TW201532159A - 打線裝置以及半導體裝置的製造方法 - Google Patents
打線裝置以及半導體裝置的製造方法 Download PDFInfo
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- TW201532159A TW201532159A TW103143976A TW103143976A TW201532159A TW 201532159 A TW201532159 A TW 201532159A TW 103143976 A TW103143976 A TW 103143976A TW 103143976 A TW103143976 A TW 103143976A TW 201532159 A TW201532159 A TW 201532159A
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- Prior art keywords
- wire
- bonding
- cut
- bonding tool
- metal wire
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- 239000004065 semiconductor Substances 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000012544 monitoring process Methods 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 25
- 230000008569 process Effects 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 90
- 239000002184 metal Substances 0.000 claims description 90
- 238000012545 processing Methods 0.000 claims description 41
- 238000005520 cutting process Methods 0.000 claims description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 29
- 238000003825 pressing Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 9
- 238000005304 joining Methods 0.000 description 7
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- OIRDTQYFTABQOQ-UHTZMRCNSA-N Vidarabine Chemical compound C1=NC=2C(N)=NC=NC=2N1[C@@H]1O[C@H](CO)[C@@H](O)[C@@H]1O OIRDTQYFTABQOQ-UHTZMRCNSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 210000000617 arm Anatomy 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L24/78—Apparatus for connecting with wire connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
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Abstract
本發明謀求縮短打線的動作時間以及提高處理效率。打線裝置包括:接合工具40,將金屬線42插通;控制部80,進行接合工具40的移動處理,以便在接合對象物100的第1接合點與第2接合點之間形成金屬線環90後切斷金屬線42;以及監視部70,在由接合工具40所插通的金屬線42與接合對象物100之間供給規定的電氣訊號,基於所供給的電氣訊號的輸出,監視金屬線42是否已被切斷,並且控制部80構成為:基於來自監視部70的監視結果,在判定為金屬線42未被切斷的期間中,繼續進行接合工具40的移動處理,並且在判定為金屬線42已被切斷時,停止接合工具40的移動處理。
