JP5115488B2 - ワイヤボンディング方法 - Google Patents
ワイヤボンディング方法 Download PDFInfo
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- JP5115488B2 JP5115488B2 JP2009023535A JP2009023535A JP5115488B2 JP 5115488 B2 JP5115488 B2 JP 5115488B2 JP 2009023535 A JP2009023535 A JP 2009023535A JP 2009023535 A JP2009023535 A JP 2009023535A JP 5115488 B2 JP5115488 B2 JP 5115488B2
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- bonding
- land
- wire
- capillary
- tip
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Description
図1は、本発明の第1実施形態に係る電子装置S1の概略構成を示す図であり、(a)は概略断面図であり、(b)は(a)中の上視平面図であり、(c)は(b)中の一点鎖線A−Aに沿った概略断面図であって、(a)におけるボンディングランド30の拡大図である。
図4は、本発明の第2実施形態に係るワイヤボンディング法におけるランド平坦化工程を示す工程図であり、図5は、図4に続くランド平坦化工程を示す工程図である。ここで、図4(a)および図5(a)はキャピラリ100の先端部102の概略平面図であり、図4(b)、(c)および図5(b)、(c)は基板10の一面に直交する方向の断面図である。
図6は、本発明の第3実施形態に係るワイヤボンディング方法におけるランド平坦化工程を示す工程図である。上記実施形態では、ランド平坦化工程では、ボンディングランド30の突出先端部にキャピラリ100を押し付け、当該突出先端部に平坦面31を形成していた。
図9は、本発明の第4実施形態に係る電子装置の製造方法におけるランド平坦化工程を示す工程図である。図9において、(a)はランド平坦化工程の全体を示す概略断面図、(b)は(a)中のランド部分を拡大して示す工程図、(c)は(b)に続く工程図、(d)は2次ボンディング工程を示す工程図である。
なお、被接合部材としては、上記したICチップなどの電子部品以外にも、基板の一面に設けられワイヤボンディングの1次ボンディングによってワイヤが接合されるものであればよく、各種の表面実装部品、あるいは、基板の一面に設けられた他のランドや電極などであってもよい。
20 被接合部材としてのICチップ
30 ボンディングランド
31 平坦面
40 ワイヤ
41 ボール
41a 第1のボール
100 キャピラリ
101 内孔
102 キャピラリの先端部
103 溝
200 マウンター
210 平坦部材
211 平坦部材の平坦面
Claims (5)
- 先端部(102)に開口する内孔(101)を有するキャピラリ(100)の前記内孔(101)にワイヤ(40)を挿入し、前記キャピラリ(100)の先端部(102)にて前記内孔(101)から導出された前記ワイヤ(40)を、基板(10)の一面に設けられた被接合部材(20)にボールボンディングによって接合する1次ボンディング工程を行った後、
次に、前記基板(10)の一面にて当該一面上に突出して設けられたボンディングランド(30)まで、前記キャピラリ(100)によって前記ワイヤ(40)を引き回し、前記キャピラリ(100)の先端部(102)にて前記ワイヤ(40)を前記ボンディングランド(30)に押し当ててウェッジボンディングによって接合する2次ボンディング工程を行うことにより、
前記ワイヤ(40)を介して前記被接合部材(20)と前記ボンディングランド(30)とを接続するようにしたワイヤボンディング方法において、
前記2次ボンディング工程の前に、前記キャピラリ(100)の先端部(102)における前記内孔(101)の周囲部を、前記ボンディングランド(30)に押し付けて前記ボンディングランド(30)を平坦化するランド平坦化工程を行い、その後、前記2次ボンディング工程にて、前記ボンディングランド(30)の前記平坦化された部位(31)に対して前記ワイヤ(40)の接合を行うものであり、
前記キャピラリ(100)として、その先端部(102)における前記内孔(101)の周囲部に、前記導出されたワイヤ(40)が入り込む溝(103)が形成されたものを用い、
前記1次ボンディング工程を行った後、前記溝(103)に前記ワイヤ(40)を入り込ませた状態で、前記ワイヤ(40)を前記ボンディングランド(30)まで引き回し、続いて、前記ランド平坦化工程を行うものであり、
このランド平坦化工程では、前記溝(103)に前記ワイヤ(40)を入り込ませた状態で、前記キャピラリ(100)の先端部(102)における前記内孔(101)の周囲部のうち前記溝(103)から外れた部位を、前記ボンディングランド(30)に押し付けて前記平坦化された部位(31)を形成し、
