CN105716630B - 一种用于光刻机器的集成传感器系统的电容式感测系统 - Google Patents

一种用于光刻机器的集成传感器系统的电容式感测系统 Download PDF

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Publication number
CN105716630B
CN105716630B CN201610064253.4A CN201610064253A CN105716630B CN 105716630 B CN105716630 B CN 105716630B CN 201610064253 A CN201610064253 A CN 201610064253A CN 105716630 B CN105716630 B CN 105716630B
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CN
China
Prior art keywords
sensor
electrode
sensing system
sensors
capacitive sensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201610064253.4A
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English (en)
Chinese (zh)
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CN105716630A (zh
Inventor
G.德波尔
J.J.J.范巴尔
K.P.帕德耶
R.莫赛尔
N.弗吉尔
S.W.H.K.斯廷布林克
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ASML Holding NV
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ASML Netherlands BV
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Expired - Fee Related legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/023—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D3/00—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups
    • G01D3/028—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure
    • G01D3/036—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
    • G01D5/2417—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying separation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
CN201610064253.4A 2009-12-31 2010-12-29 一种用于光刻机器的集成传感器系统的电容式感测系统 Expired - Fee Related CN105716630B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29141109P 2009-12-31 2009-12-31
US61/291,411 2009-12-31
CN2010800650601A CN102782585A (zh) 2009-12-31 2010-12-29 集成传感器系统

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2010800650601A Division CN102782585A (zh) 2009-12-31 2010-12-29 集成传感器系统

Publications (2)

Publication Number Publication Date
CN105716630A CN105716630A (zh) 2016-06-29
CN105716630B true CN105716630B (zh) 2019-08-23

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Family Applications (6)

Application Number Title Priority Date Filing Date
CN201610064253.4A Expired - Fee Related CN105716630B (zh) 2009-12-31 2010-12-29 一种用于光刻机器的集成传感器系统的电容式感测系统
CN2010800650584A Pending CN102782584A (zh) 2009-12-31 2010-12-29 曝光方法
CN2010800650601A Pending CN102782585A (zh) 2009-12-31 2010-12-29 集成传感器系统
CN201080063434.6A Active CN102753931B (zh) 2009-12-31 2010-12-29 电容式感测系统
CN201511036369.9A Withdrawn CN108151773A (zh) 2009-12-31 2010-12-29 具有差动对的电容式感测系统
CN201080065050.8A Active CN102782444B (zh) 2009-12-31 2010-12-29 具有差动对的电容式感测系统

Family Applications After (5)

Application Number Title Priority Date Filing Date
CN2010800650584A Pending CN102782584A (zh) 2009-12-31 2010-12-29 曝光方法
CN2010800650601A Pending CN102782585A (zh) 2009-12-31 2010-12-29 集成传感器系统
CN201080063434.6A Active CN102753931B (zh) 2009-12-31 2010-12-29 电容式感测系统
CN201511036369.9A Withdrawn CN108151773A (zh) 2009-12-31 2010-12-29 具有差动对的电容式感测系统
CN201080065050.8A Active CN102782444B (zh) 2009-12-31 2010-12-29 具有差动对的电容式感测系统

Country Status (8)

