TWI663242B - 用於封裝有機電子元件的膠帶及保護設置在基材上的有機電子元件之方法 - Google Patents

用於封裝有機電子元件的膠帶及保護設置在基材上的有機電子元件之方法 Download PDF

Info

Publication number
TWI663242B
TWI663242B TW104111187A TW104111187A TWI663242B TW I663242 B TWI663242 B TW I663242B TW 104111187 A TW104111187 A TW 104111187A TW 104111187 A TW104111187 A TW 104111187A TW I663242 B TWI663242 B TW I663242B
Authority
TW
Taiwan
Prior art keywords
adhesive
phase
poly
layer
polymer
Prior art date
Application number
TW104111187A
Other languages
English (en)
Chinese (zh)
Other versions
TW201546235A (zh
Inventor
Klaus Keite-Telgenbuescher
克勞斯 凱特泰根布雀
Julia ROMPF
茱莉亞 羅普夫
Janika STOLZE
賈尼卡 史托茲
Original Assignee
Tesa Se
德商特薩股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se, 德商特薩股份有限公司 filed Critical Tesa Se
Publication of TW201546235A publication Critical patent/TW201546235A/zh
Application granted granted Critical
Publication of TWI663242B publication Critical patent/TWI663242B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
TW104111187A 2014-04-11 2015-04-08 用於封裝有機電子元件的膠帶及保護設置在基材上的有機電子元件之方法 TWI663242B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014207074.0 2014-04-11
DE102014207074.0A DE102014207074A1 (de) 2014-04-11 2014-04-11 Klebeband für die Kapselung einer organischen elektronischen Anordnung

Publications (2)

Publication Number Publication Date
TW201546235A TW201546235A (zh) 2015-12-16
TWI663242B true TWI663242B (zh) 2019-06-21

Family

ID=52875661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111187A TWI663242B (zh) 2014-04-11 2015-04-08 用於封裝有機電子元件的膠帶及保護設置在基材上的有機電子元件之方法

Country Status (8)

Country Link
US (1) US10011742B2 (enExample)
EP (1) EP3129443B1 (enExample)
JP (1) JP2017515935A (enExample)
KR (1) KR102238014B1 (enExample)
CN (1) CN106536656B (enExample)
DE (1) DE102014207074A1 (enExample)
TW (1) TWI663242B (enExample)
WO (1) WO2015154947A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107148458A (zh) * 2014-10-29 2017-09-08 德莎欧洲公司 包含可活化的吸气剂材料的胶粘剂混合物
US10626305B2 (en) 2014-10-29 2020-04-21 Tesa Se OLED-compatible adhesive masses having silane water scavengers
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
CN104934550A (zh) * 2015-05-07 2015-09-23 京东方科技集团股份有限公司 Oled器件的封装结构、封装方法以及电子设备
DE102015222027A1 (de) * 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
JP6563796B2 (ja) * 2015-12-03 2019-08-21 双葉電子工業株式会社 封止構造、有機ｅｌ表示装置、及びセンサ
WO2017163577A1 (ja) * 2016-03-25 2017-09-28 株式会社Ｓｃｒｅｅｎホールディングス 積層体の製造方法
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
JP7285219B2 (ja) * 2017-05-05 2023-06-01 スリーエム イノベイティブ プロパティズ カンパニー ポリマーフィルムを含むディスプレイデバイス
KR102549995B1 (ko) * 2017-05-05 2023-06-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 중합체 필름 및 그러한 필름을 포함하는 디스플레이 디바이스
CN108878618B (zh) 2017-05-11 2020-03-24 Tcl集团股份有限公司 一种qled器件及其制备方法
CN109216486A (zh) * 2017-07-07 2019-01-15 杭州纤纳光电科技有限公司 一种薄膜光伏组件封装结构与方法
CN111433233A (zh) * 2017-09-27 2020-07-17 阿科玛股份有限公司 卤代烷基和卤代烯基醚(甲基)丙烯酸酯的聚合物
SG11202003310XA (en) 2017-10-12 2020-05-28 Avery Dennison Corp Low outgassing clean adhesive
KR102283118B1 (ko) * 2017-11-01 2021-07-28 주식회사 엘지화학 유-무기 복합 태양전지 및 유-무기 복합 태양전지 제조방법
CN112205075A (zh) * 2018-05-30 2021-01-08 电化株式会社 有机电致发光显示元件用密封剂
CN112585529B (zh) * 2018-07-16 2024-08-06 波利斯德有限公司 用于可变透射和电化学装置的聚合物组合物
WO2020017221A1 (ja) * 2018-07-18 2020-01-23 パナソニックＩｐマネジメント株式会社 ガラスパネルユニット、及びガラスパネルユニットの製造方法
KR102653668B1 (ko) * 2019-03-29 2024-04-03 다우 글로벌 테크놀로지스 엘엘씨 소수성 처리된 흄드 실리카를 포함하는 필름층이 있는 pv 모듈
CN110518121B (zh) * 2019-07-19 2021-02-05 华南师范大学 一种柔性钙钛矿太阳能电池的转移方法
CN110571335A (zh) * 2019-08-08 2019-12-13 北京曜能科技有限公司 钙钛矿光伏组件、制备方法和用途
CN110752312A (zh) * 2019-10-30 2020-02-04 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置
KR20210073685A (ko) 2019-12-10 2021-06-21 삼성디스플레이 주식회사 디스플레이 장치
JP2021174884A (ja) * 2020-04-24 2021-11-01 フジプレアム株式会社 ペロブスカイト型太陽電池
CN112687828A (zh) * 2020-12-28 2021-04-20 华东师范大学 一种钙钛矿太阳能电池封装方法
KR102716703B1 (ko) 2021-10-20 2024-10-15 한국전자통신연구원 발광소자의 엔캡슐레이션 소재 및 이에 의해 제조된 발광소자
CN114121690B (zh) * 2021-11-24 2025-06-03 上海昀通电子科技有限公司 一种sip封装选择性溅镀的方法
CN118511671A (zh) * 2022-01-07 2024-08-16 松下控股株式会社 太阳能电池
FR3139143B1 (fr) * 2022-08-30 2024-08-30 Commissariat Energie Atomique Procede de transfert d’une couche adhesive en polymere(s) thermoplastique(s) d’un premier substrat vers un deuxieme substrat
JP2025540610A (ja) * 2022-11-04 2025-12-16 カエラックス・コーポレーション 封入ペロブスカイトモジュール及びそれを含有する太陽電池
CN116487276B (zh) * 2023-04-26 2024-02-23 珠海妙存科技有限公司 一种芯片及其制作方法、半导体器件
DE102023209092A1 (de) 2023-09-19 2025-03-20 Infineon Technologies Ag Verkapselungsmittel mit porösem Farbstoff für ein elektronisches Gehäuse

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008310267A (ja) * 2007-06-18 2008-12-25 Daio Paper Corp 光拡散性粘着シート
TW201402766A (zh) * 2012-06-29 2014-01-16 特薩股份有限公司 用於封裝有機電子組件的膠帶

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
DE3628471A1 (de) 1986-08-22 1988-02-25 Drescher Datendrucke Verfahren zum verkleben von zu bedruckenden und/oder zu beschriftenden papierblaettern oder dgl. und papiererzeugnis, insbesondere einblattbrief, formularsatz oder dgl.
DE3918616A1 (de) 1989-06-07 1990-12-13 Minnesota Mining & Mfg Klebeband
DE69626018D1 (de) * 1995-06-26 2003-03-06 Minnesota Mining & Mfg Lichtstreuender klebstoff
EP0938526B1 (en) 1996-11-12 2003-04-23 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
US6803081B2 (en) 2001-06-26 2004-10-12 National Starch And Chemical Investment Holding Corporation Radiation curable adhesive
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
CN1678639A (zh) 2002-07-24 2005-10-05 粘合剂研究公司 可转换的压敏粘合剂胶带及其在显示屏上的用途
US7449629B2 (en) 2002-08-21 2008-11-11 Truseal Technologies, Inc. Solar panel including a low moisture vapor transmission rate adhesive composition
JP2005263994A (ja) * 2004-03-18 2005-09-29 Soken Chem & Eng Co Ltd 光拡散反射遮光性粘着テープ及びそれを用いるフラットパネル型ディスプレイ装置
JP2005298703A (ja) 2004-04-13 2005-10-27 Mitsui Chemicals Inc 粘着性フィルム、筐体およびそれを用いた有機ｅｌ発光素子
US20060087230A1 (en) 2004-10-22 2006-04-27 Eastman Kodak Company Desiccant film in top-emitting OLED
JP2006348208A (ja) * 2005-06-17 2006-12-28 Toyo Ink Mfg Co Ltd 光拡散性粘着剤組成物及びそれを用いてなる光拡散性粘着シート
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
WO2008036707A2 (en) 2006-09-20 2008-03-27 Dow Global Technologies Inc. Electronic device module comprising an ethylene multi-block copolymer
DE102008003546A1 (de) 2008-01-09 2009-07-16 Tesa Ag Liner mit einer Barriereschicht
JP5731977B2 (ja) 2008-09-17 2015-06-10 スリーエム イノベイティブ プロパティズ カンパニー 光拡散性感圧接着剤
EP2331647A4 (en) 2008-09-17 2012-02-01 3M Innovative Properties Co OPTICAL ADHESIVE WITH DIFFUSION PROPERTIES
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
JP5201347B2 (ja) 2008-11-28 2013-06-05 株式会社スリーボンド 有機ｅｌ素子封止用光硬化性樹脂組成物
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102008062130A1 (de) 2008-12-16 2010-06-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036986B4 (de) 2009-08-12 2011-07-07 Volkswagen AG, 38440 Ausgleichsgetriebe
DE102009036970A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
US20120276317A1 (en) 2009-12-08 2012-11-01 Kiu-Yuen Tse Optically diffusive adhesive and method of making the same
US9816685B2 (en) 2010-11-08 2017-11-14 Lg Chem, Ltd. Pressure-sensitive adhesive composition
DE102012202377A1 (de) 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008310267A (ja) * 2007-06-18 2008-12-25 Daio Paper Corp 光拡散性粘着シート
TW201402766A (zh) * 2012-06-29 2014-01-16 特薩股份有限公司 用於封裝有機電子組件的膠帶

Also Published As

Publication number Publication date
CN106536656B (zh) 2020-02-07
TW201546235A (zh) 2015-12-16
EP3129443B1 (de) 2021-04-28
US20170101556A1 (en) 2017-04-13
KR102238014B1 (ko) 2021-04-08
JP2017515935A (ja) 2017-06-15
CN106536656A (zh) 2017-03-22
WO2015154947A1 (de) 2015-10-15
DE102014207074A1 (de) 2015-10-15
KR20160143799A (ko) 2016-12-14
US10011742B2 (en) 2018-07-03
EP3129443A1 (de) 2017-02-15

Similar Documents

Publication Publication Date Title
CN106536656B (zh) 用于封装有机电子装置的胶带
JP2018199821A (ja) 有機電子的装置をカプセル化するための接着テープ
JP5270755B2 (ja) 接着剤封入組成物及びそれで作られた電子デバイス
JP2017515935A5 (enExample)
US8232350B2 (en) Adhesive encapsulating composition and electronic devices made therewith
JP5634518B2 (ja) 電子的装置のカプセル化方法
TWI488242B (zh) 封裝電子零件之方法
CN108264860B (zh) 用于保护粘合剂化合物的衬垫
TWI681034B (zh) 具有可活化吸氣劑材料之黏著劑、其用途及應用方法，及保護有機電子裝置之方法
CN107001892A (zh) 包含多官能性硅氧烷水清除剂的胶粘剂

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees