CN106575545B - 聚二甲基硅氧烷接枝的聚乙烯泡沫 - Google Patents
聚二甲基硅氧烷接枝的聚乙烯泡沫 Download PDFInfo
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Abstract
在一个方面，提供一种泡沫，其包含：包含接枝到聚乙烯的聚合硅氧烷的聚合物基质，和在聚合物基质中形成并且含有包含二氧化碳的发泡剂的多个泡孔。在另一个方面，提供一种制备泡沫的方法，其包含：将聚合硅氧烷接枝到聚乙烯以形成接枝中间体；使接枝中间体成型以形成成型中间体；以及使用高压CO2使成型中间体起泡以形成泡沫，其中泡沫具有大于75％的孔隙度。
Description
背景技术
泡沫具有多种应用。在一种情况下，射频电缆(在本文中被称作RF电缆)包括绝缘材料以改进电缆性能。一种类型的RF电缆是包括位于内导体和外导体之间的绝缘材料的同轴电缆。在一种情况下，此绝缘材料是泡沫。
在电信工业中，最近的趋势是在RF电缆上传输的数据频率已随时间推移而增加。当前，使用2.5GHz和2.6GHz之间的频率传输数据是常见的，该频率对应于4G频谱。预期频率将随时间推移而继续增大。
当在RF电缆上传输数据时，能量的损失率被称作损耗因子(DF)。增大RF电缆绝缘材料的孔隙度是降低DF的一种方式。孔隙度是在绝缘材料中空隙或空白空间的量度，并且通常作为空隙体积与泡沫的总体积的比率来测量。
降低DF的一种方式是提供具有高孔隙度的绝缘体，如由用尽可能纯的聚合物树脂制备的高度起泡的电介质形成的绝缘体，其中泡沫包括附接至聚合物的最小极性基团和最小极性添加剂。
泡沫通常使用发泡剂形成。发泡剂用以在聚合物材料中形成气泡。一些发泡剂将浸出到聚合物材料中并且将变成在泡沫中的杂质。一些发泡剂具有不利的环境影响，如卤代烃。一些发泡剂需要使用成核剂以加快气泡形成，并且这些成核剂可变成在泡沫中的杂质且可增加生产泡沫的成本。
期望具有低DF的泡沫。此类泡沫将优选地具有最少杂质。此类泡沫将优选地与不将杂质增加到泡沫并且极少需要或不需要成核剂的发泡剂相容。
发明内容
在一个方面提供泡沫，其包含：包含接枝聚合硅氧烷的聚乙烯的聚合物基质，和在聚合基质中形成并且含有包含二氧化碳的发泡剂的多个泡孔。
在另一个方面，提供制备泡沫的方法，其包含：使用Haake或挤出将聚合硅氧烷接枝到聚乙烯以形成接枝中间体；将接枝中间体与PE树脂共混以形成共混中间体；使共混中间体成型以形成成型中间体；以及使用高压CO2发泡使成型中间体起泡以形成泡沫，其中泡沫具有大于75％的孔隙度。
具体实施方式
如本文所用，除非另外指示，否则聚合物的分子量是指重均分子量。
本公开描述了一种改进的泡沫和用于制备该泡沫的方法。泡沫是通过在介质中捕获气体袋形成的物质，气体袋通过发泡剂提供，如本文更详细描述。如本文所用，介质优选地由聚合物基质形成，如本文更详细描述。优选地，泡沫是闭孔泡沫。闭孔泡沫是其中气体袋被包围在由聚合物基质形成的单独的泡孔中的泡沫。泡孔通过由聚合物基质形成的壁限定，其中气体捕获在泡孔中。
聚合物基质优选地由接枝聚合硅氧烷的聚乙烯形成。如本文所用，聚合硅氧烷是指具有基于式(I)的重复单元的多种硅氧烷类聚合物：
其中：
R1＝CH3；或C2H5；
R2＝CH3；或C2H5；
m＝0至500；以及
n＝0至500。
在一种情况下，式(I)的聚合硅氧烷包括如由式(II)详述的末端单元
其中：
R3＝CH＝CH2、C4H9、C2H5或
在一种情况下，合适的聚合硅氧烷是乙烯基封端的二乙基硅氧烷-二甲基硅氧烷共聚物，其具有式(III)
