CN105773400A - 具有基层和抛光表面层的抛光垫 - Google Patents
具有基层和抛光表面层的抛光垫 Download PDFInfo
- Publication number
- CN105773400A CN105773400A CN201610217648.3A CN201610217648A CN105773400A CN 105773400 A CN105773400 A CN 105773400A CN 201610217648 A CN201610217648 A CN 201610217648A CN 105773400 A CN105773400 A CN 105773400A
- Authority
- CN
- China
- Prior art keywords
- surface layer
- basic unit
- polished surface
- polishing pad
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/306,845 | 2011-11-29 | ||
US13/306,845 US9067297B2 (en) | 2011-11-29 | 2011-11-29 | Polishing pad with foundation layer and polishing surface layer |
US13/306,849 US9067298B2 (en) | 2011-11-29 | 2011-11-29 | Polishing pad with grooved foundation layer and polishing surface layer |
US13/306,849 | 2011-11-29 | ||
CN201280058372.9A CN104105575B (zh) | 2011-11-29 | 2012-05-16 | 具有基层和抛光表面层的抛光垫 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280058372.9A Division CN104105575B (zh) | 2011-11-29 | 2012-05-16 | 具有基层和抛光表面层的抛光垫 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105773400A true CN105773400A (zh) | 2016-07-20 |
CN105773400B CN105773400B (zh) | 2019-10-25 |
Family
ID=46147791
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610217648.3A Active CN105773400B (zh) | 2011-11-29 | 2012-05-16 | 具有基层和抛光表面层的抛光垫 |
CN201280058372.9A Active CN104105575B (zh) | 2011-11-29 | 2012-05-16 | 具有基层和抛光表面层的抛光垫 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280058372.9A Active CN104105575B (zh) | 2011-11-29 | 2012-05-16 | 具有基层和抛光表面层的抛光垫 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2785496B1 (zh) |
JP (3) | JP6309453B2 (zh) |
KR (3) | KR101819539B1 (zh) |
CN (2) | CN105773400B (zh) |
SG (2) | SG11201402224WA (zh) |
TW (2) | TWI608898B (zh) |
WO (1) | WO2013081665A2 (zh) |
Cited By (3)
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---|---|---|---|---|
CN108326730A (zh) * | 2017-01-20 | 2018-07-27 | 应用材料公司 | 用于cmp应用的薄的塑料抛光用具 |
CN109434568A (zh) * | 2018-10-23 | 2019-03-08 | 青岛韬谱光学科技有限公司 | 一种高面型高粗糙度的光学器件抛光方法 |
CN111032285A (zh) * | 2017-08-25 | 2020-04-17 | 3M创新有限公司 | 表面突起抛光垫 |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9597769B2 (en) * | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
EP3126092B1 (en) * | 2014-04-03 | 2022-08-17 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
JP6295807B2 (ja) * | 2014-04-28 | 2018-03-20 | 株式会社リコー | 研磨具、及び、研磨装置 |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
SG10202002601QA (en) * | 2014-10-17 | 2020-05-28 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
CN104827386B (zh) * | 2015-05-25 | 2018-10-12 | 蓝思科技股份有限公司 | 一种用于蓝宝石镜面抛光用磨头 |
US10144115B2 (en) * | 2015-06-26 | 2018-12-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making polishing layer for chemical mechanical polishing pad |
US10092998B2 (en) * | 2015-06-26 | 2018-10-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making composite polishing layer for chemical mechanical polishing pad |
CN205703794U (zh) * | 2015-06-29 | 2016-11-23 | 智胜科技股份有限公司 | 研磨垫的研磨层 |
US10092991B2 (en) | 2015-07-30 | 2018-10-09 | Jh Rhodes Company, Inc. | Polymeric lapping materials, media and systems including polymeric lapping material, and methods of forming and using same |