Description
本發明是有關於一種打線裝置以及半導體裝置的製造方法。
在製造半導體裝置的情況下,打線(wire bonding)被廣泛使用,該打線例如是藉由金屬線(wire)將半導體晶片(chip)的電極與基板的電極電性連接。作為打線方法的一個實施方式,已知有楔形接合(wedge bonding)方式,該楔形接合方式是在金屬線前端不形成焊球(ball)而對接合(bonding)對象連接金屬線。根據楔形接合方式,在利用金屬線將第1接合(bond)點與第2接合點之間連接後,藉由使接合工具(bonding tool)向平行於接合面的XY方向移動而將金屬線切斷,由此在接合工具的前端形成金屬線尾端(wire tail)。其後,將金屬線尾端接合於第1接合點,以便在不進行焊球形成處理的情況下進行接下來的打線(參照專利文獻1)。
先前,用以切斷金屬線的接合工具的移動處理是藉由作業人員事先設定參數(parameter)(移動距離)而進行的,而為了防止產生金屬線的切斷不良,通常留有餘量地確保移動距離而進行設定。因此,存在如下情況,即,有時儘管實際上已將金屬線切斷,但仍使接合工具過多地移動,相應地耗費打線裝置的動作時間。而且,在打線中,還需要設定其他各種多個參數,因此應事先設定的參數越少越佳。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本專利特開2003-318216號公報
因此,本發明的目的在於提供一種能夠解決上述課題的打線裝置以及半導體裝置的製造方法。
本發明的一個實施方式的打線裝置包括:接合工具,將金屬線插通;控制部,進行接合工具的移動處理,以便在接合對象物的第1接合點與第2接合點之間形成金屬線環(wire loop)後將金屬線切斷;以及監視部,在由接合工具所插通的金屬線與接合對象物之間供給規定的電氣訊號,並基於所供給的電氣訊號的輸出,對金屬線已被切斷與否進行監視;並且控制部構成為:基於來自監視部的監視結果,在判定為金屬線尚未被切斷的期間中,繼續進行接合工具的移動處理,並且在判定為金屬線已被切
斷時,停止接合工具的移動處理。
根據上述構成,基於對金屬線與接合對象物之間供給的電氣訊號的輸出,監視金屬線已被切斷與否,基於該監視結果,在判定為金屬線已被切斷時,停止用以切斷金屬線的接合工具的移動處理。因此,例如可在切斷金屬線的同時結束接合工具的移動處理,並且迅速移行至接下來的移動處理,從而可謀求縮短打線的動作時間。而且,由於可使金屬線的切斷處理自動化,故而可使打線時要進行的參數設定簡化。因此,可提高打線的處理效率。
在上述打線裝置中,亦可為,規定的電氣訊號為交流電氣訊號。
在上述打線裝置中,亦可為,所供給的電氣訊號的輸出是有關於金屬線與接合對象物之間的電容的輸出,並且監視部構成為:基於和電容有關的輸出與規定閾值的比較,判定金屬線是否已被切斷。
在上述打線裝置中,亦可以構成為:監視部在開始用以切斷金屬線的接合工具的移動處理之前,判定為金屬線已被切斷時,提示金屬線的切斷為異常。
在上述打線裝置中,亦可為,對接合對象物所進行的打線為楔形接合方式。
在上述打線裝置中,亦可為,接合工具的用以切斷金屬線的移動處理包含使接合工具在平行於接合面的方向上移動。
在上述打線裝置中,亦可為,控制部構成為:於藉由監視部判定為金屬線已被切斷時,停止接合工具的用以切斷金屬線
的移動處理,並且使接合工具在垂直於接合工具的方向上移動。
在上述打線裝置中,亦可為,金屬線為鋁金屬線。
本發明的一個實施方式的半導體裝置的製造方法包括:藉由接合工具在接合對象物的第1接合點與第2接合點之間形成金屬線環後,將金屬線切斷,且包括:在由接合工具所插通的金屬線與接合對象物之間供給規定的電氣訊號,基於所供給的電氣訊號的輸出,對金屬線已被切斷與否進行監視;將金屬線切斷的步驟包括:基於監視結果,在判定為金屬線尚未被切斷的期間中,繼續進行接合工具的用以切斷金屬線的移動處理,並且在判定為金屬線已被切斷時,停止接合工具的移動處理。
