CN109994590A - 一种红光led封装器件及其制作方法 - Google Patents

一种红光led封装器件及其制作方法 Download PDF

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CN109994590A
CN109994590A CN201910290014.4A CN201910290014A CN109994590A CN 109994590 A CN109994590 A CN 109994590A CN 201910290014 A CN201910290014 A CN 201910290014A CN 109994590 A CN109994590 A CN 109994590A
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程胜鹏
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ZHONGSHAN MLS ELECTRONIC Co.,Ltd.
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ZHONGSHAN LITI LIGHTING TECHNOLOGY Co Ltd
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    • H01—ELECTRIC ELEMENTS
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Abstract

一种红光LED封装器件包括一颗倒装结构的蓝光LED芯片，所述蓝光LED芯片的顶面设置有荧光胶膜层，荧光胶膜层把蓝光LED芯片发出的蓝光转变为白色光；所述蓝光LED芯片的四周侧面设置有挡光层，挡光层把蓝光LED芯片四周侧面包围着，使得从蓝光LED芯片四周侧面发出的蓝色光线无法透射出来；蓝光LED芯片顶面的荧光胶膜上和挡光层顶面上设置有红色胶膜层，红色胶膜层完全覆盖着荧光胶膜的上表面，蓝光LED芯片发出蓝色光经荧光胶膜、红色胶膜层转为红色光。由于该红光LED封装器件是采用倒装结构的蓝光LED芯片作为发光源，利用蓝光LED芯片具有尺寸微小、驱动电路容易控制的优点，去代替原本使用倒装红光LED芯片封装成的全彩色RGB LED器件。