Country Link
US (5) US20110261344A1 (enExample)
EP (4) EP2519859B1 (enExample)
JP (5) JP5784630B2 (enExample)
KR (5) KR101676831B1 (enExample)
CN (6) CN105716630B (enExample)
RU (4) RU2532575C2 (enExample)
TW (5) TW201508243A (enExample)
WO (4) WO2011080309A1 (enExample)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8151995B2 (en) * 2008-02-04 2012-04-10 Texas Instruments Incorporated Methods and apparatus to prevent mold compound feeder jams in systems to package integrated circuits
US20110261344A1 (en) * 2009-12-31 2011-10-27 Mapper Lithography Ip B.V. Exposure method
US8688393B2 (en) * 2010-07-29 2014-04-01 Medtronic, Inc. Techniques for approximating a difference between two capacitances
GB201016556D0 (en) * 2010-10-01 2010-11-17 Senergy Technology Ltd Methods for providing for correcting data and associated apparatus
JP5353991B2 (ja) * 2010-11-30 2013-11-27 株式会社日本自動車部品総合研究所 静電容量式乗員検知装置
KR20120080923A (ko) * 2011-01-10 2012-07-18 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
US9395636B2 (en) * 2011-04-22 2016-07-19 Mapper Lithography Ip B.V. Lithography system for processing a target, such as a wafer, and a method for operating a lithography system for processing a target, such as a wafer
KR102236200B1 (ko) 2011-06-30 2021-04-06 에이에스엠엘 네델란즈 비.브이. 용량성 측정 시스템을 위한 능동 실드
US8933712B2 (en) 2012-01-31 2015-01-13 Medtronic, Inc. Servo techniques for approximation of differential capacitance of a sensor
JP5909822B2 (ja) * 2012-02-27 2016-04-27 アルプス・グリーンデバイス株式会社 電流センサ及びその作製方法
US8961228B2 (en) * 2012-02-29 2015-02-24 Tyco Electronics Corporation Electrical connector having shielded differential pairs
JP6219320B2 (ja) 2012-03-08 2017-10-25 マッパー・リソグラフィー・アイピー・ビー．ブイ． ウェーハなどのターゲットを処理するためのリソグラフィシステム及び方法
US9665014B2 (en) 2012-03-08 2017-05-30 Mapper Lithography Ip B.V. Charged particle lithography system with alignment sensor and beam measurement sensor
DE102012205122B4 (de) * 2012-03-29 2024-06-20 Robert Bosch Gmbh Kapazitives Ortungsgerät
JP5934546B2 (ja) * 2012-03-29 2016-06-15 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
JP5981270B2 (ja) * 2012-08-28 2016-08-31 日置電機株式会社 電圧測定用センサおよび電圧測定装置
JP5981271B2 (ja) * 2012-08-28 2016-08-31 日置電機株式会社 電圧測定用センサおよび電圧測定装置
US9692875B2 (en) * 2012-08-31 2017-06-27 Analog Devices, Inc. Grip detection and capacitive gesture system for mobile devices
TWI464371B (zh) * 2012-10-22 2014-12-11 Pixart Imaging Inc 微機電裝置與製作方法
WO2014113936A1 (en) * 2013-01-23 2014-07-31 Nokia Corporation Method and apparatus for limiting a sensing region of a capacitive sensing electrode
EP2976650B1 (en) * 2013-03-15 2021-05-05 Ilium Technology, Inc. Apparatus and method for measuring electrical properties of matter
TW201504631A (zh) * 2013-07-23 2015-02-01 Mpi Corp 光電元件檢測用之高頻探針卡
CN107272352B (zh) 2013-09-07 2021-02-02 Asml荷兰有限公司 目标处理单元
US9739816B2 (en) * 2013-11-27 2017-08-22 Analog Devices, Inc. Capacitive sensor with differential shield
