TW201225348A - LED and method for manufacturing the same - Google Patents

Abstract

This invention relates to an LED. The LED includes a base, an LED chip setting on the base and a reflecting cup surrounding the LED chip on the base. The LED chip electrically connected to outside by the electrodes setting on the base. The reflecting cup is filled with package layer. A fluorescent layer is formed by heating and depositing on an end of the package layer away from the LED chip. The fluorescent layer is used for converting the light emitted by the LED chip into a given wavelength light. This invention also relates to a method for manufacturing the same.

Description

201225348 VI. Description of the Invention: [Technology Leading to the Invention] The present invention relates to a light-emitting diode and a method of manufacturing the same. [Prior Art] A general-purpose light-emitting diode converts light emitted from a light-emitting diode wafer into an exit wavelength having a specific wavelength by a glory layer. However, the fluorescent layer in the general light-emitting diode is disposed in the reflective cup and covers the light-emitting diode wafer. The light-emitting diode wafer in this structure is different from the fluorescent material in the glory layer, and is easy to use. The Geng Waterfall is uneven now and the scenery is shining

..... .... ....... effect. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a light-emitting diode that can avoid uneven light mixing and a method of fabricating the same. [0004] A light-emitting diode' includes a substrate, a light-emitting body wafer disposed on the read substrate, and a reflective cup disposed on the substrate and surrounding the light-emitting monolithic wafer. The light-emitting diode chip is electrically connected to the outside by an electrode provided on the substrate. The: reflective cup filling: charging: having an encapsulating layer, the encapsulating layer is formed by heating precipitation to form a layered fluorescent region, which is a light emitting diode wafer The emitted light is converted to a specific wavelength and radiated outward. [0005] A method for manufacturing a light emitting diode, the manufacturing method comprising the following steps: [0006] providing a substrate and a reflective cup, wherein opposite ends of the substrate are respectively provided with a first electrode and a second electrode, and the reflective cup is along the substrate The circumference is arranged to form an accommodating space; 099142220 Form No. A0101 Page 3 / Total 21 Page 0992073356-0 201225348 [0007] The LED chip is disposed on the first electrode in the accommodating space and is respectively separated by wires Electrically connecting with the first electrode and the second electrode; [0008] filling the accommodating space with an encapsulating material containing fluorescent particles to form an encapsulation layer; [0009] sealing the encapsulation material in the accommodating space; [0010 Inverting the light emitting diode and heating the sealed encapsulating material, so that the fluorescent particles in the encapsulating material are deposited and accumulated in an opening of the accommodating space away from the side of the illuminating diode chip to form a layered fluorescing region. [0011] After the fluorescent region is stably formed, the heating is stopped and cooled to room temperature to cure the encapsulating material. [0012] In view of the above, it is necessary to provide a light-emitting diode and a method for fabricating the same by collecting the fluorescent particles originally dispersed in the entire encapsulation layer at the top of the encapsulation layer by heating precipitation to form a layer of fluorescent light. The region is such that the distance between the phosphor particles in the encapsulation layer and the LED chip is substantially the same, thereby greatly increasing the mixed light uniformity of the entire LED. [Embodiment] As shown in FIG. 1, a light-emitting diode 1 according to an embodiment of the present invention includes a substrate 10, a first electrode 12, a second electrode 14, a reflective cup 16, and a light-emitting diode. The polar body chip 15 and an encapsulation layer 17. The first electrode 12 and the second electrode 14 are respectively disposed on opposite sides of the substrate 10. The light emitting diode chip 15 is disposed on the first electrode 12 and respectively connected to the first electrode 12 by the wire 13 The second electrodes 14 are connected. The reflective cup 16 is disposed around the periphery of the substrate 10 and defines a reverse-conical accommodating space 16a for enclosing the LED array 15 in the accommodating space 16a. Form number A0101 Page 4 / 21 pages 0992073356-0 201225348 Filling the encapsulation material 17a to form an encapsulation layer covering the LED array 15 [0014] Specifically, the substrate 10 includes an upper surface 10a, a lower surface i〇 b and side surface 10c. The upper surface i 〇 a is parallel to the lower surface 1 〇 b, and the side surface 10 c is perpendicularly connected to the upper surface i 〇 a and the lower surface 丨〇 b, respectively. The first electrode 12 and the second electrode 14 are respectively extended from opposite ends of the upper surface 1〇3 of the substrate 10 to the corresponding side surface 10c and the lower surface 101). wherein the first electrode 12 is straight Covering the upper surface 1〇3 of the substrate 1〇 and the middle portion of the lower surface 0 1 Ob. [0015] The encapsulating layer 17 is provided with fluorescent particles i8a, and the fluorescent particles 18a are gathered at an opening of the accommodating space 16a away from the LED substrate 15 to form a seal at the top of the encapsulating layer 17. The fluorescent region 18 of the accommodation space 16a. The partitioning interface 18b between the phosphor region 18 and the encapsulation layer 17 is parallel to the upper surface i〇a of the substrate 10. The light emitted by the light-emitting diode chip 15 is converted by the fluorescent particles 18a to a specific wavelength and radiated outward when passing through the fluorescent region 18. The encapsulating layer 17 may be a light transmissive material such as polymethyl methacrylate resin, mercapto acrylate resin, polyacryl resin, polycarbonate or polyethylene resin. The material of the fluorescent particles 18a may be a sulfide, a salt, an oxide, a salt or a nitride. Specifically, the chemical composition of the fluorescent particles 18a is:

