CN105914176A - 粘贴装置 - Google Patents

粘贴装置 Download PDF

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Publication number
CN105914176A
CN105914176A CN201610374204.0A CN201610374204A CN105914176A CN 105914176 A CN105914176 A CN 105914176A CN 201610374204 A CN201610374204 A CN 201610374204A CN 105914176 A CN105914176 A CN 105914176A
Authority
CN
China
Prior art keywords
thin film
roller
substrate
sticker
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610374204.0A
Other languages
English (en)
Chinese (zh)
Inventor
岛井太
佐藤晶彦
丸山健治
细田浩
千叶正树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN105914176A publication Critical patent/CN105914176A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/514—Modifying physical properties
    • B65H2301/5143—Warming

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Labeling Devices (AREA)
  • Laminated Bodies (AREA)
CN201610374204.0A 2012-03-01 2013-02-28 粘贴装置 Pending CN105914176A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2012-045703 2012-03-01
JP2012045702 2012-03-01
JP2012-045702 2012-03-01
JP2012045704 2012-03-01
JP2012-045704 2012-03-01
JP2012045703 2012-03-01
CN201380007025.8A CN104081515B (zh) 2012-03-01 2013-02-28 粘贴装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201380007025.8A Division CN104081515B (zh) 2012-03-01 2013-02-28 粘贴装置

Publications (1)

Publication Number Publication Date
CN105914176A true CN105914176A (zh) 2016-08-31

Family

ID=49082752

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201380007025.8A Active CN104081515B (zh) 2012-03-01 2013-02-28 粘贴装置
CN201610374204.0A Pending CN105914176A (zh) 2012-03-01 2013-02-28 粘贴装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201380007025.8A Active CN104081515B (zh) 2012-03-01 2013-02-28 粘贴装置

Country Status (5)

Country Link
JP (1) JP6006779B2 (ko)
KR (1) KR101791733B1 (ko)
CN (2) CN104081515B (ko)
TW (1) TWI570826B (ko)
WO (1) WO2013129561A1 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
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KR101548310B1 (ko) * 2013-12-30 2015-08-28 코닝정밀소재 주식회사 필름 부착 방법 및 장치
JP6373076B2 (ja) * 2014-06-10 2018-08-15 東京応化工業株式会社 貼付装置および貼付方法
GB201500746D0 (en) * 2015-01-16 2015-03-04 Catchpoint Ltd Improvements to labelling apparatus and method
KR101627970B1 (ko) * 2015-05-12 2016-06-07 (주) 제니스 프린팅 방식의 전자소재용 접착테이프 제조장치 및 그 제조방법
CN104960957B (zh) * 2015-05-22 2017-07-28 泉州市汉威机械制造有限公司 一种线外放卷装置
JP2017135166A (ja) * 2016-01-25 2017-08-03 東京エレクトロン株式会社 接合システム
JP6751629B2 (ja) * 2016-09-09 2020-09-09 株式会社Ｓｃｒｅｅｎホールディングス 塗工装置およびフィルム回収方法
CN107160301B (zh) * 2017-04-18 2019-04-12 安徽振达刷业有限公司 一种毛刷砂布条自动包胶装置
JP7020189B2 (ja) * 2018-03-02 2022-02-16 トヨタ自動車株式会社 フィルム搬送装置、フィルム搬送方法、及びフィルム貼付け装置
JP7099011B2 (ja) * 2018-03-30 2022-07-12 ブラザー工業株式会社 布接着装置
CN109534078B (zh) * 2018-11-27 2020-12-01 北京金风科创风电设备有限公司 自动粘贴及自动裁剪装置
JP7165572B2 (ja) * 2018-12-07 2022-11-04 リンテック株式会社 シート剥離装置およびシート剥離方法
WO2020172785A1 (en) 2019-02-26 2020-09-03 Yangtze Memory Technologies Co., Ltd. Method and device for wafer taping
DE102019110246A1 (de) * 2019-04-18 2020-10-22 Voith Patent Gmbh Auftragsvorrichtung
CN110510446A (zh) * 2019-06-26 2019-11-29 浙江商业职业技术学院 一种基于物联网的led灯贴胶带装置
KR102409736B1 (ko) * 2020-08-05 2022-06-16 (주)광진상사 청소용 점착테이프롤 제조 장치
CN112896705B (zh) * 2021-01-13 2022-11-08 毛云华 一种工业机器人标签埋入设备
CN113290874A (zh) * 2021-04-30 2021-08-24 深圳市松禾智能装备有限公司 压膜机及压膜成型方法
CN115179541B (zh) * 2022-07-11 2024-02-02 宿州深湾电子科技有限公司 一种触摸屏生产用自动化贴膜装置

