CN106973490B - 硅氧烷化合物用于印刷布线板的用途 - Google Patents
硅氧烷化合物用于印刷布线板的用途 Download PDFInfo
- Publication number
- CN106973490B CN106973490B CN201611030566.4A CN201611030566A CN106973490B CN 106973490 B CN106973490 B CN 106973490B CN 201611030566 A CN201611030566 A CN 201611030566A CN 106973490 B CN106973490 B CN 106973490B
- Authority
- CN
- China
- Prior art keywords
- group
- compound
- mass
- reaction
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
- B32B2307/736—Shrinkable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
- C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
- C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Fluid Mechanics (AREA)
- Reinforced Plastic Materials (AREA)
- Silicon Polymers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-259686 | 2012-11-28 | ||
JP2012259686 | 2012-11-28 | ||
CN201380061809.9A CN104812805B (zh) | 2012-11-28 | 2013-11-28 | 硅氧烷化合物、改性酰亚胺树脂、热固性树脂组合物、预浸渍坯、带有树脂的膜、层叠板、多层印刷布线板及半导体封装件 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380061809.9A Division CN104812805B (zh) | 2012-11-28 | 2013-11-28 | 硅氧烷化合物、改性酰亚胺树脂、热固性树脂组合物、预浸渍坯、带有树脂的膜、层叠板、多层印刷布线板及半导体封装件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106973490A CN106973490A (zh) | 2017-07-21 |
CN106973490B true CN106973490B (zh) | 2020-07-07 |
Family
ID=50827941
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710407622.XA Pending CN107254049A (zh) | 2012-11-28 | 2013-11-28 | 硅氧烷化合物、改性酰亚胺树脂、热固性树脂组合物、预浸渍坯、带有树脂的膜及层叠板 |
CN201611030566.4A Active CN106973490B (zh) | 2012-11-28 | 2013-11-28 | 硅氧烷化合物用于印刷布线板的用途 |
CN201380061809.9A Active CN104812805B (zh) | 2012-11-28 | 2013-11-28 | 硅氧烷化合物、改性酰亚胺树脂、热固性树脂组合物、预浸渍坯、带有树脂的膜、层叠板、多层印刷布线板及半导体封装件 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710407622.XA Pending CN107254049A (zh) | 2012-11-28 | 2013-11-28 | 硅氧烷化合物、改性酰亚胺树脂、热固性树脂组合物、预浸渍坯、带有树脂的膜及层叠板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380061809.9A Active CN104812805B (zh) | 2012-11-28 | 2013-11-28 | 硅氧烷化合物、改性酰亚胺树脂、热固性树脂组合物、预浸渍坯、带有树脂的膜、层叠板、多层印刷布线板及半导体封装件 |
Country Status (5)
Country | Link |
---|---|
JP (3) | JP6375951B2 (fr) |
KR (1) | KR102166235B1 (fr) |
CN (3) | CN107254049A (fr) |
TW (2) | TWI614286B (fr) |
WO (2) | WO2014084318A1 (fr) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6357762B2 (ja) * | 2012-11-28 | 2018-07-18 | 日立化成株式会社 | 変性シロキサン化合物、熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板、多層プリント配線板及び半導体パッケージ |
US10323126B2 (en) | 2012-11-28 | 2019-06-18 | Hitachi Chemical Company, Ltd. | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package |
JP6375951B2 (ja) * | 2012-11-28 | 2018-08-22 | 日立化成株式会社 | アミノ変性シロキサン化合物、変性イミド樹脂、熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板、及び半導体パッケージ |