Ca Ali2〇 :Mn ' (Ca, Sr,Ba)A1 〇0 ·Eu ' z y 2 4 Y3Al5〇12:Ce3+(YAG) , Tb3A15〇12:Ce3+(TAG),

BaMgAlio〇17: Eu2+(Mn2+) > Ca0SiCN0:Eu2+ '(Ca,Sr,Ba)S:Eu2+, (Mg,Ca,Sr,Ba)2Si〇4:Eu2+, (Mg,Ca,Sr,Ba)3Si2 〇7: Eu2+, Ca8Mg(Si〇4)4C12:Eu2 + 099142220 Form No. A0101 Page 5 of 21 Page 0992073356-0 201225348, Y2〇2S: Eu3+, CdS, CdTe or CdSe. [0018] [0020] [0020] [0010] [991] 099142220 As shown in FIG. 2, a flow chart of a method for manufacturing the light-emitting diode 1 according to the present invention, the manufacturing method includes the following Step: Step S801 'Please refer to FIG. 3 together to provide the substrate 1 〇, the first t pole 12, the second electrode 14, and the reflective cup 16 as described above. The first electrode 12 and the second electrode 14 are respectively disposed on opposite sides of the substrate, and extend from the upper surface 10a of the substrate 10 to the corresponding side surface 1〇c and the lower surface 1〇b. The reflector cup 16 is circumferentially disposed along the circumference of the substrate 1 并 and forms an inverted cone-shaped accommodating space 16a. A portion of the first electrode 12 and the second electrode 14 located on the upper surface 10 a of the substrate 10 is respectively received at the bottom of the accommodating space 16a. Step S8G2 'please-see and FIG. 4, the light-emitting diode chip 15 is disposed on the first electrode 12 in the accommodating space 16a, and the light-emitting diode chip 15 is respectively provided by providing the wire 13 The first electrode u and the second electrode 14 on the substrate 1 are electrically connected. In step S803, please - and referring to Fig. 5, the accommodating space 16a is filled with a sealing material 17a containing fluorescent particles to form an encapsulating layer I covering the luminescent diode chip 15. Turning to S804, please refer to FIG. 6 together to provide a sealing mold 2, the end of the sealing tool 2 is provided with an open receiving groove 2〇; the sealing mold 2 is placed on the shooting cup 16 for reflection The top of the cup 16 is covered by the accommodating groove 2 从而 to seal the encapsulating material 17a in the accommodating space 16a.曰' As shown in FIG. 7, a bottom layer of the accommodating groove 20 may be provided with a layer of anti-adhesive spacers _2, the (4) mold 2 and the encapsulating material 曰0992073356-0 form number female, 6ι/#21ι ΠΙθ* 201225348 [0022防 [0024] [0025] [0009] 099142220 The anti-adhesion barrier film 22 is separated, and the square 2 is separated from the packaging material. The sealing mold 22 is made of a high-strength material, such as a polytetrafluoroethylene woven cloth. Step, please - and participate in the squeezing, the sealing mold continues to illuminate the polar body 1 and invert the 'sub-fog-heater 3 to heat the sealing mold 2' so that the (four) (four) material 17a becomes (four) and remains At this time, the fluorescent particles in the encapsulating material 17a are placed under the action of their own gravity to form a layered fluorescent light at the opening of the accommodating light-emitting diode chip 15 side. Area 18. Step m, the fluorescent area 18 to be intensively stops forming, stops heating, and cools to room temperature for the sealing material (four) (four). The encapsulation material 17a is located away from the accommodating space l6a (the side of the illuminating diode chip 15 forms a stable layered fluorescing region 18. Step S807, please-see also FIG. Separating from the light-emitting diode 1 to form the structure of the light-emitting diode 1 provided by the present invention. The light-emitting diode body provided by the present invention and the manufacturing method thereof are originally dispersed in the entire encapsulation layer by means of heat precipitation. The phosphor particles 18a in 17 are collected at the top end of the encapsulation layer 17 to form a layered phosphor region 18 such that the distance between the phosphor particles 18a in the encapsulation layer 17 and the LED array 15 is substantially the same, thereby greatly improving the entire The uniformity of light mixing of the light-emitting diodes 1. Those skilled in the art can also make other changes in the spirit of the present invention. These changes according to the spirit of the present invention should be included in the claimed invention. Form No. A0101 --- Page 7 / 21 pages 0992073356-0 201225348 [Simplified Schematic] FIG. 1 is a schematic structural view of a light-emitting diode according to an embodiment of the present invention [0028] Figure 2 is BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a schematic diagram of step S801 shown in FIG. 2. [0030] FIG. 4 is a schematic diagram of step S802 shown in FIG. 2. [0031] 5 is a schematic view of the step S803 shown in Fig. 2. [0032] Fig. 6 to Fig. 7 are schematic views of the step S804 shown in Fig. 2. [0033] Fig. 8 is a schematic view of the step S805 shown in Fig. 2. Fig. 9 is a schematic view of the step S807 shown in Fig. 2. [Main element symbol description] [0035] Light emitting diode 1 [0036] Substrate 10 [0037] Upper surface 10a [0038] Lower surface 10b [0039] Side Surface 10c [0040] First Electrode 12 [0041] Conductor 13 [0042] Second Electrode 14 [0043] Light Emitting Diode Wafer 15 Form No. A0101 Page 8 / Total 21 Page 099142220 0992073356-0 201225348 LUU44J Reflector Cup 16 [ 0045] accommodating space 16a [0046] encapsulating layer 17 [0047] encapsulating material 17a [0048] fluorescent region 18 [0049] luminescent particles 18a [0050] separating interface 18b [0051] sealing mold 2 [0052] accommodating groove 20 [0053] Anti-adhesive separator 22

099142220 Form No. A0101 Page 9 of 21 0992073356-0

Claims (1)

201225348 VII. Patent application scope: 1. A light-emitting diode comprising a substrate, a light-emitting diode chip disposed on the substrate, and a reflective cup disposed on the substrate and surrounding the light-emitting diode wafer, The LED is electrically connected to the outside by an electrode disposed on the substrate, and the improvement is that the reflective cup is filled with an encapsulation layer, and the encapsulation layer is formed by heating the sink at an end away from the LED substrate. There is a layered fluorescent region for converting the light emitted by the LED chip to a specific wavelength and radiating outward. 2. The light-emitting diode according to claim 2, wherein the substrate comprises parallel opposite upper and lower surfaces and side surfaces respectively perpendicularly connected to the upper and lower surfaces. 3. The light emitting diode according to claim 2, wherein the light emitting diode comprises a first electrode and a second electrode, wherein the first electrode and the second electrode are respectively opposite to each other by an upper surface of the substrate The end extends to the corresponding side surface and the lower surface, and the LED chip is disposed on the first electrode and is respectively connected to the first electrode and the second electrode by wires. 4. The luminescent earth electrode according to claim 2, wherein: the separation interface between the fluorescent region and the encapsulation layer is parallel to the upper surface of the substrate. In the light-emitting diode, the fluorescent region is provided with fluorescent particles, and the chemical composition of the fluorescent particles is Ca2A1i2〇9:Mn, (Ca,Sr,Ba)Al2〇4:Eu, Y3Al5012 :Ce3+(YAG), Tb3AI5〇l2:Ce3+(TAG), BaMgAli〇〇i7:Eu2+(Mn2+)^Ca„Si N :Eu2+ ^ (Ca,Sr,Ba)S:Eu2+, (Mg, Ca, Sr, Ba)9SiO/Eu2+, z 4 099142220 Form No. A0101 Page 10/Total 21 Page 0992073356-0 201225348 2 + (Mg, Ca, Sr, Ba) 3Si2〇7: Eu2+, Ca8Mg(Si〇4)4c12: EU, Y2〇2S: Eu3+, CdS, CdTe or CdSe. The light-emitting diode according to claim 1, wherein the chemical composition of the #层层 is selected from the group consisting of polymethyl methacrylate resin and methyl group. A composition of a propylene resin, a polyacrylic resin, a polycarbonate, and a polyethylene resin. A method for producing a light emitting diode, the method comprising the steps of: providing a substrate and a plurality of opposite ends of the substrate are respectively provided with a first electrode and a second electrode, and the reflective cup is disposed around the periphery of the substrate to form a space for accommodating; and the light-emitting diode chip is disposed in the space of the microwave The first electrode upper bridging is electrically connected to the first electrode and the second electrode respectively by wires; filling the accommodating space with an encapsulating material containing fluorescent particles to form an encapsulation layer; sealing the inside of the accommodating space Encapsulating material; 倒 inverting the light emitting diode and heating the sealed encapsulating material ′ such that phosphorescent particles in the encapsulating material are deposited and formed in a layered manner at an opening that accommodates the side of the photodiode wafer , the fluorescent region; after the stable formation of the fluorescent region, the heating is stopped and the room temperature is cooled to cure the encapsulating material. The method for manufacturing the light emitting diode according to claim 7 is ♦ One end of the sealing mold is provided with an open receiving groove. When the sealing mold is placed on the reflecting cup, the top of the reflecting cup is covered by the receiving groove. The light emitting according to claim 8 The method of manufacturing a polar body, wherein a bottom of the accommodating groove is provided with a layer of anti-adhesive separator. When the sealing mold is covered on the reflecting cup, the anti-adhesive separating film is covered on the top of the reflecting cup. The method for manufacturing a light-emitting diode according to the invention of claim 9, wherein the anti-adhesive separator is made of a polymer material. 099142220 Form No. A0101 Page 12 of 21 0992073356-0