2012-01-06 | 주식회사 엘지실트론 | 웨이퍼 처리 장치 및 이에 사용되는 배럴과, 웨이퍼 처리 방법 |
| KR101422938B1 (ko) * | 2012-12-04 | 2014-07-23 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 이의 제조방법, 기판 내장용 적층 세라믹 전자부품을 구비하는 인쇄회로기판 |
| JP6244621B2 (ja) | 2012-12-11 | 2017-12-13 | Tdk株式会社 | 積層コンデンサ |
| KR101452079B1 (ko) * | 2012-12-28 | 2014-10-16 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
| JP2014239139A (ja) * | 2013-06-07 | 2014-12-18 | 株式会社村田製作所 | コンデンサおよびその製造方法 |
| KR101556847B1 (ko) * | 2014-05-12 | 2015-10-01 | (주)범용테크놀러지 | 진공세정기반의 외부전극 형성시스템 |
| JP7032890B2 (ja) * | 2017-09-08 | 2022-03-09 | Ｎｔｔエレクトロニクス株式会社 | ネットワーク品質推定方法及びネットワーク品質推定装置 |
-
2016
- 2016-02-04 JP JP2016020097A patent/JP6877880B2/ja active Active
-
2017
- 2017-01-17 KR KR1020170008014A patent/KR102028387B1/ko active IP Right Grant
- 2017-01-24 CN CN201710055494.7A patent/CN107068403B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87101108A (zh) * | 1987-09-29 | 1988-03-30 | 中国科学院上海冶金研究所 | 热喷涂法制备陶瓷固体器件的电极 |
| JPH0732890B2 (ja) * | 1987-10-31 | 1995-04-12 | 松下電器産業株式会社 | 液体物質連続塗布装置 |
| CN101232779A (zh) * | 1999-09-02 | 2008-07-30 | 伊比登株式会社 | 印刷布线板及其制造方法 |
| JP2002271034A (ja) * | 2001-03-13 | 2002-09-20 | Ibiden Co Ltd | プリント配線板及びプリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102028387B1 (ko) | 2019-10-04 |
| JP2017139384A (ja) | 2017-08-10 |
| JP6877880B2 (ja) | 2021-05-26 |
| CN107068403A (zh) | 2017-08-18 |
| KR20170093063A (ko) | 2017-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |