CN106167683A - 胶粘薄膜、切割胶带一体型胶粘薄膜、多层薄膜、半导体装置的制造方法及半导体装置 - Google Patents
胶粘薄膜、切割胶带一体型胶粘薄膜、多层薄膜、半导体装置的制造方法及半导体装置 Download PDFInfo
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- CN106167683A CN106167683A CN201610329649.7A CN201610329649A CN106167683A CN 106167683 A CN106167683 A CN 106167683A CN 201610329649 A CN201610329649 A CN 201610329649A CN 106167683 A CN106167683 A CN 106167683A
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- adhesive foil
- chip
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- methyl
- semiconductor device
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- QLAGHGSFXJZWKY-UHFFFAOYSA-N triphenylborane;triphenylphosphane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QLAGHGSFXJZWKY-UHFFFAOYSA-N 0.000 description 1
- KRLHYNPADOCLAJ-UHFFFAOYSA-N undecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCOC(=O)C(C)=C KRLHYNPADOCLAJ-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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Landscapes
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2015100954A JP6603479B2 (ja) | 2015-05-18 | 2015-05-18 | 接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置 |
| JP2015-100954 | 2015-05-18 |
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| CN106167683A true CN106167683A (zh) | 2016-11-30 |
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| JP (1) | JP6603479B2 (ja) |
| KR (1) | KR20160135654A (ja) |
| CN (1) | CN106167683A (ja) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107446535A (zh) * | 2017-08-16 | 2017-12-08 | 浙江林境新材料科技有限公司 | 一种复合板 |
| CN110441115A (zh) * | 2019-09-09 | 2019-11-12 | 中国科学院电工研究所 | 一种多层膜x射线波带片的制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101962193B1 (ko) * | 2017-08-22 | 2019-03-26 | (주)이녹스첨단소재 | 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| EP3706164A4 (en) * | 2017-10-31 | 2021-08-11 | Nagase ChemteX Corporation | PROCESS FOR PRODUCING A PACKAGING STRUCTURE AND SHEET USED THEREIN |
| JP7176536B2 (ja) * | 2018-01-30 | 2022-11-22 | 昭和電工マテリアルズ株式会社 | 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法 |
| JP7028264B2 (ja) * | 2018-01-30 | 2022-03-02 | 昭和電工マテリアルズ株式会社 | フィルム状接着剤及びその製造方法、並びに半導体装置及びその製造方法 |
| WO2019150444A1 (ja) * | 2018-01-30 | 2019-08-08 | 日立化成株式会社 | 半導体装置の製造方法、及びフィルム状接着剤 |
| TW202100694A (zh) * | 2019-03-22 | 2021-01-01 | 日商琳得科股份有限公司 | 膜狀接著劑以及半導體加工用片 |
| WO2020217401A1 (ja) * | 2019-04-25 | 2020-10-29 | 日立化成株式会社 | ドルメン構造を有する半導体装置及びその製造方法、並びに、支持片形成用積層フィルム及びその製造方法 |
| WO2020217397A1 (ja) | 2019-04-25 | 2020-10-29 | 日立化成株式会社 | ドルメン構造を有する半導体装置の製造方法、支持片の製造方法及び積層フィルム |
| WO2023188170A1 (ja) * | 2022-03-30 | 2023-10-05 | 株式会社レゾナック | 半導体用接着フィルム、ダイシングダイボンディングフィルム、及び半導体装置を製造する方法 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1186504A (zh) * | 1995-04-25 | 1998-07-01 | 美国3M公司 | 增粘的聚二有机基硅氧烷低聚脲嵌段共聚物及其制备方法 |
| JPH11279521A (ja) * | 1997-05-08 | 1999-10-12 | Sekisui Chem Co Ltd | 接着剤組成物 |
| CN1946821A (zh) * | 2004-02-27 | 2007-04-11 | 琳得科株式会社 | 粘接片 |
| CN1993809A (zh) * | 2004-08-03 | 2007-07-04 | 古河电气工业株式会社 | 半导体器件制造方法及晶片加工带 |