その後、前記キャピラリ(100)を前記ボンディングランド(30)の上方に移動させつつ前記内孔(101)の軸周りに回転させることによって、前記溝(103)から前記ワイヤ(40)を取り出し、
次に、前記2次ボンディング工程では、前記キャピラリ(100)の先端部(102)における前記内孔(101)の周囲部のうち前記溝(103)から外れた部位によって、前記ワイヤ(40)を前記ボンディングランド(30)の前記平坦化された部位(31)に押し付けて接合することを特徴とするワイヤボンディング方法。 - 前記ランド平坦化工程では、前記ボンディングランド(30)の突出先端部に前記キャピラリ(100)を押し付けて当該突出先端部に前記平坦化された部位(31)を形成することを特徴とする請求項1に記載のワイヤボンディング方法。
- 前記ランド平坦化工程では、前記ボンディングランド(30)における突出先端部から根元部へ向かう斜面のうち前記被接合部材(20)とは反対側の部分に前記キャピラリ(100)を押し付けて当該部分に前記平坦化された部位(31)を形成することを特徴とする請求項1に記載のワイヤボンディング方法。
- 先端部(102)に開口する内孔(101)を有するキャピラリ(100)の前記内孔(101)にワイヤ(40)を挿入し、前記キャピラリ(100)の先端部(102)にて前記内孔(101)から導出された前記ワイヤ(40)を、基板(10)の一面に設けられた被接合部材(20)にボールボンディングによって接合する1次ボンディング工程を行った後、
次に、前記基板(10)の一面にて当該一面上に突出して設けられたボンディングランド(30)まで、前記キャピラリ(100)によって前記ワイヤ(40)を引き回し、前記キャピラリ(100)の先端部(102)にて前記ワイヤ(40)を前記ボンディングランド(30)に押し当ててウェッジボンディングによって接合する2次ボンディング工程を行うことにより、
前記ワイヤ(40)を介して前記被接合部材(20)と前記ボンディングランド(30)とを接続するようにしたワイヤボンディング方法において、
前記2次ボンディング工程の前に、前記キャピラリ(100)の先端部(102)における前記内孔(101)の周囲部を、前記ボンディングランド(30)に押し付けて前記ボンディングランド(30)を平坦化するランド平坦化工程を行い、その後、前記2次ボンディング工程にて、前記ボンディングランド(30)の前記平坦化された部位(31)に対して前記ワイヤ(40)の接合を行うものであり、
前記1次ボンディング工程の前に、前記キャピラリ(100)の先端部(102)にて前記内孔(101)から導出された前記ワイヤ(40)の先端部に第1のボール(41a)を形成し、
続いて、前記基板(10)の一面上にて、前記キャピラリ(100)を、前記ボンディングランド(30)と対向する位置まで移動させた後、前記ランド平坦化工程を行うものであり、
このランド平坦化工程では、前記ボンディングランド(30)における突出先端部から根元部へ向かう斜面のうち前記被接合部材(20)とは反対側の部分に前記キャピラリ(100)を押し付けて当該部分に前記平坦化された部位(31)を形成するものであり、
さらに、このランド平坦化工程では、前記キャピラリ(100)の押し付けを行うときに、前記ボンディングランド(30)における突出先端部から根元部へ向かう斜面のうち前記被接合部材(20)とは反対側の部分に、前記キャピラリ(100)に先行して前記第1のボール(41a)を押し当てることで前記斜面に沿って前記ワイヤ(40)を曲げていくようにし、
前記ランド平坦工程の後、前記基板(10)の一面のうち前記ボンディングランド(30)以外の部位に、前記第1のボール(41a)を接合して前記第1のボール(41a)を前記ワイヤ(40)から切り離し、
その後、前記キャピラリ(100)の先端部(102)にて前記内孔(101)から導出された前記ワイヤ(40)の先端部に第2のボール(41)を形成し、
続いて、前記第2のボール(41)を前記被接合部材(20)に押し当てて前記1次ボンディング工程を行うことを特徴とするワイヤボンディング方法。 - マウンター(200)によって電子部品(20)を拾い上げ保持した状態で、基板(10)の一面上に前記電子部品(20)を搭載する部品搭載工程と、
ワイヤボンディングによって、前記電子部品(20)にワイヤ(40)をボールボンディングによって1次ボンディングした後、前記基板(10)の一面にて当該一面上に突出して設けられたボンディングランド(30)に前記ワイヤ(40)をウェッジボンディングによって2次ボンディングするワイヤボンディング工程と、を備える電子装置の製造方法において、
平坦面(211)を有する平坦部材(210)を前記マウンター(200)で保持し、前記マウンター(200)によって前記平坦部材(210)の前記平坦面(211)を、前記ボンディングランド(30)における突出先端部に押し付けて当該突出先端部を平坦化した後、
前記ワイヤボンディング工程では、この平坦化された突出先端部に対して前記ワイヤ(40)の接合を行うことを特徴とする電子装置の製造方法。
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