根據上述構成,基於對金屬線與接合對象物之間供給的電氣訊號的輸出,對金屬線已被切斷與否進行監視,基於該監視結果,在判定為金屬線已被切斷時,停止用以切斷金屬線的接合工具的移動處理。因此,例如可在切斷金屬線的同時結束接合工具的移動處理,並且迅速移行至接下來的移動處理,從而可謀求縮短打線的動作時間。而且,由於可使金屬線的切斷處理自動化,故而可使打線時要進行的參數設定簡化。因此,可提高打線的處理效率。
根據本發明,可謀求縮短打線的動作時間以及提高處理效率。
1‧‧‧打線裝置
10‧‧‧XY驅動機構
12‧‧‧Z驅動機構
14‧‧‧心軸
16‧‧‧接合台
20‧‧‧接合臂
21a‧‧‧頂面
21b‧‧‧底面
22‧‧‧臂基端部
23‧‧‧連結部
24‧‧‧臂前端部
25a、25b、25c‧‧‧狹縫
26‧‧‧凹部
30‧‧‧超音波變幅桿
32‧‧‧變幅桿固定螺絲
40‧‧‧接合工具(毛細管)
41‧‧‧插通孔
42‧‧‧金屬線
43‧‧‧金屬線尾端
44‧‧‧金屬線夾
46‧‧‧金屬線張力器
47‧‧‧按壓部
48‧‧‧按壓面
50‧‧‧荷重感測器
52‧‧‧預壓用螺絲
60‧‧‧超音波振動器
70‧‧‧監視部
72‧‧‧電源供給部
74‧‧‧測定部
76‧‧‧判定部
80‧‧‧控制部
82‧‧‧操作部
84‧‧‧顯示部
90、130‧‧‧金屬線環
100‧‧‧接合對象物
110‧‧‧半導體晶片
112、122‧‧‧電極
120‧‧‧基板
132‧‧‧第1接合部
134‧‧‧接合部
圖1是表示本實施方式的打線裝置的圖。
圖2A及圖2B是本實施方式的打線裝置的接合臂(bonding arm)的平面中的俯視圖及仰視圖。
圖3是本實施方式的半導體裝置的製造方法的流程圖(flow chart)。
圖4A及圖4B是用以說明本實施方式的半導體裝置的製造方法的圖,而且是表示本實施方式的監視部的構成的一例的圖。
圖5是與本實施方式的半導體裝置的製造方法有關的時序圖(timing chart)。
圖6是與本實施方式的半導體裝置的製造方法有關的時序圖。
以下,對本發明的實施方式進行說明。在以下的圖式記載中,同一或類似的構成要素由相同或類似的符號表示。圖式僅為例示,各部的尺寸或形狀為示意性者,而不應將本案發明的技術範圍限定於該實施方式進行解釋。
圖1是表示本實施方式的打線裝置的圖,圖2是打線裝置中的接合臂的局部放大圖,圖2A是接合臂的俯視圖,圖2B是接合臂的仰視圖。
如圖1所示,打線裝置1包含XY驅動機構10、Z驅動機構12、接合臂20、超音波變幅桿(ultrasonic horn)30、接合工具40、荷重感測器(sensor)50、超音波振動器60、監視部70以及控制部80。
XY驅動機構10構成為可在XY軸方向(平行於接合面的方向)上移動,對XY驅動機構(線性馬達(linear motor))10設置有Z驅動機構(線性馬達)12,該Z驅動機構可使接合臂20在Z軸方向(垂直於接合面的方向)上移動。
接合臂20由心軸14支持,並且構成為相對於XY驅動機構10擺動自如。接合臂20以自XY驅動機構10伸出至放置有接合對象物100的接合台(bonding stage)16的方式形成為大致長方體。接合臂20包含:臂基端部22,安裝於XY驅動機構10;臂前端部24,位於臂基端部22的前端側,供超音波變幅桿30安裝;以及連結部23,將臂基端部22與臂前端部24連結,並且具有可撓性。該連結部23包含自接合臂20的頂面21a向底面21b的方向伸出的規定寬度的狹縫(slit)25a、狹縫25b、以及自接合臂20的底面21b向頂面21a的方向伸出的規定寬度的狹縫25c。如此,連結部23因各狹縫25a、狹縫25b、狹縫25c而局部構成為薄壁部,故而臂前端部24以相對於臂基端部22撓曲的方式構成。
如圖1及圖2B所示,在接合臂20的底面21b側,形成有收容超音波變幅桿30的凹部26。超音波變幅桿30以收容於接合臂20的凹部26的狀態,藉由變幅桿固定螺絲32而安裝於臂前端部24。該超音波變幅桿30在自凹部26突出的前端部保持接合工具40,在凹部26設置有產生超音波振動的超音波振動器60。可藉由超音波振動器60產生超音波振動,並且藉由超音波變幅桿30將該超音波振動傳遞至接合工具40,而經由接合工具40對接合對象賦預超音波振動。超音波振動器60例如為壓電振動器(piezoelectric vibrator)。