JP6299434B2 (ja) * | 2014-05-28 | 2018-03-28 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ |
JP6379675B2 (ja) * | 2014-05-28 | 2018-08-29 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ |
JP6299433B2 (ja) * | 2014-05-28 | 2018-03-28 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ |
JP6596811B2 (ja) * | 2014-07-25 | 2019-10-30 | 日立化成株式会社 | 熱硬化性樹脂組成物、これを用いるプリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ |
JP6503754B2 (ja) * | 2015-01-20 | 2019-04-24 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ |
JP6493745B2 (ja) * | 2015-03-31 | 2019-04-03 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及びプリント配線板及び半導体パッケージ |
JP6696113B2 (ja) * | 2015-04-03 | 2020-05-20 | 住友ベークライト株式会社 | プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置 |
JP6606882B2 (ja) * | 2015-06-19 | 2019-11-20 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板 |
JP6785422B2 (ja) * | 2015-12-22 | 2020-11-18 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板、多層プリント配線板及び半導体パッケージ |
JP6828242B2 (ja) * | 2016-01-26 | 2021-02-10 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板及び多層プリント配線板 |
KR20180111809A (ko) * | 2016-01-26 | 2018-10-11 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | 수지 피복 금속박, 플렉서블 프린트 배선판 |
FR3050207B1 (fr) * | 2016-04-15 | 2018-04-06 | Ecole Superieure De Physique Et De Chimie Industrielles De La Ville De Paris | Composition de polymeres comprenant des silicones reticules a points de reticulation echangeables, procede de preparation et utilisations |
KR102327243B1 (ko) * | 2016-06-02 | 2021-11-16 | 쇼와덴코머티리얼즈가부시끼가이샤 | 열경화성 수지 조성물, 프리프레그, 적층판, 프린트 배선판 및 고속 통신 대응 모듈 |
KR102332305B1 (ko) * | 2016-07-19 | 2021-11-26 | 쇼와덴코머티리얼즈가부시끼가이샤 | 수지 조성물, 적층판 및 다층 프린트 배선판 |
JP6922167B2 (ja) * | 2016-07-20 | 2021-08-18 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
TWI582136B (zh) * | 2016-07-25 | 2017-05-11 | Chin Yee Chemical Industres Co Ltd | Thermosetting resin and its composition, use |
KR102321555B1 (ko) * | 2016-08-10 | 2021-11-03 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | 봉지용 아크릴 조성물, 시트재, 적층 시트, 경화물, 반도체 장치 및 반도체 장치의 제조 방법 |
TWI723211B (zh) * | 2016-09-23 | 2021-04-01 | 日商住友電木股份有限公司 | 熱硬化性樹脂組成物、樹脂密封基板及電子裝置 |
KR102217489B1 (ko) * | 2016-09-26 | 2021-02-19 | 쇼와덴코머티리얼즈가부시끼가이샤 | 수지 조성물, 반도체용 배선층 적층체 및 반도체 장치 |
JP6955329B2 (ja) * | 2016-10-28 | 2021-10-27 | 株式会社日本触媒 | 硬化性樹脂組成物、それを用いた封止材及び半導体装置 |
JP6969574B2 (ja) * | 2016-11-09 | 2021-11-24 | 昭和電工マテリアルズ株式会社 | Frp前駆体の製造方法、積層体の製造方法、プリント配線板の製造方法及び半導体パッケージの製造方法 |
WO2018151287A1 (fr) * | 2017-02-17 | 2018-08-23 | 日立化成株式会社 | Préimprégné, stratifié, carte de circuit imprimé, substrat sans noyau, boîtier de semi-conducteurs et procédé de production de substrat sans noyau |
JP6844298B2 (ja) * | 2017-02-17 | 2021-03-17 | 昭和電工マテリアルズ株式会社 | プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法 |
TWI745574B (zh) * | 2017-03-29 | 2021-11-11 | 日商昭和電工材料股份有限公司 | 無芯基板用預浸體、無芯基板、無芯基板的製造方法及半導體封裝體 |
JP7130922B2 (ja) * | 2017-06-21 | 2022-09-06 | 昭和電工マテリアルズ株式会社 | プリント配線板、プリプレグ、積層体及び半導体パッケージ |
JP7124410B2 (ja) * | 2018-04-18 | 2022-08-24 | 昭和電工マテリアルズ株式会社 | 層間絶縁層用樹脂フィルム、積層体、プリント配線板、半導体装置及び積層体の製造方法 |
JP2020138996A (ja) * | 2019-02-26 | 2020-09-03 | 味の素株式会社 | 樹脂組成物 |
KR102669010B1 (ko) * | 2019-04-26 | 2024-05-27 | 디아이씨 가부시끼가이샤 | 말레이미드, 경화성 수지 조성물, 및, 경화물 |
CN110277559B (zh) * | 2019-06-17 | 2022-02-01 | 南开大学 | 用于锂离子电池硅基负极的聚亚胺导电粘结剂 |
CN110218330A (zh) * | 2019-06-18 | 2019-09-10 | 刘涛 | 一种自修复改性硅橡胶及其制备方法 |
JP7552602B2 (ja) * | 2019-08-27 | 2024-09-18 | 三菱瓦斯化学株式会社 | ウレタン樹脂 |
CN111499866B (zh) * | 2020-06-04 | 2022-02-18 | 哈尔滨工业大学 | 一种高效催化固化苯乙炔封端聚酰亚胺树脂体系的制备方法 |
CN114507176B (zh) * | 2020-11-16 | 2024-05-24 | 广东生益科技股份有限公司 | 一种改性马来酰亚胺化合物及其制备方法和应用 |
JP7124898B2 (ja) * | 2021-01-13 | 2022-08-24 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ |
CN117795016A (zh) * | 2021-08-05 | 2024-03-29 | 三菱瓦斯化学株式会社 | 树脂组合物、树脂片、预浸料、覆金属箔层叠板、和印刷电路板 |
DE102022202324A1 (de) | 2022-03-08 | 2023-09-14 | Siemens Aktiengesellschaft | Prepreg, Teilleiterisolation und elektrische rotierende Maschine mit Teilleiterisolation |
KR20240052716A (ko) * | 2022-10-11 | 2024-04-23 | 셍기 테크놀로지 (쑤저우) 컴퍼니 리미티드 | 개질된 비스말레이미드 프리폴리머, 수지 조성물 및 수지 조성물의 용도 |
CN116120560B (zh) * | 2022-10-11 | 2024-04-12 | 苏州生益科技有限公司 | 改性双马来酰亚胺预聚物的制备方法、树脂组合物及树脂组合物的应用 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1444270A (zh) * | 2002-03-13 | 2003-09-24 | 三井金属矿业株式会社 | Cof柔性印刷线路板及制造该线路板的方法 |
CN101070387A (zh) * | 2007-06-06 | 2007-11-14 | 北京化工大学 | 含低聚倍半硅氧烷的低介电树脂及其制备方法 |
CN101223181A (zh) * | 2006-03-02 | 2008-07-16 | 设计分子有限公司 | 含有环硅氧烷的粘合剂组合物 |
CN101965387A (zh) * | 2008-02-19 | 2011-02-02 | 琳得科株式会社 | 主要由聚有机硅氧烷化合物组成的粘合剂 |
TW201245284A (en) * | 2011-01-18 | 2012-11-16 | Hitachi Chemical Co Ltd | Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4048148A (en) | 1975-05-09 | 1977-09-13 | E. I. Du Pont De Nemours And Company | Polyazomethine fibers and films |
JPS60101123A (ja) | 1983-11-07 | 1985-06-05 | Agency Of Ind Science & Technol | 含芳香族複素環ポリアゾメチン |
JPS60181127A (ja) | 1984-02-28 | 1985-09-14 | Tokyo Inst Of Technol | ポリアゾメチン樹脂およびその製造方法 |
JPS63193925A (ja) | 1987-02-09 | 1988-08-11 | Teijin Ltd | 芳香族ポリアゾメチン |
JPS63264635A (ja) * | 1987-04-21 | 1988-11-01 | Teijin Ltd | アゾメチン含有ポリオルガノシロキサン |
JPS6469631A (en) | 1987-09-10 | 1989-03-15 | Kuraray Co | Production of polyazomethine |
JPH01158037A (ja) * | 1987-09-11 | 1989-06-21 | Kuraray Co Ltd | ボリアゾメチンの製造法 |
JPS6479233A (en) | 1987-09-21 | 1989-03-24 | Teijin Ltd | Preparation of wholly aromatic polyazomethine |