其中：
m＝77至185；以及
n＝17至52。
式(III)的二乙基硅氧烷的摩尔％是18％到22％，并且比重是0.953，并且以名称EDV-2022购自Gelest公司。在一种情况下，二乙基硅氧烷的分子量是8000到20000。
在另一情况下，合适的聚合硅氧烷是单甲基丙烯酰氧基丙基封端的聚二甲基硅氧烷，其具有式(IV)
其中：
n＝9至124。
式(IV)的聚合硅氧烷的分子量是1000至10000，且比重是0.96至0.97，并且以名称MCR-M07-M22购自Gelest公司。
在另一情况下，合适的聚合硅氧烷是单乙烯基封端的聚二甲基硅氧烷，其具有式(V)
其中：
n＝67至445。
式(V)的聚合硅氧烷的分子量是5500至35000，且比重是0.97至0.98，并且以名称MCR-V21-V41购自Gelest公司。
在另一情况下，合适的聚合硅氧烷是不对称单甲基丙烯酰氧基丙基封端的聚二甲基硅氧烷，其具有式(VI)
其中：
n＝60。
式(VI)的聚合硅氧烷的分子量是5000，且比重是0.97，并且以名称MCR-M17购自Gelest公司。
在另一情况下，合适的聚合硅氧烷是对称甲基丙烯酰氧基丙基封端的聚二甲基硅氧烷，其具有式(VII)
其中：
n＝8至130；
式(VII)的聚合硅氧烷的分子量是1000至10000，且比重是0.98，并且以名称DMS-R18购自Gelest公司。
将聚合硅氧烷接枝到聚乙烯以形成接枝聚合硅氧烷的聚乙烯。低密度聚乙烯或高密度聚乙烯任一者适用作聚乙烯。许多市售聚乙烯适合用于本文。在一种情况下，选择高密度聚乙烯，其密度是0.965g/cm3，熔融质量流速是8.0g/10min，并且熔融温度是133℃，并且以商标名DGDA-6944购自陶氏化学公司(The Dow Chemical Company)。在一种情况下，选择低密度聚乙烯，其密度是0.919g/cm3，熔融质量流速是1.8g/10min，并且熔融温度是110℃，并且以商标名DFDA-1253购自陶氏化学公司。接枝聚合物是具有由一种聚合物形成的主链和由另一种聚合物形成的分支的共聚物。在一种情况下，选择聚乙烯作是主链并且选择聚合硅氧烷作为分支。应理解，可选择支链聚乙烯(如高密度聚乙烯)作为分支接枝的主链。在一种情况下，按重量计，聚合物基质是0.5摩尔％到10摩尔％聚合硅氧烷。在一种情况下，按重量计，聚合物基质是1摩尔％到5摩尔％聚合硅氧烷。在一些情况下，与其它组合技术相比，接枝产生所得泡沫的不同特性。
聚合物基质通过使用发泡剂形成为泡沫。优选地，发泡剂是二氧化碳(CO2)。在一种情况下，聚合物基质通过在高于环境的温度和高于环境的压力下将聚合物基质放置在具有CO2的容器中接着快速降低容器的压力来起泡。在一种情况下，发泡剂是超临界CO2。CO2临界压力是7.4MPa。在一种情况下，在容器中的期望压力是25MPa到35MPa。在一种情况下，对于其中低密度聚乙烯形成到主链的聚合物基质，在容器中的期望温度是95℃到105℃。在一种情况下，对于其中高密度聚乙烯形成到主链的聚合物基质，在容器中的期望温度是111℃到130℃。在一种情况下，所得泡沫具有大于70％的孔隙度。在一种情况下，所得泡沫具有大于75％的孔隙度。在一种情况下，所得泡沫具有大于80％的孔隙度。在一种情况下，泡沫的泡孔大小低于15μm。在一种情况下，泡沫的泡孔大小低于10μm。
在另一个方面，提供了制备泡沫的方法，其包含：使用Haake或挤出将聚合硅氧烷接枝到聚乙烯以形成接枝中间体；将接枝中间体与聚乙烯树脂共混以形成共混中间体；使共混中间体成型以形成成型中间体；以及使用高压CO2使成型中间体起泡以形成泡沫。
