CN106560933A - 具导角反射结构的发光装置及其制造方法 - Google Patents

具导角反射结构的发光装置及其制造方法 Download PDF

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Publication number
CN106560933A
CN106560933A CN201610033451.4A CN201610033451A CN106560933A CN 106560933 A CN106560933 A CN 106560933A CN 201610033451 A CN201610033451 A CN 201610033451A CN 106560933 A CN106560933 A CN 106560933A
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China
Prior art keywords
light
fluorescence
emitting device
led chip
catoptric arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN201610033451.4A
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English (en)
Chinese (zh)
Inventor
陈杰
王琮玺
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Maven Optronics Co Ltd
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Maven Optronics Co Ltd
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Publication date
Application filed by Maven Optronics Co Ltd filed Critical Maven Optronics Co Ltd
Priority to US15/280,927 priority Critical patent/US10763404B2/en
Priority to EP16192043.4A priority patent/EP3154095B1/en
Publication of CN106560933A publication Critical patent/CN106560933A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
CN201610033451.4A 2015-10-05 2016-01-19 具导角反射结构的发光装置及其制造方法 Pending CN106560933A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/280,927 US10763404B2 (en) 2015-10-05 2016-09-29 Light emitting device with beveled reflector and manufacturing method of the same
EP16192043.4A EP3154095B1 (en) 2015-10-05 2016-10-03 Light emitting device with beveled reflector and manufacturing method of the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW104132711A TWI677114B (zh) 2015-10-05 2015-10-05 具導角反射結構的發光裝置
TW104132711 2015-10-05

Publications (1)

Publication Number Publication Date
CN106560933A true CN106560933A (zh) 2017-04-12

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Family Applications (1)

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CN201610033451.4A Pending CN106560933A (zh) 2015-10-05 2016-01-19 具导角反射结构的发光装置及其制造方法

Country Status (4)

Country Link
JP (1) JP6599295B2 (ko)
KR (2) KR20170040761A (ko)
CN (1) CN106560933A (ko)
TW (1) TWI677114B (ko)

Cited By (12)

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CN107039572A (zh) * 2016-02-03 2017-08-11 行家光电股份有限公司 具非对称性光形的发光装置及其制造方法
CN108279528A (zh) * 2018-01-17 2018-07-13 惠州市华星光电技术有限公司 一种背光源
US10230030B2 (en) 2016-01-28 2019-03-12 Maven Optronics Co., Ltd. Light emitting device with asymmetrical radiation pattern and manufacturing method of the same
CN109494289A (zh) * 2017-09-11 2019-03-19 行家光电股份有限公司 应用量子点色彩转换的发光装置及其制造方法
TWI658610B (zh) * 2017-09-08 2019-05-01 Maven Optronics Co., Ltd. 應用量子點色彩轉換之發光裝置及其製造方法
CN109994590A (zh) * 2019-04-11 2019-07-09 中山市立体光电科技有限公司 一种红光led封装器件及其制作方法
CN110176529A (zh) * 2018-02-20 2019-08-27 晶元光电股份有限公司 发光元件及其制作方法
CN111162151A (zh) * 2018-11-07 2020-05-15 深圳市聚飞光电股份有限公司 一种led芯片封装方法及led灯珠
CN111162156A (zh) * 2018-11-07 2020-05-15 深圳市聚飞光电股份有限公司 一种led芯片封装方法及led灯珠
US10879434B2 (en) 2017-09-08 2020-12-29 Maven Optronics Co., Ltd. Quantum dot-based color-converted light emitting device and method for manufacturing the same
CN114335306A (zh) * 2021-12-13 2022-04-12 深圳市穗晶光电股份有限公司 一种新型白光led芯片
CN117153995A (zh) * 2023-10-30 2023-12-01 罗化芯显示科技开发(江苏)有限公司 一种led封装膜层及led封装结构