而且,如圖1及圖2A所示,在接合20的頂面21a側,自頂面21a朝向底面21b依序形成有狹縫25a及狹縫25b。上部的狹縫25a形成得較下部的狹縫25b寬幅。並且,在該形成為寬幅的上部的狹縫25a設置有荷重感測器50。荷重感測器50藉由預壓用螺絲52而固定於臂前端部24。荷重感測器50以夾入臂基端部22與臂前端部24之間的方式配置。即,荷重感測器50自超音波變幅桿30的長度方向的中心軸向相對於接合對象相接/分離的方向偏移(offset),而安裝於接合臂20的旋轉中心與臂前端部24中的超音波變幅桿30的安裝面(即臂前端部24中的接合工具40側的前端面)之間。並且,如上所述,保持接合工具40的超音波變幅桿30安裝於臂前端部24,故而若藉由來自接合對象的反作用力對接合工具40的前端施加荷重,則臂前端部24相對於臂基端部22撓曲,從而可在荷重感測器50中檢測出荷重。荷重感測器50例如為壓電荷重感測器。
接合工具40用以供金屬線42插通,例如為設置有插通孔41的毛細管(capillary)(參照圖4A)。在該情況下,構成為在接合工具40的插通孔41中插通用於接合的金屬線42,可自插通孔41的前端抽出金屬線42的一部分。而且,在接合工具40的前端設置有用以按壓金屬線42的按壓部47(參照圖4A)。按壓部47具有繞接合工具40的插通孔41的軸向旋轉對稱的形狀,並且在插通孔41周圍的下表面具有按壓面48。
接合工具40藉由彈力等可更換地安裝於超音波變幅桿30。而且,在接合工具40的上方設置金屬線夾(wire clamp)44,金屬線夾44以在規定的時間點將金屬線42約束或釋放的方式構
成。在金屬線夾44的更上方設置金屬線張力器(wire tensioner)46,金屬線張力器46以如下方式構成,即,供金屬線42插通,並且對接合中的金屬線42賦予適度的張力(tension)。
金屬線42的材料根據加工的容易度及電阻高低等適當選擇,例如使用金(Au)、鋁(Al)、銅(Cu)或銀(Ag)等。另外,金屬線42中自接合工具40的前端伸出的一部分43被接合於第1接合點。
監視部70在打線步驟的規定期間,監視藉由接合工具40插通的金屬線42的狀態。具體而言,監視部70對金屬線42與接合對象物100之間供給規定的電氣訊號,基於該所供給的電氣訊號的輸出,監視金屬線42是否已被切斷。
此處,如圖4A及圖4B所示,監視部70包含電源供給部72、測定部74、以及判定部74,監視部70的其中一個端子電性連接於接合台16,另一個端子電性連接於金屬線夾44(或金屬線軸(wire spool)(未圖示))。電源供給部72以對金屬線42與接合對象物100之間供給規定的電氣訊號的方式構成,測定部74以測定所供給的電氣訊號的輸出的方式構成。並且,判定部76以基於該輸出判定金屬線42的狀態(金屬線是否已被切斷)的方式構成。例如,在電源供給部72的電源為交流電壓電源的情況下,藉由測定部74內部的阻抗(impedance)測定電路(未圖示)而測定阻抗值,由此檢測出金屬線42與接合台16之間的電容分量,判定部76基於與該電容分量有關的輸出,判定金屬線42是否已被切斷。另外,該輸出亦可為電容值本身。在該情況下,判定部76亦可將作為輸出的電容值與規定閾值進行比較,例如當電容值為
規定閾值以上時判定金屬線42尚未被切斷,當電容值小於規定閾值時判定金屬線42已被切斷。或者,與電容分量有關的輸出亦可為對電容值進行運算所得的值。例如,判定部76亦可基於例如隨電容值的時間變化而變化的微分值,判定金屬線42是否已被切斷。
在成為金屬線42未電性連接於接合對象物100的狀態時,金屬線42與接合台16之間的電容分量變得與打線裝置1的元件的電容值(打線裝置電容值)相等。相對於此,在成為金屬線42電性連接於接合對象物100(例如半導體晶片110及基板120兩者)的狀態時,金屬線42與接合台16之間的電容分量變成上述打線裝置電容值與接合對象物100的電容值(半導體裝置電容值)的合計值。如此,監視部70可基於與藉由接合工具40插通的金屬線42與接合台16之間的電容分量有關的輸出,判定或監視在接合對象物100的第1接合點與第2接合點之間形成金屬線環後金屬線42是否已被切斷。