在另一个方面，提供制备泡沫的方法，其包含：使用Haake或挤出将聚合硅氧烷接枝到聚乙烯以形成接枝中间体；使接枝中间体成型以形成成型中间体；以及使用高压CO2使成型中间体起泡以形成泡沫。
实例
在比较实例A到比较实例D中，泡沫由纯聚乙烯颗粒制备。如本文所用，纯聚乙烯是指高密度聚乙烯或低密度聚乙烯任一者，其尚未与另一种聚合物共混或接枝。如本文所用，纯聚乙烯可包括痕量的其它化合物，但是优选地含有大于99％聚乙烯。颗粒通过将在表I中识别的树脂添加到具有在相反方向上旋转的σ转子的50立方厘米Haake混合器(以HAAKEPolylab OS购自赛默科技(Thermo Scientific))制备。混合器以60rpm将材料在180℃下共混8分钟。从混合器抽出所得材料并且切成颗粒。根据这些实例形成的颗粒随后形成为聚合物板，并且然后为如本文中所述的泡沫。
表I
在比较实例E到比较实例H中，泡沫由高密度聚乙烯和聚合硅氧烷的共混物制备。颗粒通过将在表II中识别的聚合树脂共混物(百分比按重量计)添加到具有在相反方向上旋转的两个σ转子的50立方厘米Haake混合器(以HAAKE Polylab OS购自赛默科技)制备。在这些实例中使用的HDPE与如描述于表I中的在比较实例A到比较实例D中使用的相同。混合器以60rpm在180℃下将材料共混8分钟。从混合器抽出所得材料并且切成颗粒。根据这些实例形成的颗粒随后形成为聚合物板，并且然后为如本文中所述的泡沫。
表II
在比较实例I和比较实例J中，泡沫由高密度聚乙烯和过氧化物L-101的共混物制备。颗粒通过将在表III中识别的材料(百分比按重量计)添加到具有在相反方向上旋转的两个σ转子的50立方厘米Haake混合器(以HAAKE Polylab OS购自赛默科技)制备。在这些实例中使用的HDPE与如描述于表I中的在比较实例A到比较实例D中使用的相同。混合器以60rpm在180℃下将材料共混8分钟。从混合器抽出所得材料并且切成颗粒。根据这些实例形成的颗粒随后形成为聚合物板，并且然后为如本文中所述的泡沫。
表III
在实例A到实例D中，泡沫由聚合硅氧烷接枝的高密度聚乙烯制备。颗粒通过将在表IV中识别的材料(百分比按重量计)添加到具有在相反方向上旋转的两个σ转子的50立方厘米Haake混合器(以HAAKE Polylab OS购自赛默科技)制备。在这些实例中使用的HDPE与如描述于表I中的在比较实例A到比较实例D中使用的相同。在这些实例中使用的L-101与如描述于表III中的在比较实例I和比较实例J中使用的相同。混合器以60rpm在180℃下将材料共混8分钟，由此产生接枝有聚合硅氧烷的高密度聚乙烯。从混合器抽出所得材料并且切成颗粒。根据这些实例形成的颗粒随后形成为聚合物板，并且然后为如本文中所述的泡沫。
表IV
在实例E和实例F中，泡沫由聚合硅氧烷接枝的高密度聚乙烯和高密度聚乙烯的共混物制备。颗粒通过将在表V中识别的材料(百分比按重量计)添加到具有在相反方向上旋转的两个σ转子的50立方厘米Haake混合器(以HAAKE Polylab OS购自赛默科技)制备。在这些实例中使用的HDPE与如描述于表I中的在比较实例A到比较实例D中使用的相同。在这些实例中使用的HDPE-g-MCR-M17与如描述于表IV中的在比较实例A中使用的相同。混合器以60rpm在180℃下共混所述材料8分钟，由此产生聚合硅氧烷接枝的高密度聚乙烯和高密度聚乙烯的共混物。从混合器抽出所得材料并且切成颗粒。根据这些实例形成的颗粒随后形成为聚合物板，并且然后为如本文中所述的泡沫。