FR2647456B1 (fr) * | 1989-05-26 | 1991-08-23 | Rhone Poulenc Chimie | Procede de preparation de copolymeres thermotropes lineaires constitues d'unites mesogenes de type azomethine aromatique et d'espaceurs polysiloxane |
FR2647455A1 (en) * | 1989-05-26 | 1990-11-30 | Rhone Poulenc Chimie | Linear thermotropic copolymers consisting of mesogenic units of the aromatic azomethine type and polysiloxane spacers and process for their manufacture |
JPH05140067A (ja) | 1991-11-20 | 1993-06-08 | Showa Highpolymer Co Ltd | 不飽和基含有芳香族ポリアゾメチンオリゴマー及びその製造方法 |
JP2001207055A (ja) * | 2000-01-25 | 2001-07-31 | Nitto Denko Corp | カルボジイミド樹脂組成物 |
JP2003073470A (ja) | 2001-08-31 | 2003-03-12 | Keio Gijuku | 酸分解性ポリアゾメチン |
CN1930219B (zh) * | 2004-03-04 | 2010-06-02 | 日立化成工业株式会社 | 预浸体、贴金属箔层叠板及使用它们的印刷电路板 |
JP4858678B2 (ja) * | 2005-05-24 | 2012-01-18 | ソニーケミカル&インフォメーションデバイス株式会社 | エステル基含有ポリ(イミド−アゾメチン)共重合体、エステル基含有ポリ(アミド酸−アゾメチン)共重合体及びポジ型感光性樹脂組成物 |
JP2007246628A (ja) * | 2006-03-14 | 2007-09-27 | Jsr Corp | 被膜形成用樹脂組成物 |
JP2010280857A (ja) * | 2009-06-05 | 2010-12-16 | Sekisui Chem Co Ltd | 芳香族アゾメチン樹脂の製造方法 |
JP5589470B2 (ja) * | 2010-03-18 | 2014-09-17 | 日立化成株式会社 | ビスマレイミド誘導体とその製造方法、並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
JP5866999B2 (ja) * | 2011-01-11 | 2016-02-24 | Jsr株式会社 | 液晶配向剤、液晶表示素子、液晶配向膜及びポリオルガノシロキサン化合物 |
JP5668517B2 (ja) * | 2011-02-16 | 2015-02-12 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ及び積層板 |
JP5810645B2 (ja) * | 2011-06-07 | 2015-11-11 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板および半導体装置 |
JP6043494B2 (ja) * | 2012-03-26 | 2016-12-14 | 株式会社タダノ | 作業車外装体の組付構造 |
JP5949249B2 (ja) * | 2012-07-13 | 2016-07-06 | 日立化成株式会社 | 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板 |
JP6375951B2 (ja) * | 2012-11-28 | 2018-08-22 | 日立化成株式会社 | アミノ変性シロキサン化合物、変性イミド樹脂、熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板、及び半導体パッケージ |
-
2013
- 2013-11-28 JP JP2014549892A patent/JP6375951B2/ja active Active
- 2013-11-28 TW TW102143668A patent/TWI614286B/zh active
- 2013-11-28 WO PCT/JP2013/082072 patent/WO2014084318A1/fr active Application Filing
- 2013-11-28 JP JP2013246492A patent/JP6372071B2/ja active Active
- 2013-11-28 CN CN201710407622.XA patent/CN107254049A/zh active Pending
- 2013-11-28 CN CN201611030566.4A patent/CN106973490B/zh active Active
- 2013-11-28 WO PCT/JP2013/082054 patent/WO2014084310A1/fr active Application Filing
- 2013-11-28 KR KR1020157013901A patent/KR102166235B1/ko active IP Right Grant
- 2013-11-28 CN CN201380061809.9A patent/CN104812805B/zh active Active
- 2013-11-28 JP JP2014549897A patent/JP6747655B2/ja active Active
- 2013-11-28 TW TW102143669A patent/TWI614262B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1444270A (zh) * | 2002-03-13 | 2003-09-24 | 三井金属矿业株式会社 | Cof柔性印刷线路板及制造该线路板的方法 |
