SG11201606608XA - Method for producing semiconductor device and wire bonding device - Google Patents

Method for producing semiconductor device and wire bonding device

Info

Publication number
SG11201606608XA
SG11201606608XA SG11201606608XA SG11201606608XA SG11201606608XA SG 11201606608X A SG11201606608X A SG 11201606608XA SG 11201606608X A SG11201606608X A SG 11201606608XA SG 11201606608X A SG11201606608X A SG 11201606608XA SG 11201606608X A SG11201606608X A SG 11201606608XA
Authority
SG
Singapore
Prior art keywords
wire bonding
producing semiconductor
semiconductor device
bonding device
producing
Prior art date
Application number
SG11201606608XA
Inventor
Naoki Sekine
Motoki Nakazawa
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201606608XA publication Critical patent/SG11201606608XA/en

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Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2924/0001—Technical content checked by a classifier
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
SG11201606608XA 2014-02-10 2015-02-09 Method for producing semiconductor device and wire bonding device SG11201606608XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014023421 2014-02-10
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WO2015119275A1 (en) 2015-08-13
US20160351535A1 (en) 2016-12-01

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