表V
根据以下程序将给定的聚合物颗粒样品制备成聚合物板。将根据若干实例中的一个形成的50g的颗粒放入热板压缩成型机(平板硫化机，由广州第一橡胶塑料设备有限公司(Guangzhou NO.1Rubber&Plastic Equipment Co.Ltd.)制造)中的模具中并且在150℃下保持5分钟。然后将颗粒在15MPa的压力下放置10分钟以产生具有15mm×10mm×1mm尺寸的聚合物板。聚合物板是成型中间体的实例。
根据以下程序将聚合物板制备成泡沫。将根据若干实例中的一个形成的聚合物板竖起来立于压力容器中，该压力容器位于搁置在铝柱塞顶上的玻璃棉薄层上。将压力容器加热到145℃维持30分钟。接下来将压力容器加热到起泡温度维持1小时(相应聚合物板的起泡温度在表VI中列出)。然后通过向容器中馈入包含起泡剂(相应聚合物板的起泡剂在表VI中列出)的加压气氛将压力容器中的压力增大到33.1MPa，并且在此压力下和在所述起泡温度下保持2小时。压力容器快速排气，由此使压力容器减压，并且从压力容器收集起泡样品。
根据以下程序将根据前述实例制备的聚合物板制备成泡沫。在压力容器中将聚合物板静置在端部上，该压力容器在搁置在铝填塞的顶部上的玻璃棉的薄层上。接下来将压力容器加热到145℃维持30分钟。接下来将压力容器加热到起泡温度维持1小时(对于相应的聚合物板的起泡温度在表VI中列出)。然后通过将容器装入包含起泡剂(对于相应的聚合物板的起泡剂在表VI中列出)的加压气氛将压力容器中的压力增大到饱和压力，并且在此饱和压力下和在该起泡温度下保持2小时。压力容器快速排气，由此使压力容器减压，由此制备从压力容器收集的起泡样品。
泡沫样品的泡孔大小通过在用液氮冷却后使泡沫断裂计算。断裂的泡沫用铱涂覆并且使用扫描电子显微法(SEM)获得图像。平均泡孔大小通过使用购自MediaCybernetics公司的Image-Pro Plus软件分析来计算。平均泡孔大小在表VI中列出。
表VI
在表VI中呈现的数据示出根据实例制备的泡沫与比较实例相比具有改进的孔隙度和泡孔大小的组合。举例来说，比较实例没有一个实现比<15μm好的泡孔大小，而全部实例实现<10μm的泡孔大小。实例示出与由纯聚乙烯或聚合物硅氧烷和聚乙烯的共混物制备的泡沫相比，由接枝聚合物硅氧烷的聚乙烯制备的泡沫提供较高孔隙度和较小泡孔大小。
在表VI中，孔隙度根据方程ф＝1-ρ/ρ0基于起泡树脂的密度和在起泡之前的树脂密度计算，其中ф是孔隙度，ρ是泡沫密度并且ρ0是在起泡之前树脂的密度。密度根据用于测量聚合物泡沫密度的已知操作测量，如ASTM标准D792-00。
Claims (15)
1.一种泡沫，其包含：
包含接枝到聚乙烯的聚合硅氧烷的聚合物基质，以及
在所述聚合物基质中形成并且含有包含二氧化碳的发泡剂的多个泡孔。
2.根据权利要求1所述的泡沫，其中所述聚乙烯是低密度聚乙烯。
3.根据权利要求1所述的泡沫，其中所述聚乙烯是高密度聚乙烯。
4.根据权利要求1至3中任一权利要求所述的泡沫，其中所述聚合硅氧烷具有式(I)
其中：
R1＝CH3；或C2H5；
R2＝CH3；或C2H5；
m＝80至500；以及
n＝80至500。
5.根据权利要求1至3中任一权利要求所述的泡沫，其中所述聚合硅氧烷具有式(II)
其中：
R1＝CH3；或C2H5；
R2＝CH3；或C2H5；
R3＝CH＝CH2、C4H9、C2H5或
m＝80至500；以及
n＝80至500。
6.根据权利要求1至3中任一权利要求所述的泡沫，其中所述聚合硅氧烷是乙烯基封端的二乙基硅氧烷-二甲基硅氧烷共聚物，其具有式(III)
