JP7036784B2 - 基板アダプタの製造方法および電子部品に接続するための基板アダプタ - Google Patents
基板アダプタの製造方法および電子部品に接続するための基板アダプタ Download PDFInfo
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- JP7036784B2 JP7036784B2 JP2019191020A JP2019191020A JP7036784B2 JP 7036784 B2 JP7036784 B2 JP 7036784B2 JP 2019191020 A JP2019191020 A JP 2019191020A JP 2019191020 A JP2019191020 A JP 2019191020A JP 7036784 B2 JP7036784 B2 JP 7036784B2
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83399—Material
- H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/83455—Nickel [Ni] as principal constituent
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- Condensed Matter Physics & Semiconductors (AREA)
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Description
3 基板
5 接触材料層
7 接着層
9 キャリア
11 ノズル
13a-13n~13a’’’-13n’’’ 三次元構造
101 基板アダプタ
103 基板
105 接触材料層
107 接着層
109 キャリア
111 ノズル
113 断層線
Claims (14)
- 電子部品との接続のための基板アダプタの製造方法であって、
少なくとも1つの予定破断箇所を有する少なくとも1つの接触材料層を、キャリアの少なくとも一方の側面と基板の表面との間に配置するステップと、
前記キャリアと前記基板とを前記接触材料層に接合するステップと、を含み、
前記キャリアは、少なくとも1つの接着層を含む、方法。 - 前記接触材料層を配置するステップは、前記予定破断箇所を形成するために、前記接触材料層内に材料空所を有する前記接触材料層を配置することを含むことを特徴とする、請求項1に記載の方法。
- 前記接触材料層を配置するステップは、前記接触材料層を、少なくとも部分的に、三次元構造の形状で配置することを含み、
前記材料空所が、隣接する三次元構造の間において、少なくとも1つの空間から形成される、ことを特徴とする請求項2に記載の方法。 - 前記接触材料層を配置するステップは、
前記三次元構造を、第1の延長軸に沿って配置することを含むことを特徴とする請求項3に記載の方法。 - 前記接触材料層を配置するステップは、
前記接触材料層を、印刷によって、前記キャリア上に配置すること、および/または、
前記接触材料層を、エンボスによって、前記キャリア上に配置することを含む、ことを特徴とする請求項1から請求項4のいずれか一項に記載の方法。 - 前記接触材料層は、接着剤、はんだ、および/または、焼結材料を含む、ことを特徴とする請求項1から請求項5のいずれか一項に記載の方法。
- 実質的に前記接触材料層と前記キャリアとの間の前記予定破断箇所に沿って、前記基板を剥離するステップを含む、ことを特徴とする請求項1から請求項6のいずれか一項に記載の方法。
- 前記キャリアと前記基板とを前記接触材料層に接合するステップの後において、前記接触材料層に接合された前記基板と前記キャリアとを別々にするステップであって、前記接触材料層に接合された前記基板を剥離するステップの前において、鋸引き、切断、パンチング、および/または、エッチングによって、前記接触材料層の一部に接合された、前記基板の少なくとも2つの成形部品に、細分するステップを含む、ことを特徴とする、請求項1から請求項7のいずれか一項に記載の方法。
- 前記基板は、金属成分を含む、ことを特徴とする、請求項1から請求項8のいずれか一項に記載の方法。
- 電子部品との接続のための基板アダプタであって、
キャリアと、
基板と、
接触材料層と、を備え、
前記接触材料層は、前記キャリアの少なくとも一方の側面と前記基板の表面との間に配置されており、
前記接触材料層は、少なくとも1つの予定破断箇所を有し、
前記キャリアおよび前記基板は、前記接触材料層に接合され、
前記キャリアは、少なくとも1つの接着層を含む、基板アダプタ。 - 前記接触材料層は、前記予定破断箇所を形成するために、当該接触材料層に少なくとも1つの材料空所を有する、ことを特徴とする請求項10に記載の基板アダプタ。
- 前記接触材料層は、少なくとも部分的に、三次元構造の形状で配置されており、
前記材料空所が、隣接する三次元構造の間において、少なくとも1つの空間から形成されている、ことを特徴とする請求項11に記載の基板アダプタ。 - 前記三次元構造は、第1の延長軸に沿って配置されている、ことを特徴とする、請求項12に記載の基板アダプタ。
- 前記接触材料層は、接着剤、はんだ、および/または、焼結材料を含む、ことを特徴とする、請求項10から請求項13のいずれか一項に記載の基板アダプタ。
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DE102018221148.5A DE102018221148A1 (de) | 2018-12-06 | 2018-12-06 | Verfahren zum Herstellen eines Substratadapters und Substratadapter zum Verbinden mit einem Elektronikbauteil |
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