US9952266B2 (en) 2014-02-14 2018-04-24 Witricity Corporation Object detection for wireless energy transfer systems
JP6452140B2 (ja) * 2014-02-19 2019-01-16 本田技研工業株式会社 距離センサ及び計測方法
KR102224824B1 (ko) * 2014-05-30 2021-03-08 삼성전자 주식회사 Ito 전극패턴을 포함하는 전자장치 및 그 전자장치의 제조방법
US10139869B2 (en) 2014-07-23 2018-11-27 Analog Devices, Inc. Capacitive sensors for grip sensing and finger tracking
US9811218B2 (en) 2014-08-16 2017-11-07 Synaptics Incorporated Location based object classification
KR102432423B1 (ko) * 2014-11-03 2022-08-12 일리노이즈 툴 워크스 인코포레이티드 차량용 센서 시스템을 위한 투과성 전면 히터
UA114724C2 (uk) * 2014-12-23 2017-07-25 Микола Іванович Єпіфанов Автономний модульний пристрій для підвищення безпеки транспортного засобу і кластерний пристрій для його реалізації
DE112016001348T5 (de) * 2015-03-23 2018-02-15 Iee International Electronics & Engineering S.A. Kapazitives Erfassungssystem mit Gerätediagnosekonzept zur Erfassung einer Sensorunterbrechung
KR101679204B1 (ko) * 2015-04-22 2016-11-25 에이디반도체(주) 감지신호 전달 장치 및 이를 이용한 정전용량 센서 장치
CN105185283B (zh) * 2015-10-23 2017-12-08 京东方科技集团股份有限公司 检测装置、基板架、检测基板架上基板位置的方法
DE102016202456B4 (de) 2016-02-17 2017-10-26 Olympus Winter & Ibe Gmbh Chirurgievorrichtung mit Funktionsvorrichtung
JP6650325B2 (ja) * 2016-04-01 2020-02-19 アルプスアルパイン株式会社 入力装置
US9852833B1 (en) * 2016-06-28 2017-12-26 Alcatel-Lucent Usa Inc. Magnetization alignment in a thin-film device
US9725302B1 (en) * 2016-08-25 2017-08-08 Applied Materials, Inc. Wafer processing equipment having exposable sensing layers
JP6775800B2 (ja) * 2016-10-25 2020-10-28 島根県 静電容量型センサ
CN108007327A (zh) * 2016-10-31 2018-05-08 深圳指瑞威科技有限公司 电容式距离传感器
FR3060733B1 (fr) * 2016-12-16 2019-01-25 Fogale Nanotech Dispositif et procede de detection de l'approche et/ou de contact, et de l'appui d'un objet, relativement a une surface de detection
FR3062205B1 (fr) * 2017-01-23 2020-01-31 Fogale Nanotech Dispositif capacitif de detection d'un objet electriquement flottant
EP3855129B1 (en) * 2017-03-22 2023-10-25 Knowles Electronics, LLC Interface circuit for a capacitive sensor
TWI613578B (zh) * 2017-04-10 2018-02-01 友達光電股份有限公司 觸控電極陣列和觸控顯示裝置
EP3612480B1 (en) * 2017-04-21 2024-02-28 Hewlett-Packard Development Company, L.P. Sensors calibration
CN107204325B (zh) * 2017-05-25 2023-06-02 成都线易科技有限责任公司 电容器阵列及制造方法
JP6718622B2 (ja) * 2017-05-26 2020-07-08 株式会社京岡 隙間センサおよび隙間測定方法
JP7094513B2 (ja) * 2017-06-19 2022-07-04 ユニパルス株式会社 厚み測定装置
KR101879285B1 (ko) * 2017-08-01 2018-07-17 송청담 고감도 정전 센서 회로
GB2566053A (en) 2017-08-31 2019-03-06 Weston Aerospace Ltd Sensor and method of manufacturing same
JP7058409B2 (ja) * 2017-09-06 2022-04-22 島根県 設置自由度の高い静電容量型センサ
JP7048043B2 (ja) * 2017-12-26 2022-04-05 島根県 非接触測定システム
KR102394081B1 (ko) * 2018-02-27 2022-05-04 삼성전자주식회사 감지 회로를 이용한 벤딩 정보에 기반하여 동작 모드를 변경하기 위한 방법, 전자 장치 및 저장 매체
CN110221594B (zh) * 2018-03-01 2024-07-12 苏州宝时得电动工具有限公司 电容传感器及自动行走设备
RU2688734C1 (ru) * 2018-04-06 2019-05-22 Общество с ограниченной ответственностью "СБ "Марит" (ООО "СБ "Марит") Емкостное средство обнаружения
ES2950745T3 (es) * 2018-05-16 2023-10-13 Alleima Tube Ab Estructura de tubo metálico con una disposición de sensor
CN108562216B (zh) * 2018-05-30 2020-07-10 华中科技大学 一种基于变压器初级远距离传输的电容位移传感装置
CN108413856B (zh) * 2018-05-30 2020-07-10 华中科技大学 一种基于双变压器远距离隔离传输的电容位移传感装置
EP3594639B1 (de) * 2018-07-13 2022-09-28 Tecan Trading Ag Vorrichtung und verfahren zur kapazitiven füllstandsmessung in flüssigkeitsbehältern
EP3608624B1 (de) * 2018-08-06 2022-06-29 Hexagon Technology Center GmbH Kapazitiver distanzsensor
US11521872B2 (en) * 2018-09-04 2022-12-06 Applied Materials, Inc. Method and apparatus for measuring erosion and calibrating position for a moving process kit
US10847393B2 (en) 2018-09-04 2020-11-24 Applied Materials, Inc. Method and apparatus for measuring process kit centering
US11342210B2 (en) 2018-09-04 2022-05-24 Applied Materials, Inc. Method and apparatus for measuring wafer movement and placement using vibration data
US11404296B2 (en) 2018-09-04 2022-08-02 Applied Materials, Inc. Method and apparatus for measuring placement of a substrate on a heater pedestal
US10794681B2 (en) * 2018-09-04 2020-10-06 Applied Materials, Inc. Long range capacitive gap measurement in a wafer form sensor system
EP3647796B1 (en) * 2018-10-30 2023-06-07 Prysmian S.p.A. Shrinkable cable joint and voltage sensor
TWI812813B (zh) * 2018-11-15 2023-08-21 美商科磊股份有限公司 攝影機系統，寬頻等離子體檢查工具，以及檢查晶圓的方法
US10724964B1 (en) 2019-04-10 2020-07-28 Kla-Tencor Corporation Multi-sensor tiled camera with flexible electronics for wafer inspection
DK3654532T3 (da) * 2018-11-16 2022-06-07 Bently Nevada Llc Proksimitetsregistreringssystem med komponentkompatibilitetstestning
CN109581511B (zh) * 2018-11-23 2020-06-16 辽宁大学 一种基于感应原理的非接触式煤岩带电监测传感器标定系统及方法
US11688617B2 (en) * 2018-12-11 2023-06-27 Rorze Corporation Electrostatic capacitance sensor
US10809048B2 (en) * 2019-01-08 2020-10-20 Formfactor Beaverton, Inc. Probe systems and methods for calibrating capacitive height sensing measurements
DE102019102965A1 (de) * 2019-02-06 2020-08-06 Physik Instrumente (Pi) Gmbh & Co. Kg Haltevorrichtung für eine optische Faser
US10837803B2 (en) 2019-04-12 2020-11-17 Kla Corporation Inspection system with grounded capacitive sample proximity sensor
CN110044253A (zh) * 2019-05-27 2019-07-23 中国工程物理研究院电子工程研究所 一种微马达及内嵌式角度测量装置
RU2722167C1 (ru) * 2019-08-11 2020-05-27 Сергей Викторович Тюрин Способ бесконтактного измерения смещения токоведущего проводника от геометрического центра кабельной жилы
CN112703108B (zh) * 2019-08-13 2023-09-08 法国圣戈班玻璃厂 具有双侧传感器布置的复合玻璃板
RU2717904C1 (ru) * 2019-09-13 2020-03-26 Общество С Ограниченной Ответственностью "Конструкторское Бюро "Дорс" (Ооо "Кб "Дорс") Способ измерения при помощи дифференциального датчика
