JP2507698B2 - 超音波ウェッジボンディングのワイヤ―切れ検出方法 - Google Patents

超音波ウェッジボンディングのワイヤ―切れ検出方法

Info

Publication number
JP2507698B2
JP2507698B2 JP2286160A JP28616090A JP2507698B2 JP 2507698 B2 JP2507698 B2 JP 2507698B2 JP 2286160 A JP2286160 A JP 2286160A JP 28616090 A JP28616090 A JP 28616090A JP 2507698 B2 JP2507698 B2 JP 2507698B2
Authority
JP
Japan
Prior art keywords
wire
ultrasonic
wedge
wedge bonding
detection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2286160A
Other languages
English (en)
Other versions
JPH04162441A (ja
Inventor
正伸 池野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP2286160A priority Critical patent/JP2507698B2/ja
Publication of JPH04162441A publication Critical patent/JPH04162441A/ja
Application granted granted Critical
Publication of JP2507698B2 publication Critical patent/JP2507698B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置のワイヤーボンディングにおける
超音波ウェッジボンディングのワイヤー切れ検出方法に
関する。
〔従来の技術〕
従来、ワイヤーボンディングの際のワイヤー切れを検
出する方法として、キャピラリーボンディングの場合
は、ワイヤーのボールアップ時のスパーク放電による導
通の有無でワイヤーの有無を検出し、導通がなければワ
イヤーが途切れていると判断していた。
一方、超音波ウェッジボンディングの場合は、ボール
アップを行わないためワイヤー切れを検出する手段はと
られていなかった。
〔発明が解決しようとする課題〕
上述した従来のワイヤー切れ検出方法は、ワイヤーの
ボールアップ時のスパーク放電の有無で検出しているの
で、ボールアップを行わない超音波ウェッジボンディン
グでは、ワイヤー切れを検出できないという欠点があ
る。
〔課題を解決するための手段〕
本発明の超音波ウェッジボンディングのワイヤー切れ
検出方法は、超音波発振によるワイヤー圧着時の超音波
発振前と発振後のワイヤーつぶれによるホーンの高さの
差を変位センサにより電圧に変換し、その電圧差からワ
イヤーの有無を検出する方法である。
〔実施例〕
次に本発明について図面を参照して説明する。
第１図は本発明の一実施例を説明する超音波ホーンの
構成図である。ホーン２は支軸まわりに揺動でき、超音
波発振子４により振動し、一端のウェッジ１によりワイ
ヤー５を接合する。ホーン２の他端側には、ホーン２と
一定距離をあけて変位センサ３を設けている。
第２図（Ａ），（Ｂ）は超音波発振前の第１図のA,B
部の拡大図であり、第３図（Ａ），（Ｂ）は超音波発振
後の第１図のA,B部の拡大図である。ａはウェッジ１の
高さ、ｂは無接触式の変位センサ３とホーン２との距離
である。第２図（Ａ）の状態で超音波発振法にてワイヤ
ー５を圧着させると、第３図（Ａ）のようにワイヤー５
はつぶれ、ウェッジ１の高さはａからｃになり、同じく
第２図（Ｂ）の変位センサ３とホーン２との距離ｂは第
３図（Ｂ）のようにｄになる。
このb,dの距離の変化を、変位センサ３により電圧に
変換された波形図である第４図で説明すると、距離ｂは
電圧Vb、距離ｄは電圧Vdとなり、Vb−Vd＞０（Ｖ）の時
ワイヤー有と判断する。また、ワイヤー無の時は、ワイ
ヤーつぶれによるa,cの変化はなくなり、ｂ＝ｄとなる
ため第５図の波形図にてVb−Vd＝０（Ｖ）となり、ワイ
ヤー無と判断する。
〔発明の効果〕
以上説明したように本発明は、ワイヤーを超音波圧接
する際の超音波発振前と発振後のワイヤーつぶれによる
超音波ホーンの沈み込みの変位量を変位センサにより電
圧に変換し、その発振前と発振後の電圧差からワイヤー
の有無を判断することにより、キャピラリーボンディン
グと違ってワイヤーのボールアップをしない超音波ウェ
ッジボンディングでも、ワイヤー切れを検出できる効果
がある。
【図面の簡単な説明】
第１図は本発明の一実施例を説明する超音波ホーンの構
成図、第２図（Ａ），（Ｂ）は超音波発振前の第１図A,
B部の拡大図、第３図（Ａ），（Ｂ）は超音波発振後の
第１図A,B部の拡大図、第４図は超音波発振時にワイヤ
ー有の場合の変位センサの波形図、第５図は同様にワイ
ヤー無の場合の変位センサの波形図である。 １……ウェッジ、２……ホーン、３……変位センサ、４
……超音波発振子、５……ワイヤー。

Claims (2)

    (57)【特許請求の範囲】
  1. 【請求項１】超音波ウェッジボンディングによりワイヤ
    ーを超音波圧着する際の超音波発振前と発振後のワイヤ
    ーつぶれによる超音波ホーンの高さの差を変位センサに
    より電圧に変換し、その電圧差からワイヤーの有無を判
    断する超音波ウェッジボンディングのワイヤー切れ検出
    方法。
  2. 【請求項２】超音波ホーンのウェッジ側とは反対の他端
    側に超音波ホーンから一定距離をあけて変位センサを設
    け、ワイヤつぶれによるウェッジ高さの変位を超音波ホ
    ーン他端の変位として検出する請求項１記載の超音波ウ
    ェッジボンディングのワイヤー切れ検出方法。
JP2286160A 1990-10-24 1990-10-24 超音波ウェッジボンディングのワイヤ―切れ検出方法 Expired - Fee Related JP2507698B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2286160A JP2507698B2 (ja) 1990-10-24 1990-10-24 超音波ウェッジボンディングのワイヤ―切れ検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2286160A JP2507698B2 (ja) 1990-10-24 1990-10-24 超音波ウェッジボンディングのワイヤ―切れ検出方法

Publications (2)

Publication Number Publication Date
JPH04162441A JPH04162441A (ja) 1992-06-05
JP2507698B2 true JP2507698B2 (ja) 1996-06-12

Family

ID=17700716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2286160A Expired - Fee Related JP2507698B2 (ja) 1990-10-24 1990-10-24 超音波ウェッジボンディングのワイヤ―切れ検出方法

Country Status (1)

Country Link
JP (1) JP2507698B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160351537A1 (en) * 2014-02-14 2016-12-01 Shinkawa Ltd. Wire bonding apparatus and method of manufacturing semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101251383B1 (ko) * 2012-04-19 2013-04-05 주식회사 에네스지 초음파 탐상용 웨지유닛

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160351537A1 (en) * 2014-02-14 2016-12-01 Shinkawa Ltd. Wire bonding apparatus and method of manufacturing semiconductor device
US9899348B2 (en) * 2014-02-14 2018-02-20 Shinkawa Ltd. Wire bonding apparatus and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPH04162441A (ja) 1992-06-05

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