JP6584895B2 (ja) * | 2015-09-30 | 2019-10-02 | 富士紡ホールディングス株式会社 | 研磨パッド |
KR20230145211A (ko) * | 2015-10-16 | 2023-10-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 적층 제조 프로세스를 이용하여 진보된 연마 패드를 형성하기 위한 방법 및 장치 |
US9868185B2 (en) * | 2015-11-03 | 2018-01-16 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and window attached thereto |
CN105500183B (zh) * | 2015-11-26 | 2018-08-10 | 上海集成电路研发中心有限公司 | 一种研磨垫及其使用周期检测方法 |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
KR20180113974A (ko) * | 2016-02-26 | 2018-10-17 | 가부시키가이샤 후지미인코퍼레이티드 | 연마 방법, 연마 패드 |
JP2017177265A (ja) * | 2016-03-29 | 2017-10-05 | 株式会社フジミインコーポレーテッド | 研磨パッド |
TWI629297B (zh) | 2016-07-05 | 2018-07-11 | 智勝科技股份有限公司 | 研磨層及其製造方法以及研磨方法 |
KR101884238B1 (ko) * | 2017-01-20 | 2018-08-02 | 에스케이하이닉스 주식회사 | 연마 시스템 및 이를 이용한 평탄화 방법 |
KR101916119B1 (ko) * | 2017-02-06 | 2019-01-30 | 주식회사 리온에스엠아이 | 화학적 기계 연마용 연마패드 |
JPWO2018181347A1 (ja) * | 2017-03-31 | 2020-03-05 | 古河電気工業株式会社 | 研磨パッド |
US11685013B2 (en) | 2018-01-24 | 2023-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad for chemical mechanical planarization |
JP6564106B2 (ja) * | 2018-04-23 | 2019-08-21 | 株式会社三共 | 遊技機 |
JP7026942B2 (ja) * | 2018-04-26 | 2022-03-01 | 丸石産業株式会社 | 研磨パッド用の下敷及び該下敷を使用する研磨方法 |
CN108972381A (zh) * | 2018-07-26 | 2018-12-11 | 成都时代立夫科技有限公司 | 一种cmp抛光垫封边工艺 |
CN109015435A (zh) * | 2018-09-10 | 2018-12-18 | 台山市远鹏研磨科技有限公司 | 一种金刚石塔型砂纸 |
CN109571302B (zh) * | 2018-11-21 | 2021-08-03 | 华侨大学 | 一种基于拉伸强度的半固结磨料抛光工具界面结合强度的表征方法 |
WO2020242172A1 (ko) * | 2019-05-29 | 2020-12-03 | 한국생산기술연구원 | 패턴구조를 갖는 화학기계적 연마용 패드 |
US20210299816A1 (en) * | 2020-03-25 | 2021-09-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp polishing pad with protruding structures having engineered open void space |
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CN113334243B (zh) * | 2021-06-03 | 2023-03-31 | 万华化学集团电子材料有限公司 | 化学机械抛光垫、制备方法及其应用 |
KR102508565B1 (ko) * | 2021-07-01 | 2023-03-10 | 에스씨엠티 주식회사 | 평탄화 공정용 2중층 연마패드 및 그 제조방법 |
JP7441916B2 (ja) * | 2021-10-12 | 2024-03-01 | エスケー エンパルス カンパニー リミテッド | 研磨パッドおよびこれを用いた半導体素子の製造方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111032285A (zh) * | 2017-08-25 | 2020-04-17 | 3M创新有限公司 | 表面突起抛光垫 |
CN109434568A (zh) * | 2018-10-23 | 2019-03-08 | 青岛韬谱光学科技有限公司 | 一种高面型高粗糙度的光学器件抛光方法 |
Also Published As
Publication number | Publication date |
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EP2785496A2 (en) | 2014-10-08 |
KR101685678B1 (ko) | 2016-12-12 |
JP2015503232A (ja) | 2015-01-29 |
JP2016104511A (ja) | 2016-06-09 |
CN104105575A (zh) | 2014-10-15 |
JP2018082213A (ja) | 2018-05-24 |
JP6200530B2 (ja) | 2017-09-20 |
EP2785496B1 (en) | 2021-11-24 |
KR20160098520A (ko) | 2016-08-18 |
KR20140097486A (ko) | 2014-08-06 |
JP6309453B2 (ja) | 2018-04-11 |
JP6805191B2 (ja) | 2020-12-23 |
TWI608898B (zh) | 2017-12-21 |
KR20150103327A (ko) | 2015-09-09 |
TW201534429A (zh) | 2015-09-16 |
SG11201402224WA (en) | 2014-09-26 |
KR101819539B1 (ko) | 2018-01-17 |
KR101825734B1 (ko) | 2018-02-05 |
CN105773400B (zh) | 2019-10-25 |
TWI513545B (zh) | 2015-12-21 |
WO2013081665A2 (en) | 2013-06-06 |
CN104105575B (zh) | 2017-11-14 |
SG10201508090WA (en) | 2015-10-29 |
TW201321131A (zh) | 2013-06-01 |
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