Citations (3)

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Publication number Priority date Publication date Assignee Title
CN1574224A (zh) * 2003-06-23 2005-02-02 株式会社东芝 薄膜涂布单元和薄膜涂布方法
JP2007000815A (ja) * 2005-06-24 2007-01-11 Miyako Roller Industry Co 基板への塗膜形成方法及び基板への塗膜形成装置
CN102009005A (zh) * 2009-09-04 2011-04-13 卡西欧计算机株式会社 排出部、涂敷装置以及涂敷方法

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JPH0326370A (ja) * 1989-06-26 1991-02-04 Nordson Kk 液体又は溶融体の塗布方法
JPH08117657A (ja) * 1994-10-27 1996-05-14 Ig Tech Res Inc 塗装装置
JP2001249617A (ja) * 2000-03-03 2001-09-14 Naohiro Saguchi ラベルとそのラベルの製造装置および貼付装置
JP2002066407A (ja) * 2000-08-29 2002-03-05 Kanegafuchi Chem Ind Co Ltd 樹脂ローラの樹脂塗布マスキング装置
JP4729192B2 (ja) * 2001-04-06 2011-07-20 株式会社フジシールインターナショナル フィルム供給装置
JP4006534B2 (ja) * 2003-02-19 2007-11-14 株式会社日立プラントテクノロジー フィルム貼付方法及びその装置
JP4371709B2 (ja) * 2003-06-05 2009-11-25 富士フイルム株式会社 光学フィルム貼付装置及び方法
JP2006012934A (ja) * 2004-06-23 2006-01-12 Pioneer Electronic Corp 基板搬送装置、基板搬送方法およびプラズマディスプレイパネルの製造方法
JP4533687B2 (ja) * 2004-07-06 2010-09-01 富士フイルム株式会社 感光性積層体の製造装置及び製造方法
JP2007038455A (ja) * 2005-08-01 2007-02-15 Showa Denko Kk 接着積層体及びその製造方法並びに加熱乾燥装置
JP2007091947A (ja) * 2005-09-29 2007-04-12 Kaneka Corp 等方的な接着フィルムおよびその製造方法、接着フィルムを用いたフレキシブル金属積層板。
JP5202832B2 (ja) * 2006-10-12 2013-06-05 東京応化工業株式会社 ウエハ回路面の保護方法及びウエハ薄化方法
JP2009137231A (ja) * 2007-12-10 2009-06-25 Seiko Epson Corp 熱溶着装置、及び、その制御方法
JP2011051198A (ja) * 2009-09-01 2011-03-17 Toppan Printing Co Ltd 積層フィルムの製造方法および装置
JP5437042B2 (ja) * 2009-12-14 2014-03-12 リンテック株式会社 シート貼付装置および貼付方法
JP5554167B2 (ja) * 2010-07-12 2014-07-23 リンテック株式会社 シート貼付装置
JP5144777B2 (ja) * 2011-03-17 2013-02-13 住友化学株式会社 基板搬送機構および偏光フィルムの貼合装置における基板支持部を備えた反転機構

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1574224A (zh) * 2003-06-23 2005-02-02 株式会社东芝 薄膜涂布单元和薄膜涂布方法
JP2007000815A (ja) * 2005-06-24 2007-01-11 Miyako Roller Industry Co 基板への塗膜形成方法及び基板への塗膜形成装置
CN102009005A (zh) * 2009-09-04 2011-04-13 卡西欧计算机株式会社 排出部、涂敷装置以及涂敷方法

Also Published As

Publication number Publication date
TWI570826B (zh) 2017-02-11
CN104081515A (zh) 2014-10-01
KR101791733B1 (ko) 2017-10-30
JP6006779B2 (ja) 2016-10-12
WO2013129561A1 (ja) 2013-09-06
JPWO2013129561A1 (ja) 2015-07-30
TW201401404A (zh) 2014-01-01
KR20140130676A (ko) 2014-11-11
CN104081515B (zh) 2017-05-10

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160831

WD01 Invention patent application deemed withdrawn after publication