CN110631465B (zh) * 2019-09-16 2021-04-16 太原理工大学 基于电容原理差动式测量的积灰结渣在线监测装置及方法
CN110779965B (zh) * 2019-10-22 2022-08-02 电子科技大学 一种大面积表面损伤柔性探测装置
US11274037B2 (en) 2019-10-30 2022-03-15 Taiwan Semiconductor Manufacturing Co., Ltd. Dual micro-electro mechanical system and manufacturing method thereof
CN112744779B (zh) * 2019-10-30 2024-02-23 台湾积体电路制造股份有限公司 微机电系统及其制造方法
RU197920U1 (ru) * 2020-01-28 2020-06-05 Акционерное общество "ПК Альматек" Печатная плата устройства для предъявления электрических импульсов при транслингвальной нейростимуляции
US12228537B2 (en) * 2020-04-24 2025-02-18 Agco Corporation Agricultural machines comprising capacitive sensors, and related methods and apparatus
US11646707B2 (en) * 2020-05-21 2023-05-09 Novatek Microelectronics Corp. Analog front end with pulse width modulation current compensation
US11574530B2 (en) 2020-06-04 2023-02-07 Ecolink Intelligent Technology, Inc. Electronic sensor with flexible sensing device
CN112325980B (zh) * 2020-10-30 2024-03-01 中国航空工业集团公司西安航空计算技术研究所 自平衡交流电桥电容式油量传感器采集装置及方法
US11275312B1 (en) * 2020-11-30 2022-03-15 Waymo Llc Systems and methods for verifying photomask cleanliness
JP2023554388A (ja) * 2020-12-16 2023-12-27 サノフイ 電極システム、電子システム、薬物送達デバイス、および電子システムを製造する方法
US11940336B2 (en) * 2021-03-26 2024-03-26 Sporian Microsystems, Inc. Driven-shield capacitive pressure sensor
CN115267345B (zh) * 2021-04-29 2024-11-01 财团法人工业技术研究院 具校正功能的微机电感测装置
CN113720249A (zh) * 2021-09-14 2021-11-30 上海钊晟传感技术有限公司 一种高精度大量程电容位移传感器
CN114396862A (zh) * 2021-11-30 2022-04-26 安徽见行科技有限公司 一种电容位移传感器及其柔性探头、柔性连接线
TWI790857B (zh) 2021-12-15 2023-01-21 財團法人工業技術研究院 差動式電容裝置與差動式電容校準方法
CN114526144B (zh) * 2022-02-25 2023-03-21 潍柴动力股份有限公司 一种NOx传感器安装位置识别方法、装置、车辆及介质
EP4258320A1 (en) 2022-04-08 2023-10-11 ASML Netherlands B.V. Sensor substrate, apparatus, and method
CN114963998B (zh) * 2022-05-09 2025-05-30 国科大杭州高等研究院 一种用于精密激光干涉测量标定的亚纳米级高精度微位移装置及应用
EP4310885A1 (en) 2022-07-21 2024-01-24 ASML Netherlands B.V. Electron-optical apparatus and method of obtaining topographical information about a sample surface
TWI822621B (zh) * 2023-03-30 2023-11-11 力晶積成電子製造股份有限公司 檢測裝置
US12313664B2 (en) 2023-08-18 2025-05-27 Elite Semiconductor Microelectronics Technology Inc. Capacitance measurement circuit
TWI850116B (zh) * 2023-09-21 2024-07-21 晶豪科技股份有限公司 電容量測電路
CN118991500B (zh) * 2024-10-17 2025-01-07 广州特伏科技有限公司 一种移动式新能源充电桩
CN119311156B (zh) * 2024-12-11 2025-06-03 基合半导体（宁波）有限公司 电容式触摸板及电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2131176B (en) * 1982-10-07 1986-02-19 Rolls Royce Method of manufacturing a capacitance distance measuring probe
US6335684B1 (en) * 1998-03-23 2002-01-01 Bayerische Motoren Werke Aktiengesellschaft Method for capacitative object recognition in motor vehicles
CN1708672A (zh) * 2002-10-31 2005-12-14 哈拉尔德·菲利普 电荷转移电容位置传感器

