CN105873979B - 超低损耗介电热固性树脂组合物以及由其制造的高性能层压板 - Google Patents

超低损耗介电热固性树脂组合物以及由其制造的高性能层压板 Download PDF

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CN105873979B
CN105873979B CN201480071436.8A CN201480071436A CN105873979B CN 105873979 B CN105873979 B CN 105873979B CN 201480071436 A CN201480071436 A CN 201480071436A CN 105873979 B CN105873979 B CN 105873979B
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component
resin composition
thermosetting resin
group
bisphenol
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CN105873979A (zh
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萨亚尔·达斯
帕特里克·希普曼
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NOVOSET LLC
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/40—Polyesters derived from ester-forming derivatives of polycarboxylic acids or of polyhydroxy compounds, other than from esters thereof
    • C08G63/44—Polyamides; Polynitriles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/02—Layered products comprising a layer of natural or synthetic rubber with fibres or particles being present as additives in the layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/78—Preparation processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C08J2351/08—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/66—Substances characterised by their function in the composition
    • C08L2666/84—Flame-proofing or flame-retarding additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
CN201480071436.8A 2013-11-04 2014-10-21 超低损耗介电热固性树脂组合物以及由其制造的高性能层压板 Active CN105873979B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/998,482 US9332637B2 (en) 2013-11-04 2013-11-04 Ultra low loss dielectric thermosetting resin compositions and high performance laminates manufactured therefrom
US13/998,482 2013-11-04
PCT/US2014/000199 WO2015065501A1 (en) 2013-11-04 2014-10-21 Ultra low loss dielectric thermosetting resin compositions and high preformance laminates manufactured therefrom

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Publication Number Publication Date
CN105873979A CN105873979A (zh) 2016-08-17
CN105873979B true CN105873979B (zh) 2018-09-07

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US (3) US9332637B2 (enExample)
EP (1) EP3066148B1 (enExample)
JP (2) JP6886292B2 (enExample)
KR (1) KR101819949B1 (enExample)
CN (1) CN105873979B (enExample)
AU (1) AU2014343034A1 (enExample)
CA (1) CA2933155A1 (enExample)
EA (1) EA201690947A1 (enExample)
SG (1) SG10201803411UA (enExample)
TW (1) TWI617594B (enExample)
WO (1) WO2015065501A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105038225A (zh) * 2015-07-28 2015-11-11 苏州科淼新材料有限公司 一种高硬度复合板的制备方法
CN106147496A (zh) * 2016-08-29 2016-11-23 薛常刚 一种pcb钻孔用涂膜铝基板的制备方法
CN106633054B (zh) * 2016-10-09 2018-10-26 西北工业大学 一种含氟低介电氰酸酯改性树脂及其制备方法
KR102201795B1 (ko) 2016-12-16 2021-01-14 노보셋, 엘엘씨 수지 조성물
WO2018139368A1 (ja) 2017-01-26 2018-08-02 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
CN109385174B (zh) 2017-08-10 2021-04-27 财团法人工业技术研究院 底漆组成物与使用该底漆组成物的铜箔基板
KR102576638B1 (ko) 2018-07-02 2023-09-11 삼성전자주식회사 유전 손실이 다른 복수의 유전체들을 갖는 절연층을 포함하는 회로 기판, 및 이를 포함하는 전자 장치
CN111786102A (zh) * 2019-04-03 2020-10-16 莱尔德电子材料(深圳)有限公司 低介电、低损耗天线罩
CN112646350B (zh) * 2019-10-11 2023-04-25 台光电子材料(昆山)有限公司 一种树脂组合物及其制品
TWI795856B (zh) * 2021-08-02 2023-03-11 南亞塑膠工業股份有限公司 高導熱橡膠樹脂材料及高導熱金屬基板
TWI785710B (zh) * 2021-08-02 2022-12-01 南亞塑膠工業股份有限公司 高介電橡膠樹脂材料及高介電金屬基板
CN114506098B (zh) * 2022-02-24 2023-07-21 四川金象赛瑞化工股份有限公司 一种覆铜板用树脂基纤维增强复合材料及其制备方法
WO2025224106A1 (en) 2024-04-25 2025-10-30 Basf Se Use of a composition or thermosetting resin or thermoset polymer made therefrom as build-up film material in a printed circuit element

