CN106536656B - 用于封装有机电子装置的胶带 - Google Patents

用于封装有机电子装置的胶带 Download PDF

Info

Publication number
CN106536656B
CN106536656B CN201580031425.1A CN201580031425A CN106536656B CN 106536656 B CN106536656 B CN 106536656B CN 201580031425 A CN201580031425 A CN 201580031425A CN 106536656 B CN106536656 B CN 106536656B
Authority
CN
China
Prior art keywords
adhesive
poly
domains
less
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580031425.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN106536656A (zh
Inventor
K.基特-泰尔甘比彻
J.龙普夫
J.斯托尔泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tessa Europe Coltd
Original Assignee
Tessa Europe Coltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessa Europe Coltd filed Critical Tessa Europe Coltd
Publication of CN106536656A publication Critical patent/CN106536656A/zh
Application granted granted Critical
Publication of CN106536656B publication Critical patent/CN106536656B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
CN201580031425.1A 2014-04-11 2015-03-17 用于封装有机电子装置的胶带 Active CN106536656B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014207074.0 2014-04-11
DE102014207074.0A DE102014207074A1 (de) 2014-04-11 2014-04-11 Klebeband für die Kapselung einer organischen elektronischen Anordnung
PCT/EP2015/055480 WO2015154947A1 (de) 2014-04-11 2015-03-17 Klebeband für die kapselung einer organischen elektronischen anordnung

Publications (2)

Publication Number Publication Date
CN106536656A CN106536656A (zh) 2017-03-22
CN106536656B true CN106536656B (zh) 2020-02-07

Family

ID=52875661

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580031425.1A Active CN106536656B (zh) 2014-04-11 2015-03-17 用于封装有机电子装置的胶带

Country Status (8)

Country Link
US (1) US10011742B2 (OSRAM)
EP (1) EP3129443B1 (OSRAM)
JP (1) JP2017515935A (OSRAM)
KR (1) KR102238014B1 (OSRAM)
CN (1) CN106536656B (OSRAM)
DE (1) DE102014207074A1 (OSRAM)
TW (1) TWI663242B (OSRAM)
WO (1) WO2015154947A1 (OSRAM)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3212725B1 (de) 2014-10-29 2024-03-06 tesa SE Oled kompatible klebemassen mit silanwasserfängern
JP6474489B2 (ja) * 2014-10-29 2019-02-27 テーザ・ソシエタス・ヨーロピア 活性化可能なゲッター材料を含む接着剤
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
CN104934550A (zh) * 2015-05-07 2015-09-23 京东方科技集团股份有限公司 Oled器件的封装结构、封装方法以及电子设备
