TWI677114B - 具導角反射結構的發光裝置 - Google Patents
具導角反射結構的發光裝置 Download PDFInfo
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- TWI677114B TWI677114B TW104132711A TW104132711A TWI677114B TW I677114 B TWI677114 B TW I677114B TW 104132711 A TW104132711 A TW 104132711A TW 104132711 A TW104132711 A TW 104132711A TW I677114 B TWI677114 B TW I677114B
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- Prior art keywords
- light
- fluorescent
- emitting device
- led chip
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- 239000000463 material Substances 0.000 claims description 58
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000004954 Polyphthalamide Substances 0.000 claims description 3
- 229920006375 polyphtalamide Polymers 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- TWMKXPBVMFGBRH-UHFFFAOYSA-N methanol;terephthalic acid Chemical compound OC.OC.OC(=O)C1=CC=C(C(O)=O)C=C1 TWMKXPBVMFGBRH-UHFFFAOYSA-N 0.000 claims 1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
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- REIDAMBAPLIATC-UHFFFAOYSA-N 4-methoxycarbonylbenzoic acid Chemical compound COC(=O)C1=CC=C(C(O)=O)C=C1 REIDAMBAPLIATC-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104132711A TWI677114B (zh) | 2015-10-05 | 2015-10-05 | 具導角反射結構的發光裝置 |
CN201610033451.4A CN106560933A (zh) | 2015-10-05 | 2016-01-19 | 具导角反射结构的发光装置及其制造方法 |
US15/280,927 US10763404B2 (en) | 2015-10-05 | 2016-09-29 | Light emitting device with beveled reflector and manufacturing method of the same |
EP16192043.4A EP3154095B1 (en) | 2015-10-05 | 2016-10-03 | Light emitting device with beveled reflector and manufacturing method of the same |
KR1020160127825A KR20170040761A (ko) | 2015-10-05 | 2016-10-04 | 경사 반사기를 갖는 발광 디바이스 및 그 제조 방법 |
JP2016197250A JP6599295B2 (ja) | 2015-10-05 | 2016-10-05 | 斜角反射体を備えた発光素子およびその製造方法 |
KR1020180144254A KR102339021B1 (ko) | 2015-10-05 | 2018-11-21 | 경사 반사기를 갖는 발광 디바이스 및 그 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104132711A TWI677114B (zh) | 2015-10-05 | 2015-10-05 | 具導角反射結構的發光裝置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201714329A TW201714329A (zh) | 2017-04-16 |
TWI677114B true TWI677114B (zh) | 2019-11-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104132711A TWI677114B (zh) | 2015-10-05 | 2015-10-05 | 具導角反射結構的發光裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6599295B2 (ko) |
KR (2) | KR20170040761A (ko) |
CN (1) | CN106560933A (ko) |
TW (1) | TWI677114B (ko) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107039572B (zh) * | 2016-02-03 | 2019-05-10 | 行家光电股份有限公司 | 具非对称性光形的发光装置及其制造方法 |
US10230030B2 (en) | 2016-01-28 | 2019-03-12 | Maven Optronics Co., Ltd. | Light emitting device with asymmetrical radiation pattern and manufacturing method of the same |
US10522728B2 (en) | 2017-01-26 | 2019-12-31 | Maven Optronics Co., Ltd. | Beveled chip reflector for chip-scale packaging light-emitting device and manufacturing method of the same |
TWI658610B (zh) * | 2017-09-08 | 2019-05-01 | Maven Optronics Co., Ltd. | 應用量子點色彩轉換之發光裝置及其製造方法 |
US10879434B2 (en) | 2017-09-08 | 2020-12-29 | Maven Optronics Co., Ltd. | Quantum dot-based color-converted light emitting device and method for manufacturing the same |
CN109494289B (zh) * | 2017-09-11 | 2020-08-11 | 行家光电股份有限公司 | 应用量子点色彩转换的发光装置及其制造方法 |
JP6729525B2 (ja) * | 2017-09-14 | 2020-07-22 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP7174215B2 (ja) * | 2017-09-29 | 2022-11-17 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
CN114464718A (zh) * | 2017-10-26 | 2022-05-10 | 晶元光电股份有限公司 | 发光装置 |
KR20190046392A (ko) * | 2017-10-26 | 2019-05-07 | 루미마이크로 주식회사 | 발광 패키지 |
