CN106165076A - 打线装置以及半导体装置的制造方法 - Google Patents

打线装置以及半导体装置的制造方法 Download PDF

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CN106165076A
CN106165076A CN201580019290.7A CN201580019290A CN106165076A CN 106165076 A CN106165076 A CN 106165076A CN 201580019290 A CN201580019290 A CN 201580019290A CN 106165076 A CN106165076 A CN 106165076A
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metal wire
cut
instrument
joint instrument
throwing device
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CN106165076B (zh
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关根直希
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Shinkawa Ltd
Arakawa Co Ltd
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Arakawa Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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    • B23K35/286—Al as the principal constituent
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

打线装置包括：接合工具40，供金属线42插通；控制部80，进行接合工具40的移动处理，以便在接合对象物100的第1接合点与第2接合点之间形成线弧90后切断金属线42；以及监视部70，对通过接合工具40所插通的金属线42与接合对象物100之间供给规定的电信号，基于所供给的电信号的输出，监视金属线42是否已被切断，并且控制部80构成为：基于来自监视部70的监视结果，在判定为金属线42未被切断的期间中，继续进行接合工具40的移动处理，并且在判定为金属线42已被切断时，停止接合工具40的移动处理。由此可实现缩短打线的动作时间以及提高处理效率。

Description

打线装置以及半导体装置的制造方法
技术领域
本发明涉及一种打线装置以及半导体装置的制造方法。
背景技术
在制造半导体装置的情况下，例如广泛使用打线(wire bonding)，所述打线是利用金属线(wire)将半导体芯片(chip)的电极与基板的电极电性连接。作为打线方法的一实施方式，已知有楔形接合(wedge bonding)方式，所述楔形接合方式是不在金属线前端形成球(ball)而将金属线连接于接合对象。根据楔形接合方式，在利用金属线将第1接合点与第2接合点之间连接后，通过使接合工具(bonding tool)向平行于接合面的XY方向移动而将金属线切断，由此在接合工具的前端形成线尾(wire tail)。其后，将线尾接合
于第1接合点，以便在不进行球形成处理的情况下进行下一打线(参照专利文献1)。
从前，用以切断金属线的接合工具的移动处理是通过作业人员事先设定参数(parameter)(移动距离)而进行，但为了防止产生金属线的切断不良，通常过多地确保移动距离而进行设定。因此，存在如下情况，即，也有时尽管实际上已将金属线切断，但仍使接合工具过多地移动，相应地耗费打线装置的动作时间。而且，在打线中，除所述以外，还需要设定各种多个参数，因此应事先设定的参数越少越佳。
现有技术文献
专利文献
专利文献1：日本专利特开2003-318216号公报
发明内容
发明所要解决的问题
因此，本发明的目的在于提供一种能够解决所述问题的打线装置以及半导体装置的制造方法。
解决问题的技术手段
本发明的一实施方式的打线装置包括：接合工具，供金属线插通；控制部，进行接合工具的移动处理，以便在接合对象物的第1接合点与第2接合点之间形成线弧(wireloop)后将金属线切断；以及监视部，对通过接合工具所插通的金属线与接合对象物之间供给规定的电信号，并基于所供给的电信号的输出，监视金属线是否已被切断；并且控制部构成为：基于来自监视部的监视结果，在判定为金属线未被切断的期间中，继续进行接合工具的移动处理，并且在判定为金属线已被切断时，停止接合工具的移动处理。
根据所述构成，基于对金属线与接合对象物之间供给的电信号的输出，监视金属线是否已被切断，基于所述监视结果，在判定为金属线已被切断时，停止用以切断金属线的接合工具的移动处理。因此，例如可在切断金属线的同时结束接合工具的移动处理，并且迅速移行至下一移动处理，从而可实现缩短打线的动作时间。而且，由于可使金属线的切断处理自动化，故而可使伴随打线的参数设定简化。由此可提高打线的处理效率。
在所述打线装置中，也可为，规定的电信号为交流电信号。
在所述打线装置中，也可为，所供给的电信号的输出是和金属线与接合对象物之间的电容相关的输出，并且监视部构成为：基于和电容相关的输出与规定阈值的比较，判定金属线是否已被切断。
在所述打线装置中，也可构成为：监视部在开始用以切断金属线的接合工具的移动处理之前，判定为金属线已被切断时，示出金属线的切断为异常。
在所述打线装置中，也可为，对接合对象物所进行的打线为楔形接合方式。
在所述打线装置中，也可为，接合工具的用以切断金属线的移动处理包括使在平行于接合面的方向上移动。
在所述打线装置中，也可为，控制部构成为：在通过监视部判定为金属线已被切断时，停止接合工具的用以切断金属线的移动处理，并且使接合工具在垂直于接合面的方向上移动。
在所述打线装置中，也可为，金属线为铝金属线。
本发明的一实施方式的半导体装置的制造方法包括：通过接合工具在接合对象物的第1接合点与第2接合点之间形成线弧后，将金属线切断，且包括：对通过接合工具所插通的金属线与接合对象物之间供给规定的电信号，基于所供给的电信号的输出，监视金属线是否已被切断；将金属线切断的步骤包括：基于监视结果，在判定为金属线未被切断的期间中，继续进行接合工具的用以切断金属线的移动处理，并且在判定为金属线已被切断时，停止接合工具的移动处理。
根据所述构成，基于对金属线与接合对象物之间供给的电信号的输出，监视金属线是否已被切断，基于所述监视结果，在判定为金属线已被切断时，停止用以切断金属线的接合工具的移动处理。因此，例如可在切断金属线的同时结束接合工具的移动处理，并且迅速移行至下一移动处理，从而可实现缩短打线的动作时间。而且，由于可使金属线的切断处理自动化，故而可使伴随打线的参数设定简化。因此，可提高打线的处理效率。
发明的效果
根据本发明，可实现缩短打线的动作时间以及提高处理效率。
附图说明
图1是表示本实施方式的打线装置的图。
图2(A)及图2(B)是本实施方式的打线装置的接合臂(bonding arm)的平面中的俯视图及仰视图。
图3是本实施方式的半导体装置的制造方法的流程图(flow chart)。
图4(A)及图4(B)是用以说明本实施方式的半导体装置的制造方法的图，而且也是表示本实施方式的监视部的构成的一例的图。
图5是与本实施方式的半导体装置的制造方法相关的时序图(timingchart)。
图6是与本实施方式的半导体装置的制造方法相关的时序图。
具体实施方式
以下，对本发明的实施方式进行说明。在以下的图式的记载中，相同或类似的构成要素由相同或类似的符号表示。图式为例示，各部分的尺寸或形状为示意性，不应将本申请发明的技术范围限定于所述实施方式进行解释。
图1是表示本实施方式的打线装置的图，图2是打线装置中的接合臂的局部放大图，图2(A)是接合臂的俯视图，图2(B)是接合臂的仰视图。
如图1所示，打线装置1包括XY驱动机构10、Z驱动机构12、接合臂20、超声波焊头(ultrasonic horn)30、接合工具40、负荷传感器(sensor)50、超声波振动元件60、监视部70以及控制部80。
XY驱动机构10构成为可在XY轴方向(平行于接合面的方向)上移动，在XY驱动机构(线性马达(linear motor))10设置有Z驱动机构(线性马达)12，所述Z驱动机构使接合臂20可在Z轴方向(垂直于接合面的方向)上移动。
接合臂20由支轴14支持，并且相对于XY驱动机构10而摆动自如地构成。接合臂20以自XY驱动机构10向放置有接合对象物100的接合台(bonding stage)16延伸出的方式而呈大致长方体地形成。接合臂20包括：臂基端部22，安装于XY驱动机构10；臂前端部24，位于臂基端部22的前端侧，且安装有超声波焊头30；以及连结部23，将臂基端部22与臂前端部24连结，并且具有可挠性。所述连结部23包括自接合臂20的顶面21a向底面21b的方向延伸出的规定宽度的狭缝(slit)25a、狭缝25b、以及自接合臂20的底面21b向顶面21a的方向延伸出的规定宽度的狭缝25c。如此，连结部23因各狭缝25a、狭缝25b、狭缝25c而局部地作为薄壁部构成，故而臂前端部24以相对于臂基端部22弯曲的方式构成。
如图1及图2(B)所示，在接合臂20的底面21b侧，形成有收容超声波焊头30的凹部26。超声波焊头30以收容于接合臂20的凹部26的状态，通过焊头固定螺钉32而安装于臂前端部24。所述超声波焊头30在自凹部26突出的前端部保持接合工具40，在凹部26设置有产生超声波振动的超声波振动元件60。通过超声波振动元件60而产生超声波振动，并且通过超声波焊头30将所述超声波振动传递至接合工具40，而可经由接合工具40对接合对象赋予超声波振动。超声波振动元件60例如为压电式振动元件(piezoelectric vibrator)。
而且，如图1及图2(A)所示，在接合20的顶面21a侧，自顶面21a朝向底面21b依序形成有狭缝25a及狭缝25b。上部的狭缝25a形成得较下部的狭缝25b更宽。并且，在所述形成得更宽的上部的狭缝25a设置有负荷传感器50。负荷传感器50通过施压用螺钉52而固定于臂前端部24。负荷传感器50以夹入臂基端部22与臂前端部24之间的方式配置。即，负荷传感器50自超声波焊头30的长度方向的中心轴向相对于接合对象接近/远离的方向偏移(offset)，而安装于接合臂20的旋转中心与臂前端部24的超声波焊头30的安装面(即臂前端部24的接合工具40侧的前端面)之间。并且，如上所述，保持接合工具40的超声波焊头30安装于臂前端部24，故而若通过来自接合对象的反作用力对接合工具40的前端施加负荷，则臂前端部24相对于臂基端部22弯曲，从而在负荷传感器50中可检测出负荷。负荷传感器50例如为压电式负荷传感器。
接合工具40用以供金属线42插通，例如为设置有插通孔41的毛细管(capillary)(参照图4(A))。在所述情况下，构成为在接合工具40的插通孔41中插通有用于接合的金属线42，可自插通孔41的前端抽出金属线42的一部分。而且，在接合工具40的前端设置有用以按压金属线42的按压部47(参照图4(A))。按压部47具有绕接合工具40的插通孔41的轴向旋转对称的形状，并且在插通孔41周围的下表面具有按压面48。
接合工具40通过弹簧力等可更换地安装于超声波焊头30。而且，在接合工具40的上方设置线夹(wire clamper)44，线夹44以在规定的时序将金属线42束紧或释放的方式构成。在线夹44的更上方设置线张力器(wire tensioner)46，线张力器46以如下方式构成，即，供金属线42插通，并且对接合中的金属线42赋予适度的张力(tension)。
金属线42的材料自容易加工与电阻低等方面适当选择，例如使用金(Au)、铝(Al)、铜(Cu)或银(Ag)等。另外，金属线42自接合工具40的前端延伸出的一部分43接合于第1接合点。
监视部70在打线步骤的规定期间，监视通过接合工具40所插通的金属线42的状态。具体而言，监视部70对金属线42与接合对象物100之间供给规定的电信号，基于所述所供给的电信号的输出，监视金属线42是否已被切断。
此处，如图4(A)及图4(B)所示，监视部70包含电源供给部72、测定部74、以及判定部74，监视部70的其中一个端子电性连接于接合台16，另一个端子电性连接于线夹44(或线轴(wire spool)(未图示))。电源供给部72以对金属线42与接合对象物100之间供给规定的电信号的方式构成，测定部74以测定所供给的电信号的输出的方式构成。并且，判定部76以基于所述输出判定金属线42的状态(金属线是否已被切断)的方式构成。例如，在电源供给部72的电源为交流电压电源的情况下，通过测定部74内部的阻抗(impedance)测定电路(未图示)而测定阻抗值，由此检测出金属线42与接合台16之间的电容分量，判定部76基于与所述电容分量相关的输出，判定金属线42是否已被切断。另外，所述输出也可为电容值其本身。在所述情况下，判定部76也可将作为输出的电容值与规定阈值进行比较，例如当电容值为规定阈值以上时判定金属线42未被切断，当电容值小于规定阈值时判定金属线42已被切断。或者，与电容分量相关的输出也可为对电容值进行运算所得的值。例如，判定部76例如也可基于伴随电容值的时间变化的微分值，判定金属线42是否已被切断。
在成为金属线42未电性连接于接合对象物100的状态时，金属线42与接合台16之间的电容分量变得与打线装置1的要素的电容值(打线装置电容值)相等。相对于此，在成为金属线42电性连接于接合对象物100(例如半导体芯片110及基板120两者)的状态时，金属线42与接合台16之间的电容分量成为所述打线装置电容值与接合对象物100的电容值(半导体装置电容值)的合计值。如此，监视部70可基于与通过接合工具40所插通的金属线42与接合台16之间的电容分量相关的输出，判定或监视在接合对象物100的第1接合点与第2接合点之间形成线弧后金属线42是否已被切断。
返回至图1，控制部80连接于XY驱动机构10、Z驱动机构12、超声波焊头30(超声波振动元件60)、负荷传感器50以及监视部70，通过控制部80控制这些构成的动作，由此可进行用以打线的必要处理。控制部80包括界面(interface)(未图示)，所述界面在与例如XY驱动机构10、Z驱动机构12、负荷传感器50、超声波焊头30(超声波振动元件60)、线夹44、负荷传感器50以及监视部70等各构成之间收发信号。具体而言，控制部80进行控制接合工具40的XYZ轴方向的移动距离或Z方向的负荷、线夹44的开闭动作、对接合工具40赋予超声波振动的时序或时间及刮擦(scrub)动作的控制等与接合工具的动作相关的控制。
而且，在控制部80连接有用以输入控制信息的操作部82、以及用以输出控制信息的显示部84，由此，作业人员可一面通过显示部84识别画面，一面通过操作部82输入所需的控制信息。另外，控制部80是包括中央处理器(Central Processing Unit，CPU)以及存储器(memory)等的计算机(computer)装置，在存储器中预先存储用以进行打线所需处理的接合程序(bonding program)等。控制部80以如下方式构成，即，进行后述半导体装置的制造方法中所说明的用以控制接合工具40的动作的各步骤(例如包括用以使计算机执行各步骤的程序)。
其次，参照图3～图6，对本实施方式的半导体装置的制造方法进行说明。所述半导体装置的制造方法包括使用所述打线装置1进行的打线方法。而且，本实施方式的打线为楔形接合方式。
此处，图3是半导体装置的制造方法的流程图，图4(A)及图4(B)是表示打线处理的图。而且，图5及图6是与半导体装置的制造方法相关的时序图。另外，图4(A)所示的XYZ轴的朝向也同样适用于图4(B)以及图5及图6中。