返回至圖1,控制部80連接於XY驅動機構10、Z驅動機構12、超音波變幅桿30(超音波振動器60)、荷重感測器50以及監視部70,藉由控制部80控制該些構成的動作,由此可進行用以打線的必要處理。控制部80包含介面(interface)(未圖示),該介面與例如XY驅動機構10、Z驅動機構12、荷重感測器50、超音波變幅桿30(超音波振動器60)、金屬線夾44、荷重感測器50以及監視部70等各構成之間收發訊號。具體而言,控制部80進行與接合工具的動作有關的控制,例如控制接合工具40的XYZ軸方向的移動距離或Z方向的荷重、控制金屬線夾44的開閉動作、對接合工具40賦予超音波振動的時序或時間及擦洗(scrub)
動作等。
而且,對控制部80連接有用以輸入控制資訊的操作部82、以及用以輸出控制資訊的顯示部84,藉此,作業人員可一面藉由顯示部84識別畫面,一面藉由操作部82輸入所需的控制資訊。另外,控制部80是包含中央處理單元(Central Processing Unit,CPU)以及記憶體(memory)等的電腦(computer)裝置,在記憶體中預先儲存用以對打線進行所需處理的接合程式(bonding program)等。控制部80以如下方式構成,即,進行下述半導體裝置的製造方法中所說明的用以控制接合工具40的動作的各步驟(例如包含用以使電腦執行各步驟的程式)。
其次,參照圖3~圖6,對本實施方式的半導體裝置的製造方法進行說明。該半導體裝置的製造方法包含使用上述打線裝置1進行的打線方法。而且,本實施方式的打線為楔形接合方式。
此處,圖3是半導體裝置的製造方法的流程圖,圖4A及圖4B是表示打線處理的圖。而且,圖5及圖6是與半導體裝置的製造方法有關的時序圖。另外,圖4A所示的XYZ軸的朝向亦同樣適用於圖4B以及圖5及圖6中。
首先,在接合台16上準備接合對象物100。
如圖1所示,接合對象物100具有藉由本實施方式的半導體裝置的製造方法而電性連接的第1接合點及第2接合點。此處,所謂第1接合點是指由金屬線連接的兩點間首先接合的部位,所謂第2接合點是指該兩點間隨後接合的部位。
接合對象物100是至少包含一個半導體晶片的半導體裝
置,並且例如圖1所示,包含具有作為第1接合點的多個電極112的半導體晶片110、以及具有作為第2接合點的多個電極122的基板120。在半導體晶片110中的電極112的形成面(形成有半導體元件一側的表面)形成有作為保護膜的鈍化膜(passivation)(未圖示),多個電極112分別自鈍化膜114的開口部露出。半導體晶片110搭載於基板120上。在此種實施方式中,通常將以自半導體晶片110的電極112至基板120的電極122的順序進行接合稱為正接合,在以下的例子中,對正接合的例子進行說明,但本實施方式的打線亦可應用於以自基板120的電極122至半導體晶片110的電極112的順序進行接合的所謂逆接合。
<時刻t0~t5的處理>
如圖3所示,藉由金屬線連接作為第1接合點的半導體晶片110的電極112與作為第2接合點的基板120的電極122(S10)。即,如圖5所示,進行第1接合處理(時刻t0~t2)、成環(looping)處理(時刻t2~t4)以及第2接合處理(時刻t4~t5)的各種處理。
具體而言,首先,如圖5所示,自時刻t0至時刻t1使Z驅動機構12作動,藉此使接合工具40自高度Z0下降至Z1,並且自時刻t1至時刻t2對接合工具40加壓。此時,一面藉由接合工具40的按壓部47(按壓面48)(參照圖4A)對金屬線42的一部分加壓,一面使熱、超音波及擦洗動作作動,由此將金屬線42與電極112接合。
繼而,自時刻t2至時刻t3使XY驅動機構10及Z驅動機構12適當作動,藉此一面抽出金屬線42一面使接合工具40沿著規定的軌跡移動,而使金屬線42成環。在時刻t3時,將接合工
具40配置於第2接合點的上方,其後,自時刻t3至時刻t4使Z驅動機構12作動,由此使接合工具下降至高度Z2。另外,自時刻t1至時刻t3,金屬線夾44成為打開的狀態。
其後,自時刻t3至時刻t4,對接合工具40加壓。此時,與第1接合點中的接合同樣地,一面藉由接合工具40的按壓部47(按壓面48)(參照圖4A)對金屬線42的一部分加壓,一面使熱、超音波及擦洗動作作動,由此將金屬線42與電極112接合。
如此,如圖4A所示,在作為第1接合點的電極112與作為第2接合點的電極122之間,形成連接兩者的金屬線環90。另外,圖4A是與時刻t5對應的圖。
<時刻t5~t8的處理(金屬線切斷處理)>
在結束第2接合點處的接合後,一面抽出金屬線42一面使接合工具40上升(S11),其後,開始進行用以切斷金屬線的工具的移動處理(S12)。例如,如圖5所示,在時刻t5,使Z驅動機構12作動而使接合工具40上升,繼而使XY驅動機構10作動而使接合工具40向離開金屬線環90的方向(Y方向)移動。其間,如圖5所示,金屬線夾44成為打開的狀態。如此,根據接合工具40的移動量自接合工具40的前端抽出規定量的金屬線42,而在接合工具40的前端與第2接合點之間伸出規定長度的金屬線42。
其後,繼續進行用以切斷金屬線42的接合工具40的移動處理(S13)。例如,如圖5所示,藉由使XY驅動機構10進一步作動,而使接合工具40向離開金屬線環90的方向移動。如此,在自時刻t5至時刻t6期間(XY驅動機構10的作動期間),對金屬線42施加拉伸應力。此時,如圖5所示,藉由在自時刻t5至時
刻t6之間的任一時間點將金屬線夾44設為關閉狀態,可藉由金屬線42施加大的拉伸應力。
於本實施方式中,在該金屬線切斷處理期間,藉由監視部70監視金屬線是否已被切斷(S14)。具體而言,監視部70在時刻t5以後,對金屬線42與接合對象物100之間供給規定的電氣訊號,基於所供給的電氣訊號的輸出,判定或監視金屬線42是否已被切斷。電氣訊號在時間上被連續供給,並且基於針對該信號的連續應答的輸出而進行監視。
在所要供給的電氣訊號為交流電氣訊號的情況下,例如可測定金屬線42與接合台16之間的電容分量作為監視輸出。在金屬線42與接合對象物100電性連接的狀態下,金屬線42與接合台16之間的電容分量成為打線裝置電容值與接合對象物100的電容值(半導體裝置電容值)的合計值,故而如圖6所示,自時刻t4至時刻t7,監視輸出成為高位準(high level)。並且,在時刻t7,若金屬線42因施加至金屬線42的拉伸應力而被切斷,則電容分量下降至打線裝置電容值,故而在時刻t7以後,監視輸出成為低位準(low level)。如此,監視部70(判定部76)在監視輸出維持於高位準期間,判定金屬線42尚未被切斷,另一方面,在金屬線42轉變為低位準時,判定金屬線42已被切斷。另外,此種判定可藉由與規定閾值(例如高位準與低位準的中間值)進行比較而進行。
控制部80自監視部70接收基於此種監視結果的訊號,並且基於該監視結果,控制與接合工具的移動處理有關的動作。
具體而言,在藉由監視部70判定金屬線42尚未被切斷
的情況下,控制部80繼續進行用以切斷金屬線42的接合工具40的移動處理(圖3所示的S14的否(NO)及S13)。即,如圖5及圖6所示,繼續藉由XY驅動機構12進行接合工具40的移動處理。另外,反覆進行圖3所示的S13及S14的一連串的處理,直至判定出金屬線42已被切斷為止。
另一方面,在藉由監視部70判定金屬線42已被切斷的情況下,控制部80停止用以切斷金屬線42的接合工具40的移動處理(圖3所示的S14的是(YES)及S15)。即,如圖5及圖6所示,在時刻t7,停止藉由XY驅動機構12進行的接合工具40的移動處理。其後,如圖3所示,作為其後應進行的處理,例如使Z驅動機構10作動,而使接合工具40在垂直於接合面的方向上上升至高度Z3(S16)。另外,圖4B是與時刻t7對應的圖。
另外,亦可構成為,於監視部70在開始用以切斷金屬線42的接合工具40的移動處理前判定金屬線42已被切斷時,監視部70或控制部80提示金屬線42的切斷為異常。例如,若自時刻t5至時刻t6在一面抽出金屬線42一面使接合工具40上升期間金屬線42已被切斷,則在接合工具的前端無法抽出規定長度的金屬線42,故而可視為此種金屬線42的切斷為異常。在該情況下,當監視部70判定在上述時間點金屬線42已被切斷時,控制部80亦可將表示上述情況的內容顯示於例如顯示部84的畫面。
如此,將金屬線42的一部分切斷,而如圖4B所示般在接合工具40的前端形成金屬線尾端43。由於藉由使接合工具40在平行於接合面的方向上移動而將金屬線42切斷,故而金屬線尾端43成為跟隨接合工具40的移動方向而向與Z方向交叉的方向
撓曲的形狀。例如,亦可使接合工具40在連結第1接合點與第2接合點的Y方向的直線上移動,而使金屬線尾端43以成為向Y方向撓曲的形狀的方式伸出。
如此,如圖4B所示,可形成呈規定形狀伸出的金屬線環130,以將第1接合點與第2接合點之間連接。金屬線環130包含作為第1接合點的電極112上的第1接合部132、以及作為第2接合點的電極122上的接合部134。