Family Cites Families (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522528A (en) * 1968-02-27 1970-08-04 Trw Inc Noncontacting capacitance distance gauge having a servosystem and a position sensor
SU932208A1 (ru) * 1978-07-17 1982-05-30 Ордена Трудового Красного Знамени Предприятие П/Я А-1742 Устройство дл измерени рассто ний до провод щей поверхности
US4538069A (en) * 1983-10-28 1985-08-27 Control Data Corporation Capacitance height gage applied in reticle position detection system for electron beam lithography apparatus
US4539835A (en) * 1983-10-28 1985-09-10 Control Data Corporation Calibration apparatus for capacitance height gauges
JPS615317A (ja) * 1984-06-18 1986-01-11 Omron Tateisi Electronics Co 自動焦点合わせ装置
SU1195182A1 (ru) * 1984-07-26 1985-11-30 Институт Электродинамики Ан Усср Емкостный измеритель перемещений
US4766368A (en) * 1986-09-30 1988-08-23 Cox Harold A Capacitive sensor
JP2518301B2 (ja) * 1987-09-11 1996-07-24 株式会社ニコン 間隔測定装置
AT393040B (de) 1988-03-03 1991-07-25 Setec Messgeraete Gmbh Kapazitiver naeherungsgeber
JPH01285801A (ja) * 1988-05-12 1989-11-16 Koko Res Kk 近接距離センサー及び形状判別装置
JP2807827B2 (ja) * 1989-07-03 1998-10-08 直之 大纒 静電容量型距離計
US5337353A (en) * 1992-04-01 1994-08-09 At&T Bell Laboratories Capacitive proximity sensors
JP2516666Y2 (ja) * 1992-10-23 1996-11-06 株式会社ミツトヨ 静電容量式変位測定装置
JPH0682506U (ja) * 1993-04-28 1994-11-25 兼子興産株式会社 非接触厚さ計
US5539323A (en) 1993-05-07 1996-07-23 Brooks Automation, Inc. Sensor for articles such as wafers on end effector
JP3520881B2 (ja) * 1995-07-03 2004-04-19 株式会社ニコン 露光装置
JP3328710B2 (ja) 1995-08-23 2002-09-30 オムロン株式会社 半導体静電容量型センサ
WO1997029391A1 (en) 1996-02-09 1997-08-14 Scandmec Ab Device for sensing presence of an electrically conducting object
JPH09280806A (ja) * 1996-04-09 1997-10-31 Nissan Motor Co Ltd 静電容量式変位計
US5844486A (en) 1997-01-02 1998-12-01 Advanced Safety Concepts, Inc. Integral capacitive sensor array
US6075375A (en) * 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
JP3356043B2 (ja) * 1997-12-26 2002-12-09 三菱電機株式会社 レーザ加工装置用距離検出器
US5990473A (en) * 1998-02-04 1999-11-23 Sandia Corporation Apparatus and method for sensing motion in a microelectro-mechanical system
JP3246726B2 (ja) * 1998-11-13 2002-01-15 株式会社ミツトヨ 静電容量式変位検出器及び測定装置
US6249130B1 (en) * 1998-12-21 2001-06-19 Agrichem, Inc. Shielded flat-plate proximity/dielectric properties sensor
WO2000050261A2 (en) * 1999-02-24 2000-08-31 Advanced Safety Concepts, Inc. Capacitive sensors for vehicular environments
JP2001091205A (ja) * 1999-07-22 2001-04-06 Sumitomo Metal Ind Ltd 物体搭載装置
JP4872989B2 (ja) * 1999-07-22 2012-02-08 東京エレクトロン株式会社 静電容量型センサ部品、物体搭載体、半導体製造装置および液晶表示素子製造装置
GB0000619D0 (en) * 2000-01-13 2000-03-01 British Aerospace Accelerometer
US6633050B1 (en) 2000-08-15 2003-10-14 Asml Holding Nv. Virtual gauging system for use in lithographic processing
US7561270B2 (en) * 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
EP1231515B1 (en) * 2001-02-08 2008-11-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US6859260B2 (en) * 2001-04-25 2005-02-22 Asml Holding N.V. Method and system for improving focus accuracy in a lithography system
JP3980387B2 (ja) * 2002-03-20 2007-09-26 富士通株式会社 容量検出型センサ及びその製造方法
US20040207395A1 (en) * 2002-04-08 2004-10-21 Moshe Sarfaty Eddy current-capacitance sensor for conducting film characterization
CN100359626C (zh) * 2002-06-15 2008-01-02 Nfab有限公司 粒子束发生器
FI115109B (fi) * 2003-01-22 2005-02-28 Nokia Corp Tunnistusjärjestely ja tunnistusjärjestelyn käsittävä matkaviestin
JP4067053B2 (ja) * 2003-03-13 2008-03-26 キヤノン株式会社 静電容量センサ式計測装置
JP4054693B2 (ja) * 2003-02-27 2008-02-27 株式会社ミツトヨ 静電容量式変位測定器
US7114399B2 (en) * 2003-03-19 2006-10-03 Ade Corporation Shaped non-contact capacitive displacement sensors for measuring shaped targets
JP4029770B2 (ja) * 2003-05-15 2008-01-09 オムロン株式会社 厚み検出センサ
JP4042973B2 (ja) * 2003-11-07 2008-02-06 株式会社日本自動車部品総合研究所 非接触式車両用接近体検出装置
JP2005156492A (ja) 2003-11-28 2005-06-16 Agilent Technol Inc 可動機構、測定装置、静電容量式距離測定装置、および、位置決め装置
JP2005175173A (ja) 2003-12-10 2005-06-30 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
US20050134865A1 (en) * 2003-12-17 2005-06-23 Asml Netherlands B.V. Method for determining a map, device manufacturing method, and lithographic apparatus
JP2005183744A (ja) * 2003-12-22 2005-07-07 Nikon Corp 露光装置及びデバイス製造方法
WO2005071491A2 (en) 2004-01-20 2005-08-04 Carl Zeiss Smt Ag Exposure apparatus and measuring device for a projection lens
WO2005088686A1 (ja) * 2004-03-16 2005-09-22 Nikon Corporation 段差計測方法及び装置、並びに露光方法及び装置
US6989679B2 (en) 2004-06-03 2006-01-24 General Electric Company Non-contact capacitive sensor and cable with dual layer active shield
JP4356570B2 (ja) * 2004-09-16 2009-11-04 沖電気工業株式会社 静電容量型距離センサ
CN100483625C (zh) * 2004-12-02 2009-04-29 株式会社尼康 曝光装置、曝光方法以及器件制造方法
KR20060082223A (ko) * 2005-01-11 2006-07-18 삼성전자주식회사 화상인식 반도체 모듈
US7342641B2 (en) * 2005-02-22 2008-03-11 Nikon Corporation Autofocus methods and devices for lithography
US7208960B1 (en) * 2006-02-10 2007-04-24 Milliken & Company Printed capacitive sensor
US7395717B2 (en) * 2006-02-10 2008-07-08 Milliken & Company Flexible capacitive sensor
DE112007000433T5 (de) * 2006-02-21 2009-01-02 Cyberoptics Semiconductor, Inc., Beaverton Kapazitive Abstandsmessung bei Halbleiterverarbeitungswerkzeugen
US7586173B2 (en) * 2006-02-27 2009-09-08 Edwards Lifesciences Corporation Method and apparatus for using flex circuit technology to create a reference electrode channel
KR101356142B1 (ko) * 2006-03-13 2014-01-24 마이크로칩 테크놀로지 저머니 Ⅱ 게엠베하 운트 콤파니 카게 전기장 발생 장치 및 이를 포함하는 센서 장치
JP4828316B2 (ja) * 2006-06-13 2011-11-30 三菱電機株式会社 レーザ加工機用のギャップ検出装置及びレーザ加工システム並びにレーザ加工機用のギャップ検出方法
RU2338997C2 (ru) * 2006-07-13 2008-11-20 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт "Электроприбор" Способ измерения зазора между электродами и подвижной массой микромеханического устройства и устройство для его реализации
RU2318183C1 (ru) * 2006-08-09 2008-02-27 Общество С Ограниченной Ответственностью "Диамех 2000" Устройство для измерения воздушного зазора
US20080079920A1 (en) * 2006-09-29 2008-04-03 Heiko Hommen Wafer exposure device and method
JP4609731B2 (ja) 2006-10-31 2011-01-12 株式会社デンソー 静電容量式乗員検知センサ
JP2008111758A (ja) * 2006-10-31 2008-05-15 Yamatake Corp 容量式電磁流量計
NL1036009A1 (nl) * 2007-10-05 2009-04-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
JP2009109208A (ja) * 2007-10-26 2009-05-21 Ono Sokki Co Ltd 測定装置および測定方法
NL1036069A1 (nl) * 2007-10-30 2009-05-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
NL1036547A1 (nl) * 2008-02-20 2009-08-24 Asml Holding Nv Gas gauge compatible with vacuum environments.
NL1036516A1 (nl) * 2008-03-05 2009-09-08 Asml Netherlands Bv Lithographic apparatus and method.
NL1036709A1 (nl) * 2008-04-24 2009-10-27 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
US8872771B2 (en) * 2009-07-07 2014-10-28 Apple Inc. Touch sensing device having conductive nodes
US20110261344A1 (en) * 2009-12-31 2011-10-27 Mapper Lithography Ip B.V. Exposure method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2131176B (en) * 1982-10-07 1986-02-19 Rolls Royce Method of manufacturing a capacitance distance measuring probe
US6335684B1 (en) * 1998-03-23 2002-01-01 Bayerische Motoren Werke Aktiengesellschaft Method for capacitative object recognition in motor vehicles
CN1708672A (zh) * 2002-10-31 2005-12-14 哈拉尔德·菲利普 电荷转移电容位置传感器

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