DE102015222027A1 (de) * 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
JP6563796B2 (ja) * 2015-12-03 2019-08-21 双葉電子工業株式会社 封止構造、有機ｅｌ表示装置、及びセンサ
WO2017163577A1 (ja) * 2016-03-25 2017-09-28 株式会社Ｓｃｒｅｅｎホールディングス 積層体の製造方法
KR102549995B1 (ko) * 2017-05-05 2023-06-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 중합체 필름 및 그러한 필름을 포함하는 디스플레이 디바이스
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
WO2018204648A1 (en) * 2017-05-05 2018-11-08 3M Innovative Properties Company Display devices containing polymeric films
CN108878618B (zh) * 2017-05-11 2020-03-24 Tcl集团股份有限公司 一种qled器件及其制备方法
CN109216486A (zh) * 2017-07-07 2019-01-15 杭州纤纳光电科技有限公司 一种薄膜光伏组件封装结构与方法
WO2019067408A1 (en) * 2017-09-27 2019-04-04 Arkema Inc. (METH) ACRYLATE POLYMERS OF HALOALKYL AND HALOALCENYL ETHER
US11541639B2 (en) 2017-10-12 2023-01-03 Avery Dennison Corporation Low outgassing clean adhesive
KR102283118B1 (ko) * 2017-11-01 2021-07-28 주식회사 엘지화학 유-무기 복합 태양전지 및 유-무기 복합 태양전지 제조방법
CN112205075A (zh) * 2018-05-30 2021-01-08 电化株式会社 有机电致发光显示元件用密封剂
US11086181B2 (en) 2018-07-16 2021-08-10 Polyceed, Inc. Polymeric ion-conductive electrolyte sheet
JPWO2020017221A1 (ja) * 2018-07-18 2021-08-12 パナソニックＩｐマネジメント株式会社 ガラスパネルユニット、及びガラスパネルユニットの製造方法
WO2020198922A1 (en) * 2019-03-29 2020-10-08 Dow Global Technologies Llc Pv module with film layer comprising hydrophobic-treated fumed silica
CN110518121B (zh) * 2019-07-19 2021-02-05 华南师范大学 一种柔性钙钛矿太阳能电池的转移方法
CN110571335A (zh) * 2019-08-08 2019-12-13 北京曜能科技有限公司 钙钛矿光伏组件、制备方法和用途
CN110752312A (zh) * 2019-10-30 2020-02-04 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置
KR20210073685A (ko) * 2019-12-10 2021-06-21 삼성디스플레이 주식회사 디스플레이 장치
JP2021174884A (ja) * 2020-04-24 2021-11-01 フジプレアム株式会社 ペロブスカイト型太陽電池
CN112687828A (zh) * 2020-12-28 2021-04-20 华东师范大学 一种钙钛矿太阳能电池封装方法
KR102716703B1 (ko) 2021-10-20 2024-10-15 한국전자통신연구원 발광소자의 엔캡슐레이션 소재 및 이에 의해 제조된 발광소자
CN114121690B (zh) * 2021-11-24 2025-06-03 上海昀通电子科技有限公司 一种sip封装选择性溅镀的方法
WO2023132135A1 (ja) * 2022-01-07 2023-07-13 パナソニックホールディングス株式会社 太陽電池
KR20250131768A (ko) * 2022-11-04 2025-09-03 케일룩스 코포레이션 캡슐화된 페로브스카이트 모듈 및 이를 포함하는 태양 전지
CN116487276B (zh) * 2023-04-26 2024-02-23 珠海妙存科技有限公司 一种芯片及其制作方法、半导体器件
DE102023209092A1 (de) 2023-09-19 2025-03-20 Infineon Technologies Ag Verkapselungsmittel mit porösem Farbstoff für ein elektronisches Gehäuse

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1189181A (zh) * 1995-06-26 1998-07-29 美国3M公司 光漫射粘合剂
JP2008310267A (ja) * 2007-06-18 2008-12-25 Daio Paper Corp 光拡散性粘着シート
CN102171300A (zh) * 2008-09-17 2011-08-31 3M创新有限公司 光漫射压敏粘合剂

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
DE3628471A1 (de) 1986-08-22 1988-02-25 Drescher Datendrucke Verfahren zum verkleben von zu bedruckenden und/oder zu beschriftenden papierblaettern oder dgl. und papiererzeugnis, insbesondere einblattbrief, formularsatz oder dgl.
DE3918616A1 (de) 1989-06-07 1990-12-13 Minnesota Mining & Mfg Klebeband
KR100430958B1 (ko) 1996-11-12 2004-05-12 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 열경화성의 감압성 접착제
US6803081B2 (en) 2001-06-26 2004-10-12 National Starch And Chemical Investment Holding Corporation Radiation curable adhesive
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US20060100299A1 (en) 2002-07-24 2006-05-11 Ranjit Malik Transformable pressure sensitive adhesive tape and use thereof in display screens
US7449629B2 (en) 2002-08-21 2008-11-11 Truseal Technologies, Inc. Solar panel including a low moisture vapor transmission rate adhesive composition
JP2005263994A (ja) * 2004-03-18 2005-09-29 Soken Chem & Eng Co Ltd 光拡散反射遮光性粘着テープ及びそれを用いるフラットパネル型ディスプレイ装置
JP2005298703A (ja) 2004-04-13 2005-10-27 Mitsui Chemicals Inc 粘着性フィルム、筐体およびそれを用いた有機ｅｌ発光素子
US20060087230A1 (en) 2004-10-22 2006-04-27 Eastman Kodak Company Desiccant film in top-emitting OLED
JP2006348208A (ja) * 2005-06-17 2006-12-28 Toyo Ink Mfg Co Ltd 光拡散性粘着剤組成物及びそれを用いてなる光拡散性粘着シート
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
CN101517750B (zh) 2006-09-20 2011-06-29 陶氏环球技术有限责任公司 包括乙烯多嵌段共聚物的电子器件模块
DE102008003546A1 (de) 2008-01-09 2009-07-16 Tesa Ag Liner mit einer Barriereschicht
KR20110055730A (ko) * 2008-09-17 2011-05-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 확산 특성을 갖는 광학 접착제
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
JP5201347B2 (ja) 2008-11-28 2013-06-05 株式会社スリーボンド 有機ｅｌ素子封止用光硬化性樹脂組成物
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102008062130A1 (de) 2008-12-16 2010-06-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036970A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036986B4 (de) 2009-08-12 2011-07-07 Volkswagen AG, 38440 Ausgleichsgetriebe
KR20120091439A (ko) 2009-12-08 2012-08-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광학 확산 접착제 및 그의 제조 방법
KR101621993B1 (ko) 2010-11-08 2016-05-19 주식회사 엘지화학 점착제 조성물
DE102012202377A1 (de) 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
DE102012211335A1 (de) * 2012-06-29 2014-01-02 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1189181A (zh) * 1995-06-26 1998-07-29 美国3M公司 光漫射粘合剂
JP2008310267A (ja) * 2007-06-18 2008-12-25 Daio Paper Corp 光拡散性粘着シート
CN102171300A (zh) * 2008-09-17 2011-08-31 3M创新有限公司 光漫射压敏粘合剂

Also Published As

Publication number Publication date
KR20160143799A (ko) 2016-12-14
TW201546235A (zh) 2015-12-16
TWI663242B (zh) 2019-06-21
JP2017515935A (ja) 2017-06-15
EP3129443A1 (de) 2017-02-15
EP3129443B1 (de) 2021-04-28
KR102238014B1 (ko) 2021-04-08
US10011742B2 (en) 2018-07-03
DE102014207074A1 (de) 2015-10-15
WO2015154947A1 (de) 2015-10-15
US20170101556A1 (en) 2017-04-13
CN106536656A (zh) 2017-03-22

Similar Documents

Publication Publication Date Title
CN106536656B (zh) 用于封装有机电子装置的胶带
CN104508063B (zh) 用于封装有机电子组件的胶带
JP2017515935A5 (OSRAM)
CN102576822B (zh) 封装电子装置的方法
CN102576821B (zh) 封装电子装置的方法
TWI488242B (zh) 封裝電子零件之方法
CN101677072B (zh) 封装电子装置的方法
KR102123407B1 (ko) 전자 장치를 둘러싸기 위한 감압 접착제
CN108264860B (zh) 用于保护粘合剂化合物的衬垫
KR20110020862A (ko) 접착성 캡슐화 조성물 및 그것을 사용하여 제조한 전자 소자
TW201435037A (zh) 含吸氣劑材料的膠帶
KR20110014692A (ko) 접착성 캡슐화 조성물 및 그로 제조된 전자 소자
KR102248140B1 (ko) 얇은 유리 복합체 및 얇은 유리 필름을 저장하는 방법
TWI681034B (zh) 具有可活化吸氣劑材料之黏著劑、其用途及應用方法，及保護有機電子裝置之方法
TWI633927B (zh) 平面構造物、其用途及自平面構造物移除滲透物之方法
TW201710452A (zh) 特別用於封裝電子組件之黏著劑
CN107001892A (zh) 包含多官能性硅氧烷水清除剂的胶粘剂
TW201436855A (zh) 從平面結構物移除滲透物的方法
CN112424970B (zh) 透明全区域封装与具有高吸气剂含量的非透明边缘封装的组合

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Norderstedt

Applicant after: Tesa AG

Address before: Norderstedt

Applicant before: Tesa Europe Corporation

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant