CN106233444B - 半导体装置的制造方法以及打线装置 - Google Patents

半导体装置的制造方法以及打线装置 Download PDF

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Publication number
CN106233444B
CN106233444B CN201580017569.1A CN201580017569A CN106233444B CN 106233444 B CN106233444 B CN 106233444B CN 201580017569 A CN201580017569 A CN 201580017569A CN 106233444 B CN106233444 B CN 106233444B
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junction
bonding tool
line tail
bank
semiconductor device
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CN106233444A (zh
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关根直希
中泽基树
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Arakawa Co Ltd
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Arakawa Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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Abstract

本发明涉及一种半导体装置的制造方法以及打线装置。半导体装置的制造方法包括：线尾形成步骤，利用接合工具(40)在第1接合点与第2接合点之间形成线弧(130)之后，将自接合工具(40)的前端延伸出的金属线(42)的一部分切断，而在接合工具(40)的前端形成线尾(43)；以及线尾弯曲步骤，使接合工具(40)朝向形成有线弧(130)的第2接合点下降，将线尾(43)压抵于第2接合点上的线弧(130)的一部分，由此以使线尾(43)的前端(43a)朝向上方的方式对线尾(43)进行弯曲加工。由此简便且有效率地进行线尾的弯曲加工。

Description

半导体装置的制造方法以及打线装置
技术领域
本发明涉及一种半导体装置的制造方法以及打线(wire bonding)装置。
背景技术
当制造半导体装置时，例如广泛采用打线，利用金属线(wire)将半导体芯片(chip)的电极与基板的电极电性连接。作为半导体装置的制造方法的一实施方式，已知有楔形接合(wedge bonding)方式，不在金属线前端形成球(ball)而将金属线连接于接合对象。根据楔形接合方式，利用金属线将第1接合点与第2接合点之间连接之后，将自接合工具(bonding tool)的前端延伸出的金属线的一部分切断，在接合工具的前端形成用于下次打线的线尾(wire tail)，且不进行球形成步骤而将所述线尾直接接合于下次第1接合点。
然而，例如当将第1接合点设为半导体芯片的电极时，有如下情况：接合于第1接合点之后的线尾的前端会接触于半导体芯片上的邻接的电极或钝化膜(passivation film)，由此会导致半导体芯片损伤或不良。
为了解决此种问题，例如专利文献1所记载般有如下方法，即，与接合对象物不同地另外准备用于将线尾的前端向上方弯曲的构件(模具)，在进行向第1接合点的接合之前使接合工具移动至所述构件上而调整线尾的形状。然而，需要在每次进行打线时均使接合工具移动至远离接合对象物的位置，从而难以说得上是简便且有效率的制造方法。或者，鉴于此种问题仅可产生在第1接合点，而也考虑通过使接合顺序颠倒的逆接合来解决，但接合顺序会受到制约，无法说得上是半导体装置的制造方法的设计自由度为高。
现有技术文献
专利文献
专利文献1：日本专利特开2003-318216号公报
发明内容
发明所要解决的问题
因此，本发明的目的在于提供一种可解决所述问题的半导体装置的制造方法以及打线装置。
解决问题的技术手段
本发明的一实施方式的半导体装置的制造方法包括：线尾形成步骤，利用接合工具在第1接合点与第2接合点之间形成线弧(wire loop)之后，将自接合工具的前端延伸出的金属线的一部分切断，而在接合工具的前端形成线尾；以及线尾弯曲步骤，使接合工具朝形成有线弧的第2接合点下降，将线尾压抵于第2接合点上的线弧的一部分，由此以使线尾的前端朝向上方的方式对线尾进行弯曲加工。
根据所述构成，通过使接合工具朝向接合完成的形成有线弧的第2接合点下降，将线尾压抵于第2接合点上的线弧的一部分，而进行线尾的弯曲加工。由此抑制接合工具的移动量，并且无需准备用于弯曲加工的另外的构件，因此可简便且有效率地进行线尾的弯曲加工。由此例如在下一打线的第1接合点处的接合中，可防止金属线的前端接触于其他邻接的要素，从而防止半导体装置发生损伤或者不良，并且可进行设计自由度高、简便且有效率的半导体装置的制造方法。
在所述半导体装置的制造方法中，也可在线尾弯曲步骤中，将线尾压抵于刚接合完成的第2接合点上的线弧的一部分。
在所述半导体装置的制造方法中，也可在线尾弯曲步骤中，将线尾压抵于第2接合点上的线弧的前端。
在所述半导体装置的制造方法中，也可在线尾弯曲步骤中，将线尾压抵于第2接合点上的线弧的立起部。
在所述半导体装置的制造方法中，也可在线尾形成步骤中，一面将金属线抽出，一面使接合工具上升，且使接合工具向远离线弧的方向移动，由此将金属线的一部分切断。
本发明的一实施方式的打线装置是用于利用接合工具在第1接合点与第2接合点之间形成线弧的打线装置，且包括控制部，对接合工具的动作进行控制，控制部构成为执行以下步骤：将自接合工具的前端延伸出的金属线的一部分切断，而在接合工具的前端形成线尾的步骤；以及使接合工具朝向形成有线弧的第2接合点下降，将线尾压抵于第2接合点上的线弧的一部分，由此以使线尾的前端朝向上方的方式对所述线尾进行弯曲加工的步骤。
根据所述构成，打线装置的控制部构成为通过使接合工具朝向接合完成的形成有线弧的第2接合点下降，将线尾压抵于第2接合点上的线弧的一部分，而进行线尾的弯曲加工。由此抑制接合工具的移动量，并且无需准备用于弯曲加工的另外的构件，因此可提供能够简便且有效率地进行线尾的弯曲加工的打线装置。由此例如在下一打线的第1接合点处的接合中，可防止金属线的前端接触于其他邻接的要素，从而可提供防止半导体装置发生损伤或者不良，并且能够进行设计自由度高、简便且有效率的处理的打线装置。
发明的效果
根据本发明，可简便且有效率地进行打线中的线尾的弯曲加工。由此可提供防止半导体装置发生损伤或者不良，并且能够进行设计自由度高、简便且有效率的处理的半导体装置的制造方法以及打线装置。
附图说明
图1是表示本实施方式的打线装置的图。
图2(A)及图2(B)是本实施方式的打线装置的接合臂(bonding arm)的平面的俯视图及仰视图。
图3是本实施方式的半导体装置的制造方法的流程图(flow chart)。
图4(A)～图4(C)是用于对本实施方式的半导体装置的制造方法进行说明的图。
图5(A)～图5(D)是用于对本实施方式的半导体装置的制造方法进行说明的图。
图6是与本实施方式的半导体装置的制造方法相关的时序图(timing chart)。
图7是用于对本实施方式的变形例的半导体装置的制造方法进行说明的图。
符号的说明：
1：打线装置；
40：接合工具(毛细管)；
42：金属线；
43：线尾；
43a：线尾的前端；
80：控制部；
130：线弧；
135：线弧的前端；
136：线弧的立起部。
具体实施方式
以下，对本发明的实施方式进行说明。在以下的附图的记载中，相同或类似的构成要素以相同或类似的符号表示。附图为例示，各部分的尺寸或形状为示意性，不应将本申请发明的技术范围限定于所述实施方式而解释。