<時刻t8以後的處理>
在使接合工具40上升至Z3後,如圖3所示般,判定是否需要對接合對象物100進行接下來的打線(S17),在需要進行接下來的打線的情況下(S17為是),使接合工具40向用於接下來的打線的第1接合點移動,而將金屬線尾端43接合於第1接合點,並且重複進行S10~S16的一連串的步驟。另一方面,在無須進行接下來的打線而完全結束對於接合對象物100的打線的情況下(S17為否),結束對於該接合對象物100的打線步驟。
如以上般,根據本實施方式,基於對金屬線42與接合對象物100之間供給的電氣訊號的輸出,監視金屬線是否已被切斷,在基於該監視結果判定金屬線已被切斷時,停止用以切斷金屬線的接合工具的移動處理。因此,例如可在切斷金屬線42的同時結束接合工具40的移動處理,並且迅速移行至接下來的移動處理,從而可謀求縮短打線的動作時間。而且,由於可使金屬線42的切斷處理自動化,故而可使打線時要進行的參數設定簡化。因此,可提高打線的處理效率。
本發明並不限定於上述實施方式,可進行各種變形而應
用。
在上述實施方式中,藉由監視部70監視金屬線狀態的期間雖設為時刻t5~t7,但並不限於此,例如可為開始使XY驅動機構12作動的時刻t6~t7,或者亦可設為打線步驟的整個期間。而且,用以切斷金屬線的接合工具40的移動處理亦可使XY驅動機構10及Z驅動機構12兩者作動。另外,圖5或圖6的時序圖為一例,本發明並不限於該例。
而且,接合工具40向XYZ方向的移動並不限定於上述實施方式的例中所示的構成,例如亦可包含不僅描繪直線軌道還描繪曲線軌道的處理。而且,接合工具40的形狀亦不限定於圖示的形狀。
而且,在上述實施方式中,對監視部70供給交流電氣訊號的例子進行了說明,但並不限於此,亦可供給直流脈衝(pulse)電氣訊號。在該情況下,亦可為,電源供給部72供給直流脈衝電源,測定部74測定金屬線42與接合台16之間的電壓值。即,亦可為,藉由讀取取決於金屬線42是否電性連接於接合對象物100的電壓值的變化,判定或監視金屬線42是否已被切斷。
通過上述發明的實施方式說明的實施例或應用例可根據用途適當組合,或者加以變更或改良而使用,本發明並不限定於上述實施方式的記載。根據申請專利範圍的記載可明確:此種組合或者加以變更或改良後的形態亦包含於本發明的技術範圍內。
16‧‧‧接合台
40‧‧‧接合工具(毛細管)
41‧‧‧插通孔
42‧‧‧金屬線
43‧‧‧金屬線尾端
44‧‧‧金屬線夾
70‧‧‧監視部
72‧‧‧電源供給部
74‧‧‧測定部
76‧‧‧判定部
100‧‧‧接合對象物
110‧‧‧半導體晶片
112、122‧‧‧電極
120‧‧‧基板
130‧‧‧金屬線環
132‧‧‧第1接合部
134‧‧‧接合部
Claims (9)
- 一種打線裝置,包括:接合工具,將金屬線插通;控制部,進行上述接合工具的移動處理,以便在接合對象物的第1接合點與第2接合點之間形成金屬線環後將金屬線切斷;以及監視部,在由上述接合工具所插通的金屬線與上述接合對象物之間供給規定的電氣訊號,基於上述所供給的電氣訊號的輸出,對上述金屬線已被切斷與否進行監視,且上述控制部構成為:基於來自上述監視部的監視結果,在判定為上述金屬線尚未被切斷的期間中,繼續進行上述接合工具的上述移動處理,並且在判定為上述金屬線已被切斷時,停止上述接合工具的上述移動處理。
- 如申請專利範圍第1項所述的打線裝置,其中上述規定的電氣訊號為交流電氣訊號或直流脈衝訊號。
- 如申請專利範圍第2項所述的打線裝置,其中上述所供給的電氣訊號的輸出是有關於上述金屬線與上述接合對象物之間的電容的輸出,並且上述監視部構成為:基於和上述電容有關的輸出與規定閾值的比較,判定上述金屬線是否已被切斷。
- 如申請專利範圍第1項所述的打線裝置,構成為:上述監視部在開始用以切斷上述金屬線的上述接合工具的移動處理之前,判定為上述金屬線已被切斷時,提示上述金屬線的切斷為異 常。
- 如申請專利範圍第1項所述的打線裝置,其中對上述接合對象物所進行的打線為楔形接合方式。
- 如申請專利範圍第1項所述的打線裝置,其中上述接合工具的用以切斷金屬線的移動處理,包含使上述接合工具在平行於接合面的方向上移動。