首先，在接合台16上准备接合对象物100。
如图1所示，接合对象物100具有通过本实施方式的半导体装置的制造方法而电性连接的第1接合点及第2接合点。此处，所谓第1接合点是指利用金属线而连接的两点间中的最初接合的部位，所谓第2接合点是指所述两点间中的后续接合的部位。
接合对象物100是包含至少一个半导体芯片的半导体装置，并且例如图1所示，包括具有作为第1接合点的多个电极112的半导体芯片110、以及具有作为第2接合点的多个电极122的基板120。在半导体芯片110的电极112的形成面(形成有半导体元件的一侧的表面)形成有作为保护膜的钝化(passivation)(未图示)，多个电极112分别自钝化114的开口部露出。半导体芯片110搭载于基板120上。在此种实施方式中，通常将以自半导体芯片110的电极112至基板120的电极122的顺序进行接合的情况称为正接合，在以下的例子中，对正接合的例子进行说明，但本实施方式的打线也可应用于以自基板120的电极122至半导体芯片110的电极112的顺序进行接合的所谓逆接合。
<时刻t0～时刻t5的处理>
如图3所示，通过金属线连接作为第1接合点的半导体芯片110的电极112与作为第2接合点的基板120的电极122(S10)。即，如图5所示，进行第1接合处理(时刻t0～时刻t2)、成弧(looping)处理(时刻t2～时刻t4)以及第2接合处理(时刻t4～时刻t5)的各处理。
具体而言，首先，如图5所示，自时刻t0至时刻t1使Z驱动机构12运作，由此使接合工具40自高度Z0下降至Z1，并且自时刻t1至时刻t2对接合工具40进行加压。此时，通过接合工具40的按压部47(按压面48)(参照图4(A))对金属线42的一部分进行加压，并且产生热、超声波及进行刮擦动作，由此将金属线42与电极112接合。
继而，自时刻t2至时刻t3使XY驱动机构10及Z驱动机构12适当运作，由此一面抽出金属线42一面使接合工具40沿着规定的轨迹移动，而使金属线42成弧。在时刻t3时，将接合工具40配置于第2接合点的上方，其后，自时刻t3至时刻t4使Z驱动机构12运作，由此使接合工具下降至高度Z2。另外，自时刻t1至时刻t3，线夹44成为打开的状态。
其后，自时刻t3至时刻t4，对接合工具40进行加压。此时，与第1接合点中的接合同样地，通过接合工具40的按压部47(按压面48)(参照图4A)对金属线42的一部分加压，并且产生热、超声波及进行刮擦动作，由此将金属线42与电极112接合。
如此，如图4(A)所示，在作为第1接合点的电极112与作为第2接合点的电极122之间，形成连接两者的线弧90。另外，图4(A)是与时刻t5对应的图。
<时刻t5～时刻t8的处理(金属线切断处理)>
在结束第2接合点处的接合后，一面抽出金属线42一面使接合工具40上升(S11)，其后，开始进行用以切断金属线的工具的移动处理(S12)。例如，如图5所示，在时刻t5，使Z驱动机构12运作而使接合工具40上升，继而使XY驱动机构10运作而使接合工具40向远离线弧90的方向(Y方向)移动。其间，如图5所示，线夹44成为打开的状态。如此，根据接合工具40的移动量自接合工具40的前端仅抽出规定量的金属线42，而在接合工具40的前端与第2接合点之间延伸出规定长度的金属线42。
其后，继续进行用以切断金属线42的接合工具40的移动处理(S13)。例如，如图5所示，通过使XY驱动机构10进一步运作，而使接合工具40向远离线弧90的方向移动。如此，在自时刻t5至时刻t6期间(XY驱动机构10的运作期间)，对金属线42施加拉伸应力。此时，如图5所示，通过在自时刻t5至时刻t6之间的任一时序将线夹44设为关闭状态，可通过金属线42施加大的拉伸应力。
在本实施方式中，在所述金属线切断处理期间，通过监视部70监视金属线是否已被切断(S14)。具体而言，监视部70在时刻t5以后，对金属线42与接合对象物100之间供给规定的电信号，基于所供给的电信号的输出，判定或监视金属线42是否已被切断。电信号在时间上被连续供给，并且基于针对所述信号的连续应答的输出而进行监视。
在所供给的电信号为交流电信号的情况下，例如可测定金属线42与接合台16之间的电容分量作为监视输出。在金属线42与接合对象物100电性连接的状态下，金属线42与接合台16之间的电容分量成为打线装置电容值与接合对象物100的电容值(半导体装置电容值)的合计值，故而如图6所示，自时刻t4至时刻t7，监视输出成为高电平(high level)。并且，在时刻t7，若金属线42因施加至金属线42的拉伸应力而被切断，则电容分量下降至打线装置电容值，故而在时刻t7以后，监视输出成为低电平(low level)。如此，监视部70(判定部76)在监视输出维持于高电平期间，判定金属线42未被切断，另一方面，在金属线42转变为低电平时，判定金属线42已被切断。另外，此种判定可通过与规定阈值(例如高电平与低电平的中间值)进行比较而进行。
控制部80白监视部70接收基于此种监视结果的信号，并且基于所述监视结果，控制与接合工具的移动处理相关的动作。
具体而言，在通过监视部70判定为金属线42未被切断的情况下，控制部80继续进行用以切断金属线42的接合工具40的移动处理(图3所示的S14的否(No)及S13)。即，如图5及图6所示，继续进行通过XY驱动机构12进行的接合工具40的移动处理。另外，反复进行图3所示的S13及S14的一连串的处理，直至判定为金属线42已被切断为止。
另一方面，在通过监视部70判定为金属线42已被切断的情况下，控制部80停止用以切断金属线42的接合工具40的移动处理(图3所示的S14的是(Yes)及S15)。即，如图5及图6所示，在时刻t7，停止通过XY驱动机构12进行的接合工具40的移动处理。其后，如图3所示，作为其后应进行的处理，例如使Z驱动机构10运作，而使接合工具40在垂直于接合面的方向上上升至高度Z3(S16)。另外，图4(B)是与时刻t7对应的图。
另外，也可构成为，在监视部70在开始用以切断金属线42的接合工具40的移动处理前判定为金属线42已被切断时，监视部70或控制部80示出金属线42的切断为异常。例如，若自时刻t5至时刻t6在一面抽出金属线42一面会在使接合工具40上升期间切断金属线42，则在接合工具的前端无法抽出规定长度的金属线42，故而可视为此种金属线42的切断为异常。在所述情况下，当监视部70判定为在所述时序金属线42已被切断时，控制部80也可将表示所述情况的主旨显示于例如显示部84的画面。
如此，将金属线42的一部分切断，而如图4(B)所示那样在接合工具40的前端形成线尾43。由于通过使接合工具40在平行于接合面的方向上移动而将金属线42切断，故而线尾43依照接合工具40的移动方向而成为向与Z方向交叉的方向弯曲的形状。例如，也可使接合工具40在连结第1接合点与第2接合点的Y方向的直线上移动，而使线尾43以成为向Y方向弯曲的形状的方式延伸出。
如此，如图4(B)所示，可形成呈规定形状延伸出的线弧130，以将第1接合点与第2接合点之间连接。线弧130包括作为第1接合点的电极112上的第1接合部132、以及作为第2接合点的电极122上的接合部134。
<时刻t8以后的处理>
在使接合工具40上升至Z3后，如图3所示那样，判定是否需要对接合对象物100进行下一打线(S17)，在需要进行下一打线的情况下(S17为是(Yes))，使接合工具40向用于下一打线的第1接合点移动，而将线尾43接合于第1接合点，并且重复进行S10～S16的一连串的步骤。另一方面，在无须进行下一打线而完全结束对于接合对象物100的打线的情况下(S17为否(No))，结束对于所述接合对象物100的打线步骤。
如以上所述那样，根据本实施方式，基于对金属线42与接合对象物100之间供给的电信号的输出，监视金属线是否已被切断，在基于所述监视结果而判定为金属线已被切断时，停止用以切断金属线的接合工具的移动处理。因此，例如可在切断金属线42的同时结束接合工具40的移动处理，并且迅速移行至下一移动处理，从而可实现缩短打线的动作时间。而且，由于可使金属线42的切断处理自动化，故而可使伴随打线的参数设定简化。因此，可提高打线的处理效率。
本发明并不限定于所述实施方式，可进行各种变形而应用。
在所述实施方式中，虽将通过监视部70来监视金属线状态的期间设为时刻t5～时刻t7，但并不限于此，例如可为开始使XY驱动机构12运作的时刻t6～时刻t7，或者也可设为打线步骤的整个期间。而且，用以切断金属线的接合工具40的移动处理也可使XY驱动机构10及Z驱动机构12两者运作。另外，图5或图6的时序图为一例，本发明并不限于所述例。
而且，接合工具40向XYZ方向的移动并不限定于由所述实施方式的例子所示的构成，例如也可包含不仅描绘直线轨道且描绘曲线轨道的处理。而且，接合工具40的形状也不限定于图示的形状。
而且，在所述实施方式中，对监视部70供给交流电信号的例子进行了说明，但并不限于此，也可供给直流脉冲(pulse)电信号。在所述情况下，也可为，电源供给部72供给直流脉冲电源，测定部74测定金属线42与接合台16之间的电压值。即，也可为，通过读取取决于金属线42是否电性连接于接合对象物100的电压值的变化，判定或监视金属线42是否已被切断。
通过所述发明的实施方式所说明的实施例或应用例可根据用途而适当组合，或者加以变更或改良而使用，本发明并不限定于所述实施方式的记载。根据权利要求书的记载可明确：此种组合或者加以变更或改良而成的实施方式也包含在本发明的技术范围内。
符号的说明
1：打线装置
40：接合工具(毛细管)
42：金属线
70：监视部
80：控制部

Claims (9)

1.一种打线装置，包括：
接合工具，供金属线插通；
控制部，进行所述接合工具的移动处理，以便在接合对象物的第1接合点与第2接合点之间形成线弧后将金属线切断；以及
监视部，对通过所述接合工具所插通的金属线与所述接合对象物之间供给规定的电信号，基于所述所供给的电信号的输出，监视所述金属线是否已被切断，且
所述控制部构成为：基于来自所述监视部的监视结果，在判定为所述金属线未被切断的期间中，继续进行所述接合工具的所述移动处理，并且在判定为所述金属线已被切断时，停止所述接合工具的所述移动处理。
2.根据权利要求1所述的打线装置，其中所述规定的电信号为交流电信号或直流脉冲信号。
3.根据权利要求2所述的打线装置，其中所述所供给的电信号的输出是和所述金属线与所述接合对象物之间的电容相关的输出，并且
所述监视部构成为：基于和所述电容相关的输出与规定阈值的比较，判定所述金属线是否已被切断。
4.根据权利要求1所述的打线装置，构成为：所述监视部在开始用以切断所述金属线的所述接合工具的移动处理之前，判定为所述金属线已被切断时，示出所述金属线的切断为异常。
5.根据权利要求1所述的打线装置，其中对所述接合对象物所进行的打线为楔形接合方式。
6.根据权利要求1所述的打线装置，其中所述接合工具的用以切断金属线的移动处理包括使在平行于接合面的方向上移动。
7.根据权利要求1所述的打线装置，其中所述控制部构成为：在通过所述监视部判定为所述金属线已被切断时，停止所述接合工具的用以切断金属线的移动处理，并且使所述接合工具在垂直于接合面的方向上移动。
8.根据权利要求1所述的打线装置，其中所述金属线为铝金属线。
9.一种半导体装置的制造方法，包括：通过接合工具在接合对象物的第1接合点与第2接合点之间形成线弧后，将金属线切断，且
所述半导体装置的制造方法包括：对通过所述接合工具所插通的金属线与所述接合对象物之间供给规定的电信号，基于所述所供给的电信号的输出，监视所述金属线是否已被切断，
将所述金属线切断的步骤包括：基于所述监视结果，在判定为所述金属线未被切断的期间中，继续进行所述接合工具的用以切断所述金属线的移动处理，并且在判定为所述金属线已被切断时，停止所述接合工具的所述移动处理。
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