图1是表示本实施方式的打线装置的图，图2(A)及图2(B)是打线装置中的接合臂的局部放大图，图2(A)是接合臂的俯视图，图2(B)是接合臂的仰视图。
如图1所示，打线装置1包括XY驱动机构10、Z驱动机构12、接合臂20、超声波焊头(ultrasonic horn)30、接合工具40、负荷传感器(sensor)50、超声波振动元件60以及控制部80。
XY驱动机构10构成为能够沿XY轴方向(平面方向)移动，在XY驱动机构(线性马达(linear motor))10设置有Z驱动机构(线性马达)12，所述Z驱动机构12使接合臂20能够沿Z轴方向(上下方向)移动。
接合臂20由支轴14支撑，相对于XY驱动机构10而摆动自如地构成。接合臂20是以自XY驱动机构10向放置有接合对象物100的接合台(bonding stage)16延伸出的方式而呈大致长方体地形成。接合臂20包括：臂基端部22，安装于XY驱动机构10；臂前端部24，位于臂基端部22的前端侧，且安装有超声波焊头30；以及连结部23，将臂基端部22与臂前端部24连结，且具有可挠性。所述连结部23包括：规定宽度的狭缝(slit)25a、狭缝25b，自接合臂20的顶面21a向底面21b的方向延伸出；以及规定宽度的狭缝25c，自接合臂20的底面21b向顶面21a的方向延伸出。如此，连结部23利用各狭缝25a、狭缝25b、狭缝25c而局部地作为薄壁部构成，因此，臂前端部24是以相对于臂基端部22而挠曲的方式构成。
如图1及图2(B)所示，在接合臂20的底面21b侧，形成有收容超声波焊头30的凹部26。超声波焊头30在收容于接合臂20的凹部26的状态下，利用焊头固定螺钉32而安装于臂前端部24。所述超声波焊头30在自凹部26突出的前端部保持有接合工具40，且在凹部26内设置有产生超声波振动的超声波振动元件60。利用超声波振动元件60而产生超声波振动，所述超声波振动利用超声波焊头30而传递至接合工具40，从而可经由接合工具40对接合对象赋予超声波振动。超声波振动元件60例如为压电式(piezo)振动元件。
另外，如图1及图2(A)所示，在接合臂20的顶面21a侧，自顶面21a朝底面21b依序形成有狭缝25a及狭缝25b。上部的狭缝25a较下部的狭缝25b更宽地形成。而且，在所述较宽地形成的上部的狭缝25a，设置有负荷传感器50。负荷传感器50利用施压用螺钉52而固定于臂前端部24。负荷传感器50以夹入的方式配置于臂基端部22与臂前端部24之间。即，负荷传感器50自超声波焊头30的长度方向的中心轴向相对于接合对象接近/远离的方向偏移(offset)，且安装于接合臂20的旋转中心与臂前端部24的超声波焊头30的安装面(即，臂前端部24的接合工具40侧的前端面)之间。而且，如上所述，保持接合工具40的超声波焊头30安装于臂前端部24，因此，若利用来自接合对象的反作用力对接合工具40的前端施加负荷，则臂前端部24会相对于臂基端部22而挠曲，从而在负荷传感器50能够检测出负荷。负荷传感器50例如为压电式负荷传感器。
接合工具40用于引导金属线42，例如为设置有插通孔41的毛细管(capillary)(参照图4(A))。此时，在接合工具40的插通孔41中插通有用于接合的金属线42，且构成为能够将金属线42的一部分自所述接合工具40的前端抽出。而且，在接合工具40的前端，设置有用于对金属线42进行按压的按压部47(参照图4(A))。按压部47具有绕接合工具40的插通孔41的轴方向为旋转对称的形状，且在插通孔41的周围的下表面具有按压面48。
接合工具40利用弹簧力等而能够更换地安装于超声波焊头30。而且，在接合工具40的上方设置有线夹(wire clamper)44，线夹44构成为在规定的时序将金属线42束紧或释放。在线夹44的更上方设置有线张紧器(wire tensioner)46，线张紧器46构成为供金属线42插通，且对接合中的金属线42赋予适度的张力。
金属线42的材料自容易加工与电阻低等方面适当选择，例如使用金(Au)、铝(Al)、铜(Cu)或银(Ag)等。再者，金属线42自接合工具40的前端延伸出的一部分43接合于第1接合点。
回到图1，控制部80连接于XY驱动机构10、Z驱动机构12、超声波焊头30(超声波振动元件60)以及负荷传感器50，利用控制部80对这些构成的动作进行控制，由此可进行用于打线的必要处理。控制部80包括界面(interface)(未图示)，所述界面在与例如XY驱动机构10、Z驱动机构12、负荷传感器50、超声波焊头30(超声波振动元件60)、线夹44等各构成之间进行信号的收发。具体而言，控制部80进行接合工具40的XYZ轴方向的移动距离或Z方向的负荷的控制、线夹44的开闭动作、对接合工具40赋予的超声波振动的时序或时间以及刮擦(scrub)动作的控制等与接合工具的动作相关的控制。
另外，在控制部80，连接有用于输入控制信息的操作部82、以及用于输出控制信息的显示部84，由此作业者可一面利用显示部84识别画面，一面利用操作部82输入必要的控制信息。再者，控制部80是包括中央处理器(Central Processing Unit，CPU)及存储器(memory)等的计算机(computer)装置，且在存储器中预先存储有用于进行打线所需的处理的接合程序(bonding program)等。控制部80包括用于进行各处理的手段(用于使计算机执行各处理的程序)，所述各处理会在后述的半导体装置的制造方法中进行说明，且是用于对接合工具40的动作进行控制。
接下来，参照图3～图6，对本实施方式的半导体装置的制造方法进行说明。所述半导体装置的制造方法是使用所述打线装置1而进行。
此处，图3是半导体装置的制造方法的流程图，图4(A)～图4(C)及图5(A)～图5(D)表示打线的处理。另外，图6是与半导体装置的制造方法相关的时序图。再者，图4(A)所示的XYZ轴的朝向也同样适用于图4(B)～图4(C)、图5(A)～图5(D)以及图6。
首先，在接合台16上准备接合对象物100。
如图1所示，接合对象物100具有利用本实施方式的半导体装置的制造方法而电性连接的第1接合点与第2接合点。此处，所谓第1接合点是指利用金属线而连接的两点中的最初接合的部位，所谓第2接合点是指所述两点中的后续接合的部位。
接合对象物100是包含至少一个半导体芯片的半导体装置，例如图1所示，包括具有作为第1接合点的多个电极112的半导体芯片110、以及具有作为第2接合点的多个电极122的基板120。在半导体芯片110的电极112的形成面(形成有半导体元件的一侧的表面)，形成有作为保护膜的钝化膜114(图1中省略，参照图5(D))，多个电极112分别自钝化膜114的开口部露出。半导体芯片110搭载于基板120上。此种实施方式中，通常将以自半导体芯片110的电极112至基板120的电极122的顺序接合的情况称为正接合，在以下的例子中对正接合的例子进行说明，但本实施方式的打线也适用于以自基板120的电极122至半导体芯片110的电极112的顺序接合的所谓逆接合。
＜时刻t0以前及时刻t0～时刻t1的处理＞
如图3所示，利用金属线将作为第1接合点的半导体芯片110的电极112与作为第2接合点的基板120的电极122连接(S10)。
具体而言，如图1所示，将自接合工具40的前端延伸出的金属线的一部分(线尾)接合于半导体芯片110的电极112(第1接合点)，然后，一面将金属线自接合工具40的前端抽出，一面使接合工具40沿规定的轨迹移动而移动至基板120的电极122(第2接合点)的上方后，使接合工具40下降。然后，如图6所示，在时刻t0至时刻t1的期间，在闭合线夹44的状态下对接合工具40在高度Z0进行加压，而如图4(A)所示，将金属线42的一部分94接合于基板120的电极122。具体而言，利用接合工具40的按压部47(按压面48)对金属线42的一部分94进行加压，并且产生热、超声波以及进行刮擦动作，由此将金属线与电极接合。如此，在作为第1接合点的电极112与作为第2接合点的电极122之间形成将两者连接的线弧90。
＜时刻t1～时刻t3的处理＞
结束第2接合点处的接合之后，一面将金属线42抽出，一面使接合工具40上升至高度Z1(S11)。例如图6所示，在时刻t1，使Z驱动机构12运作而使接合工具40上升，接下来，使XY驱动机构10运作而使接合工具40向远离线弧90的方向(Y方向)移动。在此期间，如图6所示，线夹44设为打开的状态。如此伴随接合工具40的移动量，将金属线42自接合工具40的前端仅抽出规定量。如此在时刻t2，如图4(B)所示，在接合工具40的前端与第2接合点之间延伸出规定长度的金属线42。
然后，如图3所示，使接合工具40进一步向远离线弧90的方向(Y方向)移动，而将金属线42切断(S12)。具体而言，如图6所示，在时刻t2，在闭合线夹44的状态下使XY驱动机构10进一步运作，由此使接合工具40向远离线弧90的方向移动，然后，使Z驱动机构12运作，在时刻t3，如图4(C)所示，使接合工具40上升至高度Z2。如此，在时刻t2至时刻t3的期间的任一时序，对金属线42施加拉伸应力而将金属线42的一部分切断，在接合工具40的前端形成线尾43。由于通过使接合工具40向远离线弧90的方向移动而将金属线42切断，故而如图4(C)所示，线尾43依照接合工具40的移动方向，而成为向与Z方向交叉的方向弯曲的形状。例如，也可使接合工具40在将第1接合点与第2接合点连结的Y方向的直线上移动，而使线尾43以成为向Y方向弯曲的形状的方式延伸出。另外，金属线42被切断的时序并无特别限定，例如图6所示，可在时刻t2以后XY驱动机构10运作的期间中将金属线42切断，也可在XY驱动机构10的运作停止之后Z驱动机构12运作而使接合工具40上升的期间中将金属线42切断。
通过此种处理，如图4(C)所示，可形成为了将第1接合点与第2接合点之间连接而呈规定形状延伸出的线弧130。线弧130在作为第2接合点的电极122上具有接合部134。接合部134通过接合工具40的接合而以较金属线直径更薄(例如1/3左右)的方式塑性变形。
＜时刻t3～时刻t6的处理＞
在形成线尾43之后，使接合工具40向已接合完成的第2接合点的上方移动(S13)。具体而言，如图6所示，自时刻t3至时刻t4，通过使XY驱动机构10运作而使接合工具40移动，在时刻t4，如图5(A)所示，将线尾43配置于第2接合点的上方。当在基板120上有多个接合完成的第2接合点时，优选为向刚接合完成的第2接合点移动。由此可使接合工具40的移动量成为最小，且线尾43的延伸方向与第2接合点上的线弧130的延伸方向大致相同，因此无需特别调整接合工具40的朝向，而可容易地进行后述的线尾43的弯曲加工。
接下来，如图3所示，将线尾43压抵于第2接合点上的线弧130的一部分(S14)。具体而言，如图6所示，自时刻t4至时刻t5，使Z驱动机构12运作而使接合工具40朝向第2接合点下降，在时刻t5至时刻t6的期间，以将线尾43压抵于线弧130的一部分的方式对接合工具40在高度Z3进行加压。
例如图5(B)所示，也可将线尾43压抵于第2接合点上的线弧130的接合部(缝点(stitch))134(具体而言为接合部134的前端135)。由于第2接合点上的前端135自电极122的表面(或基板120的表面)突起(形成有阶差)，故而通过将线尾43压抵于线弧130的前端135，而能够以前端135为起点，以使线尾43的前端43a朝向上方的方式对线尾43进行弯曲加工。另外，线尾的除前端43a以外的部分43b通过接合工具40的按压部47(按压面48)的按压，而被加工成向与XY平面大致平行的方向延伸出。如此，可将线尾43加工成具有如下形状：具有以自XY平面朝向斜上方的方式延伸出的前端43a，且除所述前端43a以外的部分43b与XY平面大致平行地延伸出。
＜时刻t6～时刻t7以及时刻t7以后的处理＞
然后，如图6所示，自时刻t6至时刻t7，使Z驱动机构12运作而使接合工具40上升至高度Z4(S15)。如此在时刻t7，如图5(C)所示，可形成将第1接合点与第2接合点连接的线弧130，并且在接合工具40的前端形成被弯曲加工成规定形状的线尾43。然后，如图3所示，判定是否需要对接合对象物100进行下次打线(S16)，当需要时(S16是(Yes))，使接合工具40向用于下次打线的第1接合点移动，将线尾43接合于第1接合点，且重复进行S10～S15的一连串的步骤。另一方面，当无需进行下一打线，对接合对象物100的打线全部结束时(S16否(No))，结束对所述接合对象物100的打线步骤。
当进行下次打线时(S16是(Yes))，如图6所示，在时刻t7以后，使XY驱动机构10运作而使接合工具40向下一第1接合点的上方移动。然后，使接合工具40朝向作为第1接合点的半导体芯片110的电极112下降，如图5(D)所示，将自接合工具40的前端延伸出的线尾43接合于电极112。此处，半导体芯片110搭载于基板120上，在半导体芯片110中的电极112的形成面(形成有半导体元件的一侧的表面)，设置有作为保护膜的钝化膜114。而且，线尾43的一部分(除前端以外的部分43b)接合于电极122中的自钝化膜114的开口部露出的区域。由于线尾43的前端43a以自XY平面朝向斜上方的方式延伸出，故而可防止线尾43接触于邻接的其他要素(例如钝化膜114或邻接的其他电极等)。
如上所述，根据本实施方式，通过使接合工具40朝向接合完成的形成有线弧130的第2接合点(电极122)下降，将线尾43压抵于第2接合点上的线弧130的一部分，而进行线尾43的弯曲加工。由此抑制接合工具40的移动量，并且无需准备用于弯曲加工的另外的构件，因此可简便且有效率地进行线尾的弯曲加工。由此例如在下次打线的第1接合点处的接合中，可防止金属线的前端接触于其他邻接的要素，从而防止半导体装置发生损伤或者不良，并且可进行设计自由度高、简便且有效率的处理。
本发明并不限定于所述实施方式，可进行各种变形而应用。
在所述实施方式中，如图5(B)所示，示出将线尾43压抵于第2接合点上的线弧130的(接合部134的)前端135的例子，但本发明并不限于此例。例如图7所示，也可将线尾43压抵于第2接合点上的线弧130的立起部136。由于第2接合点上的立起部136自线弧130的接合部134突起(形成有阶差)，故而以线弧130的立起部136为起点，此时也能够以使线尾43的前端43a朝向上方的方式对线尾43进行弯曲加工。
另外，接合工具40向XYZ方向的移动并不限定于由所述实施方式的例子所示的构成，例如也可包括不仅描绘直线轨道且描绘曲线轨道的处理。另外，接合工具40的形状也不限定于图示者。
通过所述发明的实施方式所说明的实施例或应用例可根据用途而适当组合、或者加以变更或改良而使用，本发明并不限定于所述实施方式的记载。根据权利要求书的记载可知，所述组合而成或者加以变更或改良而成的实施方式也可包含在本发明的技术范围内。

Claims (6)

1.一种半导体装置的制造方法，包括：
线尾形成步骤，利用接合工具在第1接合点与第2接合点之间形成线弧之后，将自所述接合工具的前端延伸出的金属线的一部分切断，而在所述接合工具的前端形成线尾；以及
线尾弯曲步骤，使所述接合工具朝向形成有所述线弧的所述第2接合点下降，将所述线尾压抵于所述第2接合点上的所述线弧的一部分，由此以使所述线尾的前端朝向上方的方式对所述线尾进行弯曲加工。
2.根据权利要求1所述的半导体装置的制造方法，其中在所述线尾弯曲步骤中，将所述线尾压抵于刚接合完成的所述第2接合点上的所述线弧的一部分。
3.根据权利要求1所述的半导体装置的制造方法，其中在所述线尾弯曲步骤中，将所述线尾压抵于所述第2接合点上的所述线弧的前端。
4.根据权利要求1所述的半导体装置的制造方法，其中在所述线尾弯曲步骤中，将所述线尾压抵于所述第2接合点上的所述线弧的立起部。
5.根据权利要求1所述的半导体装置的制造方法，其中在所述线尾形成步骤中，一面将所述金属线抽出，一面使所述接合工具上升，且使所述接合工具向远离所述线弧的方向移动，由此将所述金属线的一部分切断。
6.一种打线装置，用于利用接合工具在第1接合点与第2接合点之间形成线弧，所述打线装置包括：
控制部，对所述接合工具的动作进行控制，且
所述控制部构成为执行以下步骤：
将自所述接合工具的前端延伸出的金属线的一部分切断，而在所述接合工具的前端形成线尾的步骤；以及
使所述接合工具朝向形成有所述线弧的所述第2接合点下降，将所述线尾压抵于所述第2接合点上的所述线弧的一部分，由此以使所述线尾的前端朝向上方的方式对所述线尾进行弯曲加工的步骤。
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