- 如申請專利範圍第1項所述的打線裝置,其中上述控制部構成為:在藉由上述監視部判定為上述金屬線已被切斷時,停止上述接合工具的用以切斷金屬線的移動處理,並且使上述接合工具在垂直於接合面的方向上移動。
- 如申請專利範圍第1項所述的打線裝置,其中上述金屬線為鋁金屬線。
- 一種半導體裝置的製造方法,包括:藉由接合工具在接合對象物的第1接合點與第2接合點之間形成金屬線環後,將金屬線切斷,且上述半導體裝置的製造方法包括:在由上述接合工具所插通的金屬線與上述接合對象物之間供給規定的電氣訊號,基於上述所供給的電氣訊號的輸出,對上述金屬線已被切斷與否進行監視,將上述金屬線切斷的步驟包括:基於上述監視結果,在判定為上述金屬線尚未被切斷的期間中,繼續進行上述接合工具的用以切斷上述金屬線的移動處理,並且在判定為上述金屬線已被切斷時,停止上述接合工具的上述移動處理。
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TWI543284B (zh) * | 2014-02-10 | 2016-07-21 | 新川股份有限公司 | 半導體裝置的製造方法以及打線裝置 |
TWI557821B (zh) * | 2014-02-21 | 2016-11-11 | 新川股份有限公司 | 半導體裝置的製造方法以及打線裝置 |
TWI643276B (zh) * | 2016-08-23 | 2018-12-01 | 日商新川股份有限公司 | 夾線裝置的校準方法以及打線裝置 |
KR102579103B1 (ko) * | 2018-12-12 | 2023-09-15 | 헤라우스 매터리얼즈 싱가포르 피티이 엘티디 | 전자 부품의 콘택트 표면을 전기적으로 연결하는 방법 |
DE102019109262A1 (de) * | 2019-04-09 | 2020-10-15 | Lisa Dräxlmaier GmbH | VORRICHTUNG ZUM BESTIMMEN EINES ZUSTANDS EINES ULTRASCHALLSCHWEIßPROZESSES |
KR20210140957A (ko) | 2020-05-14 | 2021-11-23 | 삼성전자주식회사 | 반도체 패키지의 와이어 본딩 방법 |
WO2022130617A1 (ja) * | 2020-12-18 | 2022-06-23 | 株式会社新川 | ワイヤボンディング装置、ワイヤ切断方法及びプログラム |
CN112992706B (zh) * | 2021-01-25 | 2022-12-09 | 芯峰光电技术(深圳)有限公司 | 一种芯片引脚打线针装置 |
CN116313940B (zh) * | 2023-05-18 | 2023-08-11 | 上海聚跃检测技术有限公司 | 一种引线键合结构的切割方法及切割辅助装置 |
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- 2015-02-10 WO PCT/JP2015/053664 patent/WO2015122410A1/ja active Application Filing
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TWI517277B (zh) | 2016-01-11 |
WO2015122410A1 (ja) | 2015-08-20 |
US20160351537A1 (en) | 2016-12-01 |
JPWO2015122410A1 (ja) | 2017-03-30 |
CN106165076A (zh) | 2016-11-23 |
CN106165076B (zh) | 2019-01-01 |
KR20160118364A (ko) | 2016-10-11 |
US9899348B2 (en) | 2018-02-20 |
KR101921527B1 (ko) | 2018-11-26 |
JP6118960B2 (ja) | 2017-04-26 |
SG11201606765WA (en) | 2016-10-28 |
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