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4797454A (en) * 1987-09-24 1989-01-10 Basf Corporation Curable resin systems containing cyanate ester functional oxazolinylpolysiloxanes
CN101824157A (zh) * 2010-04-28 2010-09-08 南京大学 以端羟基聚丁二烯改性氰酸酯树脂的方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1025428A (en) * 1963-09-12 1966-04-06 Ici Ltd New and useful silanes and siloxanes
SE421006B (sv) * 1974-03-19 1981-11-16 Mitsubishi Gas Chemical Co Herdbar hartskomposition av en cyanatesterkomponent och en bismaleinsyraimidkomponent
DE2608894A1 (de) 1976-03-04 1977-09-08 Pfersee Chem Fab Verfahren zur herstellung von modifizierten polymerisaten und deren verwendung
JPS54142300A (en) * 1978-04-28 1979-11-06 Mitsubishi Electric Corp Curable polymer composition
JPS5598244A (en) * 1979-01-22 1980-07-26 Fujitsu Ltd Thermosetting resin composition
JPS5939307B2 (ja) * 1980-06-18 1984-09-21 三菱瓦斯化学株式会社 プラスチツク物品
JPS61233060A (ja) * 1985-04-09 1986-10-17 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物
DE3690204T (enExample) * 1985-04-09 1987-04-02
JPH02145622A (ja) * 1988-11-28 1990-06-05 Nippon Soda Co Ltd 硬化性樹脂組成物
JP2653604B2 (ja) * 1992-05-14 1997-09-17 住友ベークライト株式会社 熱硬化性樹脂組成物
US5292861A (en) * 1992-12-29 1994-03-08 International Business Machines Corporation Trifunctional cyanate esters, polymers thereof; use and preparation thereof
US5571609A (en) 1994-10-13 1996-11-05 Rogers Corporation Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof
US6245841B1 (en) 1998-03-23 2001-06-12 General Electric Company Cyanate ester based thermoset compositions
JP2005506422A (ja) * 2001-10-19 2005-03-03 ロンザ ア−ゲ− 硬化性シアネート組成物
US8030431B2 (en) 2001-10-19 2011-10-04 Lonza Ag Hardenable cyanate compositions
DE60231551D1 (de) 2001-12-05 2009-04-23 Isola Laminate Systems Corp Wärmehärtende harzzusammensetzung für hochleistungslaminate
WO2005072031A2 (en) 2004-01-20 2005-08-04 World Properties, Inc. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
US7666509B2 (en) 2006-02-24 2010-02-23 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and metal-foil-clad laminate
US20110037028A1 (en) * 2007-05-16 2011-02-17 Dow Global Technologies Inc. Flame retardant composition
EP2602277B1 (en) 2010-08-06 2014-11-05 Hitachi Chemical Company, Ltd. Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminate
JP2011202175A (ja) * 2011-05-27 2011-10-13 Hitachi Chem Co Ltd シロキサン変性シアネート樹脂組成物、ならびにそれを用いる接着フィルム、樹脂付き金属箔および多層プリント配線板
US8404764B1 (en) 2011-09-22 2013-03-26 Elite Material Co., Ltd. Resin composition and prepreg, laminate and circuit board thereof
TWI447166B (zh) 2012-03-13 2014-08-01 Elite Material Co Ltd Resin composition for insulating film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4797454A (en) * 1987-09-24 1989-01-10 Basf Corporation Curable resin systems containing cyanate ester functional oxazolinylpolysiloxanes
CN101824157A (zh) * 2010-04-28 2010-09-08 南京大学 以端羟基聚丁二烯改性氰酸酯树脂的方法

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AU2014343034A1 (en) 2016-06-09
US20160249451A1 (en) 2016-08-25
TW201522420A (zh) 2015-06-16
SG10201803411UA (en) 2018-06-28
JP7356782B2 (ja) 2023-10-05
EA201690947A1 (ru) 2016-10-31
TWI617594B (zh) 2018-03-11
JP6886292B2 (ja) 2021-06-16
US20160360614A1 (en) 2016-12-08
CA2933155A1 (en) 2015-05-07
CN105873979A (zh) 2016-08-17
KR101819949B1 (ko) 2018-02-28
WO2015065501A1 (en) 2015-05-07
EP3066148B1 (en) 2021-07-14
JP2021119231A (ja) 2021-08-12
EP3066148A4 (en) 2017-08-02
US9332637B2 (en) 2016-05-03
EP3066148A1 (en) 2016-09-14
US9439284B1 (en) 2016-09-06
US20150126684A1 (en) 2015-05-07
US9596753B2 (en) 2017-03-14
KR20160084421A (ko) 2016-07-13
JP2016537496A (ja) 2016-12-01

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