Description

一种红光LED封装器件及其制作方法
技术领域
本发明涉及LED封装领域，具体涉及一种红光LED封装器件的封装结构及其制作方法。
背景技术
目前，全彩色LED显示屏相对于投影仪、电视墙、液晶显示屏具有亮度高、工作电压低、功耗小、寿命长和性能稳定等优点。现有的全彩色LED显示屏是由很多件贴片式正装结构封装的RGB LED器件矩阵排列组成，每件RGB LED器件作为一个显示像素。每件正装封装的RGB LED器件是由分别发红光、绿光和蓝光的三颗LED芯片焊接在一单元电路上组成的，并施以不同的电流控制各自的亮度值，达到RGB三原色混合发光，从而实现全彩显色。如采用倒装结构LED芯片封装成的RGB LED器件，则能更有效地缩小器件尺寸，从而提高全彩色LED显示屏分辨率的优点。存在的问题是，RBG LED器件在封装时需要使用到的倒装红光LED芯片成本高，其厚度高，导致整个RBG LED器件尺寸增大，无法做到轻薄的。而且红光芯片的驱动电压较低，并与蓝光、绿光LED芯片不一致，导致RBG LED器件的驱动电路变得复杂，不易控制。
发明内容
本发明的目的是：为了解决上述的问题，提供一种应用倒装蓝光LED芯片经封装后转为发出红光的器件，用于代替原本的红光倒装LED芯片，使得成本降低，并且使用该红光LED封装器件组合成全彩色RGB LED器件的驱动电路容易设计和控制，电压更稳定的特点。
本发明是这样实现的：一种红光LED封装器件包括一颗倒装结构的蓝光LED芯片，所述蓝光LED芯片的顶面设置有荧光胶膜层，荧光胶膜层把蓝光LED芯片发出的蓝光转变为白色光；
所述蓝光LED芯片的四周侧面设置有挡光层，挡光层把蓝光LED芯片四周侧面包围着，使得从蓝光LED芯片四周侧面发出的蓝色光线无法透射出来；
蓝光LED芯片顶面的荧光胶膜上和挡光层顶面上设置有红色胶膜层，红色胶膜层完全覆盖着荧光胶膜的上表面，蓝光LED芯片发出蓝色光经荧光胶膜、红色胶膜层转为红色光。
进一步地，所述荧光胶膜为均匀混有荧光粉的胶膜。
进一步地，所述挡光层高度与荧光胶膜层高度相一致，并处于一个水平面上。
一种红光LED封装器件的制作方法包括下列步骤：
步骤1、将相同的蓝光LED芯片以矩阵方式排列固定在带有粘性的垫板上；
步骤2、将调试好蓝光转白光的荧光胶膜通过压膜工艺覆盖在蓝光LED芯片和垫板表面上；
步骤3、通过切割工艺将垫板四围边缘和蓝光LED芯片之间的荧光胶膜去掉形成纵横交错的沟槽，保留蓝光LED芯片顶面上的荧光胶膜层；
步骤4、将不透光的胶膜通过压膜工艺填充到沟槽内形成挡光层；
步骤5、将红色胶膜通过压膜工艺压合在挡光层顶面和荧光胶膜层上表面形成红色胶膜层；
步骤6、通过切割工艺沿垫板纵向、横向方向切割，去除每个红光LED封装器件底面上的垫板，得到多个红光LED封装器件的单体。
本发明提供一种红光LED封装器件，由于该红光LED封装器件是采用倒装结构的蓝光LED芯片作为发光源，利用蓝光LED芯片具有尺寸微小，驱动电路容易控制的优点，去代替原本使用倒装红光LED芯片封装成的全彩色RGB LED器件，有效地缩小全彩色RGB LED器件的尺寸，同时全彩色RGB LED器件的驱动电路控制更加容易。
附图说明
图1是本发明结构示意图。
图2是本发明的制作流程结构示意图。
图3是荧光胶膜覆盖在蓝光LED芯片和垫板表面上的结构示意图。
图4是去除蓝光LED芯片四周侧面上的荧光胶膜形成沟槽的示意图。
图5是使用不透光胶膜将沟槽填平后构成挡光层的结构示意图。
图6是将红色胶膜通压合在挡光层5顶面和荧光胶膜层3上形成红色胶膜层的结构示意图。
标记部分：1、垫板，2、蓝光LED芯片，3、荧光胶膜层，4、切割形成的沟槽，5、挡光层，6、红色胶膜层。
具体实施方式
下面结合附图对本发明的实施方式作详细描述，此处所描述的具体实施例仅是用于解释本发明，并不用于限定本发明。
如图1所示，一种红光LED封装器件包括一颗倒装结构的蓝光LED芯片2，所述蓝光LED芯片2的顶面设置有荧光胶膜层3，荧光胶膜层把蓝光LED芯片发出的蓝光转变为白色光；
所述蓝光LED芯片2的四周侧面设置有挡光层5，挡光层5把蓝光LED芯片2四周侧面包围着，使得从蓝光LED芯片2四周侧面发出的蓝色光线无法透射出来；
所述挡光层5高度与荧光胶膜层3高度相一致，并处于一个水平面上；
蓝光LED芯片顶面的荧光胶膜3上和挡光层5顶面上设置有红色胶膜层6，红色胶膜层6完全覆盖着荧光胶膜3的上表面，蓝光LED芯片发出蓝色光经荧光胶膜、红色胶膜层6转为红色光。
如图2-6所示，一种红光LED封装器件的制作方法包括下列步骤：
步骤1、将相同的蓝光LED芯片2以矩阵方式排列固定在带有粘性的垫板上；
步骤2、将调试好蓝光转白光的荧光胶膜通过压膜工艺覆盖在蓝光LED芯片2和垫板1表面上；
步骤3、通过切割工艺将垫板四围边缘和蓝光LED芯片之间的荧光胶膜3去掉形成纵横交错的沟槽4，保留蓝光LED芯片2顶面上的荧光胶膜层3；
步骤4、将不透光的胶膜通过压膜工艺填充到沟槽内形成挡光层5；
步骤5、将红色胶膜通过压膜工艺压合在挡光层5顶面和荧光胶膜层3上表面形成红色胶膜层；
步骤6、通过切割工艺沿垫板纵向、横向方向切割，除每个红光LED封装器件底面上的垫板，得到多个红光LED封装器件的单体。
通过上述步骤制作成的红光LED封装器件，去代替原本使用红光倒装LED芯片封装成的全彩色RGB LED器件，因此，每个全彩色RGB LED器件中的发光源实质是由二颗相同的倒装蓝光LED芯片加一颗倒装绿光LED芯片组成，其驱动电路只需设计成二路控制即可，即是蓝光LED芯片驱动电路和绿光LED芯片驱动电路，由于蓝光LED芯片相对于红光LED芯片的驱动电路设计要简单，且容易控制，实现了电压更稳定。由于蓝光LED芯片的结构优点是其厚度要比红光LED芯片的厚度更小，可有效地缩小全彩色RGB LED器件的尺寸，实现RGB LED器件的轻薄化。
以上所述的技术方案仅是本发明的优先实施方式。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明原理的情况下，还可以作出若干改进和变型，这也视为本发明的保护范围内。

