CN106536656B - 用于封装有机电子装置的胶带 - Google Patents

用于封装有机电子装置的胶带 Download PDF

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CN106536656B
CN106536656B CN201580031425.1A CN201580031425A CN106536656B CN 106536656 B CN106536656 B CN 106536656B CN 201580031425 A CN201580031425 A CN 201580031425A CN 106536656 B CN106536656 B CN 106536656B
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adhesive
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CN106536656A (zh
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K.基特-泰尔甘比彻
J.龙普夫
J.斯托尔泽
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Tessa Europe Coltd
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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    • H—ELECTRICITY
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
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    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
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    • H10K85/151—Copolymers
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    • H10W74/00—Encapsulations, e.g. protective coatings
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    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
CN201580031425.1A 2014-04-11 2015-03-17 用于封装有机电子装置的胶带 Active CN106536656B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014207074.0A DE102014207074A1 (de) 2014-04-11 2014-04-11 Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102014207074.0 2014-04-11
PCT/EP2015/055480 WO2015154947A1 (de) 2014-04-11 2015-03-17 Klebeband für die kapselung einer organischen elektronischen anordnung

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CN106536656A CN106536656A (zh) 2017-03-22
CN106536656B true CN106536656B (zh) 2020-02-07

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US (1) US10011742B2 (enExample)
EP (1) EP3129443B1 (enExample)
JP (1) JP2017515935A (enExample)
KR (1) KR102238014B1 (enExample)
CN (1) CN106536656B (enExample)
DE (1) DE102014207074A1 (enExample)
TW (1) TWI663242B (enExample)
WO (1) WO2015154947A1 (enExample)

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US10626305B2 (en) 2014-10-29 2020-04-21 Tesa Se OLED-compatible adhesive masses having silane water scavengers
CN107148458A (zh) * 2014-10-29 2017-09-08 德莎欧洲公司 包含可活化的吸气剂材料的胶粘剂混合物
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
CN104934550A (zh) * 2015-05-07 2015-09-23 京东方科技集团股份有限公司 Oled器件的封装结构、封装方法以及电子设备
DE102015222027A1 (de) * 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
JP6563796B2 (ja) * 2015-12-03 2019-08-21 双葉電子工業株式会社 封止構造、有機ｅｌ表示装置、及びセンサ
WO2017163577A1 (ja) * 2016-03-25 2017-09-28 株式会社Ｓｃｒｅｅｎホールディングス 積層体の製造方法
KR102549995B1 (ko) * 2017-05-05 2023-06-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 중합체 필름 및 그러한 필름을 포함하는 디스플레이 디바이스
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
JP7285219B2 (ja) * 2017-05-05 2023-06-01 スリーエム イノベイティブ プロパティズ カンパニー ポリマーフィルムを含むディスプレイデバイス
CN108878618B (zh) 2017-05-11 2020-03-24 Tcl集团股份有限公司 一种qled器件及其制备方法
CN109216486A (zh) * 2017-07-07 2019-01-15 杭州纤纳光电科技有限公司 一种薄膜光伏组件封装结构与方法
JP7203835B2 (ja) * 2017-09-27 2023-01-13 アーケマ・インコーポレイテッド ハロアルキル及びハロアルケニルエーテル（メタ）アクリレートのポリマー
CN111163938B (zh) 2017-10-12 2022-09-09 艾利丹尼森公司 低放气清洁胶黏剂
KR102283118B1 (ko) * 2017-11-01 2021-07-28 주식회사 엘지화학 유-무기 복합 태양전지 및 유-무기 복합 태양전지 제조방법
JP7253542B2 (ja) * 2018-05-30 2023-04-06 デンカ株式会社 有機エレクトロルミネッセンス表示素子用封止剤
US10824040B2 (en) 2018-07-16 2020-11-03 Polyceed Inc. Insulated glass unit utilizing electrochromic elements
JPWO2020017221A1 (ja) * 2018-07-18 2021-08-12 パナソニックＩｐマネジメント株式会社 ガラスパネルユニット、及びガラスパネルユニットの製造方法
JP7329615B2 (ja) * 2019-03-29 2023-08-18 ダウ グローバル テクノロジーズ エルエルシー 疎水性処理されたヒュームドシリカを含むフィルム層を有するｐｖモジュール
CN110518121B (zh) * 2019-07-19 2021-02-05 华南师范大学 一种柔性钙钛矿太阳能电池的转移方法
CN110571335A (zh) * 2019-08-08 2019-12-13 北京曜能科技有限公司 钙钛矿光伏组件、制备方法和用途
CN110752312A (zh) * 2019-10-30 2020-02-04 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置
KR20210073685A (ko) * 2019-12-10 2021-06-21 삼성디스플레이 주식회사 디스플레이 장치
JP2021174884A (ja) * 2020-04-24 2021-11-01 フジプレアム株式会社 ペロブスカイト型太陽電池
CN112687828A (zh) * 2020-12-28 2021-04-20 华东师范大学 一种钙钛矿太阳能电池封装方法
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CN120345368A (zh) * 2022-11-04 2025-07-18 塞卢克斯公司 封装钙钛矿模块及包含该模块的太阳能电池
CN116487276B (zh) * 2023-04-26 2024-02-23 珠海妙存科技有限公司 一种芯片及其制作方法、半导体器件
DE102023209092A1 (de) 2023-09-19 2025-03-20 Infineon Technologies Ag Verkapselungsmittel mit porösem Farbstoff für ein elektronisches Gehäuse

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JP2017515935A (ja) 2017-06-15
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US10011742B2 (en) 2018-07-03
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