其中：
m＝77至185；
n＝17至52；以及
二乙基硅氧烷的摩尔％是18％到22％。
7.根据权利要求1至3中任一权利要求所述的泡沫，其中所述聚合硅氧烷是单甲基丙烯酰氧基丙基封端的聚二甲基硅氧烷，其具有式(IV)
其中：
n＝9至124。
8.根据权利要求1至3中任一权利要求所述的泡沫，其中所述聚合硅氧烷是单乙烯基封端的聚二甲基硅氧烷，其具有式(V)
其中：
n＝67至445。
9.根据权利要求1至3中任一权利要求所述的泡沫，其中所述聚合硅氧烷是不对称单甲基丙烯酰氧基丙基封端的聚二甲基硅氧烷，其具有式(VI)
其中：
n＝60。
10.根据权利要求1至3中任一权利要求所述的泡沫，其中所述聚合硅氧烷是对称甲基丙烯酰氧基丙基封端的聚二甲基硅氧烷，其具有式(VII)
其中：
n＝8至130；
11.根据权利要求1至3中任一权利要求所述的泡沫，其中所述泡沫具有大于75％的孔隙度。
12.根据权利要求1至3中任一权利要求所述的泡沫，其中聚合硅氧烷的摩尔％是0.5％到10％。
13.根据权利要求1至3中任一权利要求所述的泡沫，其中所述聚合物基质包含聚乙烯和接枝到聚乙烯的聚合硅氧烷的共混物。
14.一种制备泡沫的方法，其包含：
a.将聚合硅氧烷接枝到聚乙烯以形成接枝中间体；
b.使所述接枝中间体成型以形成成型中间体；以及
c.使用高压CO2使所述成型中间体起泡以形成所述泡沫。
15.根据权利要求14所述的方法，其中所述聚合硅氧烷具有式(I)
其中：
R1＝CH3；或C2H5；
R2＝CH3；或C2H5；
m＝80至500；以及
n＝80至500。
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| CN1908053A (zh) * | 2006-08-14 | 2007-02-07 | 华东理工大学 | 超临界二氧化碳技术制备含硅聚丙烯纳米发泡材料的方法 |
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| CA2957605C (en) | 2022-03-01 |
| JP6438568B2 (ja) | 2018-12-12 |
| CN106575545A (zh) | 2017-04-19 |
| WO2016023218A1 (en) | 2016-02-18 |
| EP3180793A1 (en) | 2017-06-21 |
| US20170204239A1 (en) | 2017-07-20 |
| MX2017001439A (es) | 2017-05-25 |
| RU2681185C1 (ru) | 2019-03-04 |
| JP2017530212A (ja) | 2017-10-12 |
| BR112017002210A2 (pt) | 2018-01-16 |
| CA2957605A1 (en) | 2016-02-18 |
| BR112017002210B1 (pt) | 2022-05-03 |
| EP3180793B1 (en) | 2019-10-23 |
| KR102259570B1 (ko) | 2021-06-03 |
| KR20170047250A (ko) | 2017-05-04 |
| US10308782B2 (en) | 2019-06-04 |
| EP3180793A4 (en) | 2018-04-25 |
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