Claims (4)

1.一种红光LED封装器件包括一颗倒装结构的蓝光LED芯片，其特征在于，所述蓝光LED芯片的顶面设置有荧光胶膜层，荧光胶膜层把蓝光LED芯片发出的蓝光转变为白色光；
所述蓝光LED芯片的四周侧面设置有挡光层，挡光层把蓝光LED芯片四周侧面包围着，使得从蓝光LED芯片四周侧面发出的蓝色光线无法透射出来；
蓝光LED芯片顶面的荧光胶膜上和挡光层顶面上设置有红色胶膜层，红色胶膜层完全覆盖着荧光胶膜的上表面，蓝光LED芯片发出蓝色光经荧光胶膜、红色胶膜层转为红色光。
2.根据权利要求1所述的一种红光LED封装器件，其特征在于，所述挡光层高度与荧光胶膜层高度相一致，处于一个水平面上。
3.根据权利要求2所述的一种微小型的全彩色LED封装器件，其特征在于，所述荧光胶膜为均匀混有荧光粉的胶膜。
4.一种红光LED封装器件的制作方法包括下列步骤：
步骤1、将相同的蓝光LED芯片以矩阵方式排列固定在带有粘性的垫板上；
步骤2、将调试好蓝光转白光的荧光胶膜通过压膜工艺覆盖在蓝光LED芯片和垫板表面上；
步骤3、通过切割工艺将垫板四围边缘和蓝光LED芯片之间的荧光胶膜去掉形成纵横交错的沟槽，保留蓝光LED芯片顶面上的荧光胶膜层；
步骤4、将不透光的胶膜通过压膜工艺填充到沟槽内形成挡光层；
步骤5、将红色胶膜通过压膜工艺压合在挡光层顶面和荧光胶膜层上表面形成红色胶膜层；
步骤6、通过切割工艺沿垫板纵向、横向方向切割，去除每个红光LED封装器件底面上的垫板，得到多个红光LED封装器件的单体。
CN201910290014.4A 2019-04-11 2019-04-11 一种红光led封装器件及其制作方法 Pending CN109994590A (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101978516A (zh) * 2008-03-21 2011-02-16 皇家飞利浦电子股份有限公司 发光器件
CN103779375A (zh) * 2014-02-19 2014-05-07 京东方科技集团股份有限公司 全彩led显示面板及其制造方法、显示器
CN106560933A (zh) * 2015-10-05 2017-04-12 行家光电股份有限公司 具导角反射结构的发光装置及其制造方法
CN108400220A (zh) * 2018-04-25 2018-08-14 江苏稳润光电有限公司 一种微型led显示模块的封装结构
CN209729947U (zh) * 2019-04-11 2019-12-03 中山市立体光电科技有限公司 一种红光led封装器件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101978516A (zh) * 2008-03-21 2011-02-16 皇家飞利浦电子股份有限公司 发光器件
CN103779375A (zh) * 2014-02-19 2014-05-07 京东方科技集团股份有限公司 全彩led显示面板及其制造方法、显示器
CN106560933A (zh) * 2015-10-05 2017-04-12 行家光电股份有限公司 具导角反射结构的发光装置及其制造方法
CN108400220A (zh) * 2018-04-25 2018-08-14 江苏稳润光电有限公司 一种微型led显示模块的封装结构
CN209729947U (zh) * 2019-04-11 2019-12-03 中山市立体光电科技有限公司 一种红光led封装器件

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