| CN101679815A (zh) * | 2007-05-28 | 2010-03-24 | Dic株式会社 | 再剥离用粘着片 |
| CN102074494A (zh) * | 2009-10-14 | 2011-05-25 | 日东电工株式会社 | 热固型芯片接合薄膜 |
| CN102190975A (zh) * | 2010-03-01 | 2011-09-21 | 日东电工株式会社 | 芯片接合薄膜、切割/芯片接合薄膜及半导体装置 |
| CN102994009A (zh) * | 2012-11-27 | 2013-03-27 | 明尼苏达矿业制造医用器材（上海）有限公司 | 水胶体粘合剂和水胶体敷料 |
| CN103525338A (zh) * | 2012-07-06 | 2014-01-22 | 日东电工株式会社 | 半导体装置用胶粘剂组合物、半导体装置用胶粘薄膜、带有切割薄膜的胶粘薄膜、半导体装置的制造方法以及半导体装置 |
| CN104119812A (zh) * | 2013-04-25 | 2014-10-29 | 日东电工株式会社 | 胶粘薄膜、切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1360258B1 (en) * | 2000-01-31 | 2007-03-14 | H.B. Fuller Licensing & Financing, Inc. | Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks |
| JP5063262B2 (ja) * | 2006-08-30 | 2012-10-31 | Ｄｉｃ株式会社 | 再剥離用粘着シート |
| US20110229721A1 (en) * | 2008-09-11 | 2011-09-22 | Lanxess Deutschland Gmbh | Hotmelt adhesives |
| US20100286642A1 (en) * | 2009-05-11 | 2010-11-11 | Allen Jr William Maxwell | Water-stable, oil-modified, nonreactive alkyd resin construction adhesives, and use thereof |
| JP5897839B2 (ja) * | 2011-07-29 | 2016-03-30 | 日東電工株式会社 | 半導体装置 |
| JP5888805B2 (ja) * | 2011-09-01 | 2016-03-22 | 日東電工株式会社 | 接着フィルム及びダイシング・ダイボンドフィルム |
| JP2013191592A (ja) * | 2012-03-12 | 2013-09-26 | Idemitsu Unitech Co Ltd | 電気・電子部品の封止方法 |
-
2015
- 2015-05-18 JP JP2015100954A patent/JP6603479B2/ja active Active
-
2016
- 2016-05-09 KR KR1020160056178A patent/KR20160135654A/ko unknown
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Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1186504A (zh) * | 1995-04-25 | 1998-07-01 | 美国3M公司 | 增粘的聚二有机基硅氧烷低聚脲嵌段共聚物及其制备方法 |
| JPH11279521A (ja) * | 1997-05-08 | 1999-10-12 | Sekisui Chem Co Ltd | 接着剤組成物 |
| CN1946821A (zh) * | 2004-02-27 | 2007-04-11 | 琳得科株式会社 | 粘接片 |
| CN1993809A (zh) * | 2004-08-03 | 2007-07-04 | 古河电气工业株式会社 | 半导体器件制造方法及晶片加工带 |
| CN101679815A (zh) * | 2007-05-28 | 2010-03-24 | Dic株式会社 | 再剥离用粘着片 |
| CN102074494A (zh) * | 2009-10-14 | 2011-05-25 | 日东电工株式会社 | 热固型芯片接合薄膜 |
| CN102190975A (zh) * | 2010-03-01 | 2011-09-21 | 日东电工株式会社 | 芯片接合薄膜、切割/芯片接合薄膜及半导体装置 |
| CN103525338A (zh) * | 2012-07-06 | 2014-01-22 | 日东电工株式会社 | 半导体装置用胶粘剂组合物、半导体装置用胶粘薄膜、带有切割薄膜的胶粘薄膜、半导体装置的制造方法以及半导体装置 |
| CN102994009A (zh) * | 2012-11-27 | 2013-03-27 | 明尼苏达矿业制造医用器材（上海）有限公司 | 水胶体粘合剂和水胶体敷料 |
| CN104119812A (zh) * | 2013-04-25 | 2014-10-29 | 日东电工株式会社 | 胶粘薄膜、切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107446535A (zh) * | 2017-08-16 | 2017-12-08 | 浙江林境新材料科技有限公司 | 一种复合板 |
| CN110441115A (zh) * | 2019-09-09 | 2019-11-12 | 中国科学院电工研究所 | 一种多层膜x射线波带片的制备方法 |
| CN110441115B (zh) * | 2019-09-09 | 2022-02-22 | 中国科学院电工研究所 | 一种多层膜x射线波带片的制备方法 |
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| Publication number | Publication date |
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| KR20160135654A (ko) | 2016-11-28 |
| JP2016216562A (ja) | 2016-12-22 |
| JP6603479B2 (ja) | 2019-11-06 |
| TW201714996A (zh) | 2017-05-01 |
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