JP6877880B2 - 電子部品の製造方法 - Google Patents

電子部品の製造方法 Download PDF

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Publication number
JP6877880B2
JP6877880B2 JP2016020097A JP2016020097A JP6877880B2 JP 6877880 B2 JP6877880 B2 JP 6877880B2 JP 2016020097 A JP2016020097 A JP 2016020097A JP 2016020097 A JP2016020097 A JP 2016020097A JP 6877880 B2 JP6877880 B2 JP 6877880B2
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JP
Japan
Prior art keywords
ceramic capacitor
electronic component
multilayer ceramic
capacitor
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016020097A
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English (en)
Japanese (ja)
Other versions
JP2017139384A (ja
Inventor
信貴 浅井
信貴 浅井
雅樹 廣田
雅樹 廣田
安雄 松本
安雄 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2016020097A priority Critical patent/JP6877880B2/ja
Priority to KR1020170008014A priority patent/KR102028387B1/ko
Priority to CN201710055494.7A priority patent/CN107068403B/zh
Publication of JP2017139384A publication Critical patent/JP2017139384A/ja
Application granted granted Critical
Publication of JP6877880B2 publication Critical patent/JP6877880B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2016020097A 2016-02-04 2016-02-04 電子部品の製造方法 Active JP6877880B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016020097A JP6877880B2 (ja) 2016-02-04 2016-02-04 電子部品の製造方法
KR1020170008014A KR102028387B1 (ko) 2016-02-04 2017-01-17 전자부품의 제조 방법
CN201710055494.7A CN107068403B (zh) 2016-02-04 2017-01-24 电子部件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016020097A JP6877880B2 (ja) 2016-02-04 2016-02-04 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JP2017139384A JP2017139384A (ja) 2017-08-10
JP6877880B2 true JP6877880B2 (ja) 2021-05-26

Family

ID=59566922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016020097A Active JP6877880B2 (ja) 2016-02-04 2016-02-04 電子部品の製造方法

Country Status (3)

Country Link
JP (1) JP6877880B2 (ko)
KR (1) KR102028387B1 (ko)
CN (1) CN107068403B (ko)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5913075A (ja) * 1982-07-12 1984-01-23 Nippon Light Metal Co Ltd 均一皮膜を形成する方法
CN1007297B (zh) * 1987-09-29 1990-03-21 中国科学院上海冶金研究所 陶瓷阻客元件电极的制造方法
JPH0732890B2 (ja) * 1987-10-31 1995-04-12 松下電器産業株式会社 液体物質連続塗布装置
JPH06251334A (ja) * 1993-03-01 1994-09-09 Matsushita Electric Ind Co Ltd 浮動型薄膜磁気ヘッドの製造方法
JP3654785B2 (ja) * 1999-02-04 2005-06-02 株式会社村田製作所 積層セラミックコンデンサの製造方法
JP4000733B2 (ja) * 1999-06-30 2007-10-31 セイコーエプソン株式会社 水晶振動片のエッチング方法とエッチング装置及びエッチング用の水晶片の収容器
EP1139705B1 (en) * 1999-09-02 2006-11-22 Ibiden Co., Ltd. Printed wiring board and method of producing the same
JP2001291725A (ja) * 2000-04-05 2001-10-19 Ibiden Co Ltd 電子部品搭載用基板及びその製造方法
JP4863564B2 (ja) * 2001-03-13 2012-01-25 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP4721085B2 (ja) * 2001-04-05 2011-07-13 新東工業株式会社 補助タンブラー及び補助タンブラーによるセラミックス部品のバリ取り方法
JP2003204235A (ja) * 2002-01-08 2003-07-18 Seiko Epson Corp 圧電振動片の収容器、圧電振動片のエッチング装置及び圧電振動片のエッチング方法
US20080057195A1 (en) * 2006-08-31 2008-03-06 United Technologies Corporation Non-line of sight coating technique
KR101104016B1 (ko) * 2008-11-04 2012-01-06 주식회사 엘지실트론 웨이퍼 처리 장치 및 이에 사용되는 배럴과, 웨이퍼 처리 방법
KR101422938B1 (ko) * 2012-12-04 2014-07-23 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 이의 제조방법, 기판 내장용 적층 세라믹 전자부품을 구비하는 인쇄회로기판
JP6244621B2 (ja) 2012-12-11 2017-12-13 Tdk株式会社 積層コンデンサ
KR101452079B1 (ko) * 2012-12-28 2014-10-16 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
JP2014239139A (ja) * 2013-06-07 2014-12-18 株式会社村田製作所 コンデンサおよびその製造方法
KR101556847B1 (ko) * 2014-05-12 2015-10-01 (주)범용테크놀러지 진공세정기반의 외부전극 형성시스템
JP7032890B2 (ja) * 2017-09-08 2022-03-09 Ｎｔｔエレクトロニクス株式会社 ネットワーク品質推定方法及びネットワーク品質推定装置

Also Published As

Publication number Publication date
KR102028387B1 (ko) 2019-10-04
JP2017139384A (ja) 2017-08-10
CN107068403A (zh) 2017-08-18
KR20170093063A (ko) 2017-08-14
CN107068403B (zh) 2019-11-26

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