KR102530755B1 (ko) * | 2017-12-07 | 2023-05-10 | 삼성전자주식회사 | 광 반사 패턴 및 파장 변환 층을 갖는 발광 소자 |
CN108279528B (zh) * | 2018-01-17 | 2021-05-28 | 惠州市华星光电技术有限公司 | 一种背光源 |
JP7224201B2 (ja) * | 2018-02-20 | 2023-02-17 | 晶元光電股▲ふん▼有限公司 | 発光素子およびその製造方法 |
US10461231B2 (en) * | 2018-02-27 | 2019-10-29 | Lumens Co., Ltd. | Method for fabricating LED package |
KR102621850B1 (ko) * | 2018-03-29 | 2024-01-08 | 주식회사 루멘스 | 사이드뷰 엘이디 패키지 및 사이드뷰 엘이디 모듈 |
JP6576581B1 (ja) | 2018-03-29 | 2019-09-18 | ルーメンス カンパニー リミテッド | サイドビューledパッケージ及びサイドビューledモジュール |
KR102567568B1 (ko) * | 2018-04-06 | 2023-08-16 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 패키지 |
CN110364612A (zh) | 2018-04-11 | 2019-10-22 | 日亚化学工业株式会社 | 发光装置 |
JP6848997B2 (ja) * | 2018-04-11 | 2021-03-24 | 日亜化学工業株式会社 | 発光装置 |
JP7133973B2 (ja) * | 2018-05-10 | 2022-09-09 | スタンレー電気株式会社 | 半導体発光装置 |
JP2019201089A (ja) * | 2018-05-15 | 2019-11-21 | マブン オプトロニックス カンパニー リミテッドMaven Optronics Co., Ltd. | チップスケールパッケージング発光素子の斜角チップ反射器およびその製造方法 |
JP7054005B2 (ja) | 2018-09-28 | 2022-04-13 | 日亜化学工業株式会社 | 発光装置 |
CN111162156A (zh) * | 2018-11-07 | 2020-05-15 | 深圳市聚飞光电股份有限公司 | 一种led芯片封装方法及led灯珠 |
CN111162151A (zh) * | 2018-11-07 | 2020-05-15 | 深圳市聚飞光电股份有限公司 | 一种led芯片封装方法及led灯珠 |
KR102101346B1 (ko) * | 2018-11-19 | 2020-05-27 | (주)호전에이블 | Led 플립칩 어레이 및 그 결합방법 |
JP7484727B2 (ja) * | 2019-01-25 | 2024-05-16 | ソニーグループ株式会社 | 発光デバイスおよび画像表示装置 |
CN109994590A (zh) * | 2019-04-11 | 2019-07-09 | 中山市立体光电科技有限公司 | 一种红光led封装器件及其制作方法 |
KR102131666B1 (ko) | 2019-11-08 | 2020-07-08 | 주식회사 위드플러스 | 발포잉크 리플렉터 및 이를 인쇄방식으로 인쇄회로기판에 형성하는 방법 |
KR102096668B1 (ko) | 2019-12-24 | 2020-04-03 | (주)코리아시스템 | 발광 디바이스 |
JP7189451B2 (ja) | 2020-06-30 | 2022-12-14 | 日亜化学工業株式会社 | 発光モジュール、液晶表示装置 |
KR102607323B1 (ko) * | 2020-08-28 | 2023-11-29 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 장치 |
JP7328557B2 (ja) | 2020-11-30 | 2023-08-17 | 日亜化学工業株式会社 | 光源、光源装置および光源の製造方法 |
CN113838961A (zh) * | 2021-10-25 | 2021-12-24 | 北京数字光芯科技有限公司 | 一种小发散角N型共阴极Micro LED器件及其阵列 |
CN114335306A (zh) * | 2021-12-13 | 2022-04-12 | 深圳市穗晶光电股份有限公司 | 一种新型白光led芯片 |
CN117153995A (zh) * | 2023-10-30 | 2023-12-01 | 罗化芯显示科技开发(江苏)有限公司 | 一种led封装膜层及led封装结构 |
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US20090321758A1 (en) * | 2008-06-25 | 2009-12-31 | Wen-Huang Liu | Led with improved external light extraction efficiency |
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US20110291149A1 (en) * | 2010-05-26 | 2011-12-01 | Kabushiki Kaisha Toshiba | Light emitting device |
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-
2015
- 2015-10-05 TW TW104132711A patent/TWI677114B/zh active
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2016
- 2016-01-19 CN CN201610033451.4A patent/CN106560933A/zh active Pending
- 2016-10-04 KR KR1020160127825A patent/KR20170040761A/ko active Application Filing
- 2016-10-05 JP JP2016197250A patent/JP6599295B2/ja active Active
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2018
- 2018-11-21 KR KR1020180144254A patent/KR102339021B1/ko active IP Right Grant
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TW201225348A (en) * | 2010-12-03 | 2012-06-16 | Advanced Optoelectronic Tech | LED and method for manufacturing the same |
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Also Published As
Publication number | Publication date |
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JP6599295B2 (ja) | 2019-10-30 |
CN106560933A (zh) | 2017-04-12 |
KR20170040761A (ko) | 2017-04-13 |
TW201714329A (zh) | 2017-04-16 |
KR102339021B1 (ko) | 2021-12-15 |
JP2017108111A (ja) | 2017-06-15 |
KR20180127292A (ko) | 2018-11-28 |
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