CN101223181A (zh) * | 2006-03-02 | 2008-07-16 | 设计分子有限公司 | 含有环硅氧烷的粘合剂组合物 |
CN101070387A (zh) * | 2007-06-06 | 2007-11-14 | 北京化工大学 | 含低聚倍半硅氧烷的低介电树脂及其制备方法 |
CN101965387A (zh) * | 2008-02-19 | 2011-02-02 | 琳得科株式会社 | 主要由聚有机硅氧烷化合物组成的粘合剂 |
TW201245284A (en) * | 2011-01-18 | 2012-11-16 | Hitachi Chemical Co Ltd | Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same |
Non-Patent Citations (1)
Title |
---|
SYNTHESE DE BISMALEIMIDES ET POLYBISMALEIMIDES A PONT SILOXANIQUE-REACTIVITE ET THNUE THERMIQUE;MILANO J. C. 等;《Eur. polym. J.》;19970831;第33卷(第8期);第1333-1340页 * |
Also Published As
Publication number | Publication date |
---|---|
WO2014084310A1 (fr) | 2014-06-05 |
JP6372071B2 (ja) | 2018-08-15 |
JP2014129520A (ja) | 2014-07-10 |
CN104812805A (zh) | 2015-07-29 |
KR20150089017A (ko) | 2015-08-04 |
TWI614262B (zh) | 2018-02-11 |
KR102166235B1 (ko) | 2020-10-15 |
CN106973490A (zh) | 2017-07-21 |
CN107254049A (zh) | 2017-10-17 |
TW201428030A (zh) | 2014-07-16 |
JP6375951B2 (ja) | 2018-08-22 |
JPWO2014084318A1 (ja) | 2017-01-05 |
JPWO2014084310A1 (ja) | 2017-01-05 |
WO2014084318A1 (fr) | 2014-06-05 |
TW201434850A (zh) | 2014-09-16 |
TWI614286B (zh) | 2018-02-11 |
JP6747655B2 (ja) | 2020-08-26 |
CN104812805B (zh) | 2017-06-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106973490B (zh) | 硅氧烷化合物用于印刷布线板的用途 | |
JP6241536B2 (ja) | 樹脂組成物、及びこれを用いたプリプレグ、積層板、プリント配線板 | |
JP6160675B2 (ja) | 樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板 | |
US10323126B2 (en) | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package | |
JP6167850B2 (ja) | 熱硬化性樹脂組成物、これを用いたプリプレグ、樹脂付フィルム、積層板、プリント配線板及び半導体パッケージ | |
JP6357762B2 (ja) | 変性シロキサン化合物、熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板、多層プリント配線板及び半導体パッケージ | |
JP6503754B2 (ja) | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ | |
JP6596811B2 (ja) | 熱硬化性樹脂組成物、これを用いるプリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ | |
JP6427959B2 (ja) | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ | |
JP6299433B2 (ja) | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ | |
JP6299434B2 (ja) | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ | |
JP6819062B2 (ja) | 熱硬化性樹脂組成物、これを用いたプリプレグ、樹脂付フィルム、積層板、プリント配線板及び半導体パッケージ、並びにイミド樹脂及びその製造方法 | |
JP6597721B2 (ja) | 熱硬化性樹脂組成物、これを用いたプリプレグ、樹脂付フィルム、積層板、プリント配線板及び半導体パッケージ | |
JP2015224307A (ja) | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Showa electrical materials Co.,Ltd. Address before: Tokyo, Japan Patentee before: HITACHI CHEMICAL Co.,Ltd. Address after: Tokyo, Japan Patentee after: Lishennoco Co.,Ltd. Address before: Tokyo, Japan Patentee before: Showa electrical materials Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |