JP4591529B2 - バンプの接合方法およびバンプの接合構造体 - Google Patents
バンプの接合方法およびバンプの接合構造体 Download PDFInfo
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- JP4591529B2 JP4591529B2 JP2008079771A JP2008079771A JP4591529B2 JP 4591529 B2 JP4591529 B2 JP 4591529B2 JP 2008079771 A JP2008079771 A JP 2008079771A JP 2008079771 A JP2008079771 A JP 2008079771A JP 4591529 B2 JP4591529 B2 JP 4591529B2
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- Prior art keywords
- bump
- bumps
- protrusion
- tip
- semiconductor chip
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
- Y10T29/49213—Metal
Description
この突起(40)を設ける際では、突起(40)を保持する治具(K1)上にて、突起(40)をその長さ方向に沿って立たせて、突起(40)を第1のバンプ(31)に対応する位置に配置しておき、治具(K1)上に第1の部材(10)の一面(11)を対向させ、第1のバンプ(31)に突起(40)を転写することにより、突起(40)を第1のバンプ(31)の先端部に取り付け、
その後、突起(40)を第2のバンプ(32)の先端部に突き刺して両バンプ(31、32)の先端部同士を接触させることにより、突起(40)の一端側が第1のバンプ(31)に対して食い込んだ状態で埋設されるとともに、当該突起(40)の他端側が第1のバンプ(31)の内部から両バンプ(31、32)の接触界面を超えて第2のバンプ(32)の内部に食い込んだ状態とされることを特徴とするバンプの接合方法が提供される。
また、本発明のように、第1のバンプ(31)の先端部に突起(40)を設けることにより、第1のバンプ(31)が複数個ある場合でも、各々の第1のバンプ(31)に一括して突起(40)を設けることが可能となる。
図1(a)は、本発明の第1実施形態に係るバンプの接合構造体S1の概略断面図、図1(b)は同接合構造体S1における第1の部材としての第1の半導体チップ10の一面11側の概略平面図、図1(c)は同接合構造体S1における第2の部材としての第2の半導体チップ20の一面21側の概略平面図である。なお、図1(b)、(c)は接合前の各半導体チップ10、20の一面11、21の状態を示す。
本発明の第2実施形態は、上記第1実施形態に比べてバンプ31、32の接合形態および接合方法を変更したものであり、この第1実施形態との相違点を中心に述べる。図3は、本第2実施形態に係るバンプの接合構造体S2の概略断面図である。
なお、上記第1実施形態では、棒状をなす突起40をその長さ方向に沿って治具K1上に立たせ、第1のバンプ31に突起40を食い込ませることによって転写を行ったが、この転写は、第1のバンプ31に突起40を食い込ませなくてもよく、第1のバンプ31と突起40とを圧着させるなどによって行ってもよい。
10 第1の部材としての第1の半導体チップ
11 第1の半導体チップの一面
20 第2の部材としての第2の半導体チップ
21 第2の半導体チップの一面
31 第1のバンプ
32 第2のバンプ
40、41 突起
Claims (3)
- 一面(11)側に当該一面(11)より突出する第1のバンプ(31)を備える第1の部材(10)と、一面(21)側に当該一面(21)より突出する第2のバンプ(32)を備える第2の部材(20)とを用意し、前記両部材(10、20)の前記一面(11、21)同士を対向させ前記両バンプ(31、32)の先端部同士を接触させた状態で、これら両バンプ(31、32)を接合するバンプの接合方法において、
前記第1のバンプ(31)の先端部に、当該先端部より前記第2のバンプ(32)側へ向かって突出し、前記第1および第2のバンプ(31、32)よりも硬い材料よりなり、前記第1および第2のバンプ(31、32)よりも細い棒状の突起(40)を設け、
前記突起(40)を設ける際では、前記突起(40)を保持する治具(K1)上にて、前記突起(40)をその長さ方向に沿って立たせて、前記突起(40)を前記第1のバンプ(31)に対応する位置に配置しておき、前記治具(K1)上に前記第1の部材(10)の前記一面(11)を対向させ、前記第1のバンプ(31)に前記突起(40)を転写することにより、前記突起(40)を前記第1のバンプ(31)の先端部に取り付け、
その後、前記突起(40)を前記第2のバンプ(32)の先端部に突き刺して前記両バンプ(31、32)の先端部同士を接触させることにより、前記突起(40)の一端側が前記第1のバンプ(31)に対して食い込んだ状態で埋設されるとともに、当該突起(40)の他端側が前記第1のバンプ(31)の内部から前記両バンプ(31、32)の接触界面を超えて前記第2のバンプ(32)の内部に食い込んだ状態とされることを特徴とするバンプの接合方法。 - 前記第1のバンプ及び前記第2のバンプは金よりなり、前記突起は鉄鋼又は銅よりなるものであることを特徴とする請求項1に記載のバンプの接合方法。
- 前記第1のバンプ(31)に荷重を加えて前記突起(40)を前記第1のバンプ(31)の先端部に食い込ませることによって前記転写を行うことを特徴とする請求項1または2に記載のバンプの接合方法。
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JP2008079771A JP4591529B2 (ja) | 2008-03-26 | 2008-03-26 | バンプの接合方法およびバンプの接合構造体 |
US12/382,876 US7971349B2 (en) | 2008-03-26 | 2009-03-26 | Bump bonding method |
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JP2008079771A JP4591529B2 (ja) | 2008-03-26 | 2008-03-26 | バンプの接合方法およびバンプの接合構造体 |
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JP5923725B2 (ja) | 2012-05-15 | 2016-05-25 | パナソニックIpマネジメント株式会社 | 電子部品の実装構造体 |
JP6602544B2 (ja) * | 2015-03-06 | 2019-11-06 | 三菱重工業株式会社 | 接合方法 |
US10068865B1 (en) * | 2017-05-10 | 2018-09-04 | Nanya Technology Corporation | Combing bump structure and manufacturing method thereof |
US11165010B2 (en) * | 2019-02-11 | 2021-11-02 | International Business Machines Corporation | Cold-welded flip chip interconnect structure |
Citations (5)
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JPH04116944A (ja) * | 1990-09-07 | 1992-04-17 | Oki Electric Ind Co Ltd | 半導体素子の実装方法 |
JPH05135216A (ja) * | 1991-11-13 | 1993-06-01 | Toppan Printing Co Ltd | データ処理装置 |
JPH09223721A (ja) * | 1996-02-15 | 1997-08-26 | Fujitsu Ltd | 半導体装置及びその製造方法及び実装基板及びその製造方法 |
JP2001102411A (ja) * | 1999-09-29 | 2001-04-13 | Kyocera Corp | 電子部品の実装方法 |
JP2002222832A (ja) * | 2001-01-29 | 2002-08-09 | Nec Corp | 半導体装置及び半導体素子の実装方法 |
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JPH06188289A (ja) * | 1992-12-21 | 1994-07-08 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
US5508561A (en) * | 1993-11-15 | 1996-04-16 | Nec Corporation | Apparatus for forming a double-bump structure used for flip-chip mounting |
JP2000232129A (ja) | 1999-02-10 | 2000-08-22 | Sony Corp | 半導体実装装置と、半導体実装装置の製造方法と、電子機器 |
JP2003197672A (ja) | 2001-12-25 | 2003-07-11 | Nec Electronics Corp | 半導体装置の製造方法 |
JP2008035918A (ja) | 2006-08-01 | 2008-02-21 | Sanyo Electric Co Ltd | 血糖値測定装置および血糖値測定方法 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04116944A (ja) * | 1990-09-07 | 1992-04-17 | Oki Electric Ind Co Ltd | 半導体素子の実装方法 |
JPH05135216A (ja) * | 1991-11-13 | 1993-06-01 | Toppan Printing Co Ltd | データ処理装置 |
JPH09223721A (ja) * | 1996-02-15 | 1997-08-26 | Fujitsu Ltd | 半導体装置及びその製造方法及び実装基板及びその製造方法 |
JP2001102411A (ja) * | 1999-09-29 | 2001-04-13 | Kyocera Corp | 電子部品の実装方法 |
JP2002222832A (ja) * | 2001-01-29 | 2002-08-09 | Nec Corp | 半導体装置及び半導体素子の実装方法 |
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US20090241337A1 (en) | 2009-10-01 |
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