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US10522728B2 (en) 2017-01-26 2019-12-31 Maven Optronics Co., Ltd. Beveled chip reflector for chip-scale packaging light-emitting device and manufacturing method of the same
JP6729525B2 (ja) * 2017-09-14 2020-07-22 日亜化学工業株式会社 発光装置の製造方法
JP7174215B2 (ja) * 2017-09-29 2022-11-17 日亜化学工業株式会社 発光装置の製造方法及び発光装置
DE102018126783A1 (de) 2017-10-26 2019-05-02 Epistar Corporation Lichtemittierende Vorrichtung
KR20190046392A (ko) * 2017-10-26 2019-05-07 루미마이크로 주식회사 발광 패키지
KR102530755B1 (ko) * 2017-12-07 2023-05-10 삼성전자주식회사 광 반사 패턴 및 파장 변환 층을 갖는 발광 소자
US10461231B2 (en) * 2018-02-27 2019-10-29 Lumens Co., Ltd. Method for fabricating LED package
JP6576581B1 (ja) * 2018-03-29 2019-09-18 ルーメンス カンパニー リミテッド サイドビューｌｅｄパッケージ及びサイドビューｌｅｄモジュール
KR102621850B1 (ko) * 2018-03-29 2024-01-08 주식회사 루멘스 사이드뷰 엘이디 패키지 및 사이드뷰 엘이디 모듈
KR102567568B1 (ko) * 2018-04-06 2023-08-16 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
JP6848997B2 (ja) * 2018-04-11 2021-03-24 日亜化学工業株式会社 発光装置
US10553768B2 (en) 2018-04-11 2020-02-04 Nichia Corporation Light-emitting device
JP7133973B2 (ja) * 2018-05-10 2022-09-09 スタンレー電気株式会社 半導体発光装置
JP2019201089A (ja) * 2018-05-15 2019-11-21 マブン オプトロニックス カンパニー リミテッドＭａｖｅｎ Ｏｐｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． チップスケールパッケージング発光素子の斜角チップ反射器およびその製造方法
JP7054005B2 (ja) * 2018-09-28 2022-04-13 日亜化学工業株式会社 発光装置
KR102101346B1 (ko) * 2018-11-19 2020-05-27 (주)호전에이블 Led 플립칩 어레이 및 그 결합방법
WO2020153191A1 (ja) 2019-01-25 2020-07-30 ソニー株式会社 発光デバイスおよび画像表示装置
KR102131666B1 (ko) 2019-11-08 2020-07-08 주식회사 위드플러스 발포잉크 리플렉터 및 이를 인쇄방식으로 인쇄회로기판에 형성하는 방법
KR102096668B1 (ko) 2019-12-24 2020-04-03 (주)코리아시스템 발광 디바이스
JP7189451B2 (ja) 2020-06-30 2022-12-14 日亜化学工業株式会社 発光モジュール、液晶表示装置
KR102607323B1 (ko) * 2020-08-28 2023-11-29 니치아 카가쿠 고교 가부시키가이샤 발광 장치
JP7328557B2 (ja) 2020-11-30 2023-08-17 日亜化学工業株式会社 光源、光源装置および光源の製造方法

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WO2015025247A1 (en) * 2013-08-20 2015-02-26 Koninklijke Philips N.V. Shaped phosphor to reduce repeated reflections

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10707391B2 (en) 2016-01-28 2020-07-07 Maven Optronics Co., Ltd. Light emitting device with asymmetrical radiation pattern and manufacturing method of the same
US10230030B2 (en) 2016-01-28 2019-03-12 Maven Optronics Co., Ltd. Light emitting device with asymmetrical radiation pattern and manufacturing method of the same
CN107039572B (zh) * 2016-02-03 2019-05-10 行家光电股份有限公司 具非对称性光形的发光装置及其制造方法
CN107039572A (zh) * 2016-02-03 2017-08-11 行家光电股份有限公司 具非对称性光形的发光装置及其制造方法
TWI658610B (zh) * 2017-09-08 2019-05-01 Maven Optronics Co., Ltd. 應用量子點色彩轉換之發光裝置及其製造方法
US10879434B2 (en) 2017-09-08 2020-12-29 Maven Optronics Co., Ltd. Quantum dot-based color-converted light emitting device and method for manufacturing the same
CN109494289A (zh) * 2017-09-11 2019-03-19 行家光电股份有限公司 应用量子点色彩转换的发光装置及其制造方法
CN108279528A (zh) * 2018-01-17 2018-07-13 惠州市华星光电技术有限公司 一种背光源
CN110176529B (zh) * 2018-02-20 2022-03-08 晶元光电股份有限公司 发光元件及其制作方法
CN110176529A (zh) * 2018-02-20 2019-08-27 晶元光电股份有限公司 发光元件及其制作方法
CN111162156A (zh) * 2018-11-07 2020-05-15 深圳市聚飞光电股份有限公司 一种led芯片封装方法及led灯珠
CN111162151A (zh) * 2018-11-07 2020-05-15 深圳市聚飞光电股份有限公司 一种led芯片封装方法及led灯珠
CN109994590A (zh) * 2019-04-11 2019-07-09 中山市立体光电科技有限公司 一种红光led封装器件及其制作方法
CN114335306A (zh) * 2021-12-13 2022-04-12 深圳市穗晶光电股份有限公司 一种新型白光led芯片
CN117153995A (zh) * 2023-10-30 2023-12-01 罗化芯显示科技开发(江苏)有限公司 一种led封装膜层及led封装结构

Also Published As

Publication number Publication date
TWI677114B (zh) 2019-11-11
KR102339021B1 (ko) 2021-12-15
KR20170040761A (ko) 2017-04-13
JP2017108111A (ja) 2017-06-15
JP6599295B2 (ja) 2019-10-30
TW201714329A (zh) 2017-04-16
KR20180127292A (ko) 2018-11-28

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Application publication date: 20170412