CN105457855B - 用漆涂覆衬底的方法和用于平面化漆层的设备 - Google Patents

用漆涂覆衬底的方法和用于平面化漆层的设备 Download PDF

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CN105457855B
CN105457855B CN201510612238.4A CN201510612238A CN105457855B CN 105457855 B CN105457855 B CN 105457855B CN 201510612238 A CN201510612238 A CN 201510612238A CN 105457855 B CN105457855 B CN 105457855B
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solvent
substrate
lacquer
atmosphere
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卡特琳·费舍尔
佛罗莱恩·帕利奇卡
约翰内斯·普拉滕
金子健人
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Suess Microtec Lithography GmbH
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Abstract

本发明涉及一种用漆涂覆衬底(26)的方法,其包括以下步骤:‑对衬底(26)均匀地施加漆,‑降低对衬底(26)施加的漆(30)的溶剂比例,‑将涂覆的衬底(26)暴露于溶剂氛,本发明还涉及一种用于平面化漆层的设备。

Description

用漆涂覆衬底的方法和用于平面化漆层的设备
本发明涉及用漆涂覆衬底的方法和用于平面化衬底上的漆层的设备。
微米和纳米制造工艺通常使用漆,所述漆以层施加到待处理的衬底上。在这些漆的帮助下,有可能产生例如衬底上的掩模,在其帮助下可以产生所需的结构或者可以在衬底上实现加工。为了这个目的,所述漆是例如光敏的,从而使得所需的结构可以在光学成像的帮助下从光掩模传递到光敏漆。
为了达到最佳结果,非常重要的是所施加的漆层不含有任何不规则(irregularities)和颗粒。除了旋转方法,也使用喷射法将漆施加到衬底上,在喷射法中,通过喷嘴将漆喷射到衬底上。尤其在衬底具有表面形貌的情况下,即,衬底本身已经在其表面上具有垂直的三维结构,以只通过喷涂漆的经济方式可以实现尽可能均匀的漆层。
然而,由于一定数量的漆滴在喷嘴和衬底之间飞行时变干,然后已经作为(几乎)固化的漆颗粒撞击衬底的表面上或者在该位置处存在的漆,因此,当喷涂漆时,漆颗粒在漆层上形成。这些漆颗粒在喷涂的漆层上聚集并且在进一步的加工期间(例如,在暴露于光期间)造成问题,并最终导致所产生的结构上的局部缺陷。
本发明的目的是提供一种方法和一种设备,其中,施加在衬底上的漆层平坦并且不含有漆颗粒。
该目的通过用漆涂覆衬底的方法实现,其中将漆均匀地施加到衬底上,然后降低施加到衬底的漆的溶剂比例,随后将涂覆的衬底暴露于溶剂氛。由于涂覆的衬底暴露于溶剂氛,已经在衬底上形成的漆颗粒溶解。然而,由于衬底的溶剂比例已经预先降低,因此确保即便是在溶剂氛中操作期间,对衬底施加的漆不会进一步流动或者开始再次流动。因此确保即便是在可能提供的表面形貌的陡峭倾斜点处,衬底保持完全地涂覆有漆。
直到衬底暴露于溶剂氛时和衬底暴露于溶剂氛期间,所施加的漆的溶剂比例必须保持在一范围内,在该范围内所施加的漆的粘度足够高以确保漆不再流动。同时,必须不能将溶剂比例降低到使得漆颗粒或者不规则不再能够被溶剂氛溶解。
在这方面,术语“漆”应理解成溶剂和适于所需的应用的漆的混合物。
在已暴露于溶剂氛之后,优选加热涂覆的衬底,由此所施加的漆经历软烘。软烘降低漆的溶剂比例到漆完全硬化并且可以进一步加工(例如,暴露于光)的程度。
可以将涂覆的衬底暴露于真空以便以所需的方式降低对衬底施加的漆的溶剂比例。以这种方式,挥发性溶剂的一部分蒸发,所以漆的粘度增加。
真空应被理解为小于0.3巴的压力。
在一个实施方案变化中,加热涂覆的衬底以便降低对衬底施加的漆的溶剂比例,由此漆的粘度同样增加。
在本发明一个实施方案中,溶剂氛具有至少50摩尔%,尤其是至少70摩尔%的溶剂比例。已经证明这些值特别适于溶解从而去除所施加的漆上的不规则和漆颗粒。
溶剂可以是丙酮或甲基乙基酮,由此可以使用便宜的已知溶剂。
在本发明的一个实施方案中,溶剂氛的温度高于溶剂的沸点,从而防止溶剂的凝结,这会导致不希望的溶剂液滴。这些液滴是不希望的,因为它们可以以不受控制的方式滴到涂覆的漆上并破坏漆层。
例如,溶剂氛的压力大于或等于0.5巴,特别是大于或等于0.7巴,由此确保可靠地去除漆颗粒和不规则。
涂覆的衬底可以在溶剂氛中暴露480s或更少,特别是420s或更少。这段时间足够长使漆颗粒溶解并且不规则变平坦,但是又足够短使所施加的漆不会开始再次溶解和开始流动。
在本发明的一个实施方案变化中,通过喷射将漆均匀地施加到衬底,由此即便该衬底具有表面形貌,可以以尝试和测试的方式均匀地涂覆衬底。
所述目标还通过平面化衬底上的漆层的设备实现,所述设备具有处理室,设计用于降低漆层的溶剂比例的干燥设备,和可以在处理室中产生溶剂氛的蒸发器。该设备能够干燥漆层(即,降低漆的溶剂比例)到漆层不再流动的程度。另外,通过溶剂氛可以去除漆层上的不规则和漆颗粒。
因此,术语“蒸发器”并不限于从固体或者液体产生气体的设备。该术语还包括能够在处理室中产生溶剂氛的其他设备,例如,具有合适的阀的气体储存容器。
优选地,所述设备具有涂覆设备,其可以将漆层均匀地施加到衬底,尤其是可以喷射漆。以这种方式,以尝试和测试的方式,可以在衬底上,尤其是在具有表面形貌的衬底上产生均匀的漆层。
例如,干燥设备具有真空泵和/或至少一个文丘里喷嘴,其可以在处理室中产生真空,从而溶剂从施加的漆层蒸发并且漆层的溶剂比例降低。
在一个实施方案变化中,干燥设备是加热设备,其可以加热漆层,因此所施加的漆层的溶剂比例同样地降低。
在本发明的一个实施方案中,所述设备具有加热系统,其可以加热处理室中的气氛,由此可以控制处理室中的气氛的温度。例如,通过该加热系统也可以加热所施加的漆层。
在本发明的一个实施方案中,蒸发器产生具有至少50摩尔%,尤其是至少70摩尔%的溶剂比例的溶剂氛,由此确保气氛中的溶剂浓度足够高以弄平不规则和溶解漆颗粒。
参照以下描述和附图,本发明的进一步的特征和优点将是明显的。在附图中:
图1示出根据本发明的第一实施方案的根据本发明的设备的示意图。
图2示出根据本发明的第二实施方案的根据本发明的设备的示意图。
图3a到3c示意性地示出了处于根据本发明的方法的不同时间点的待涂覆的衬底的截面图。
图1示意性地示出了用于涂覆和处理衬底的设备10。所述衬底是例如后续进一步处理的半导体。
设备10具有其中设置有衬底架14的处理室12。蒸发器16和干燥设备18连接至处理室12。
此外,设备10可以设置有涂覆设备20。
设备10还具有加热系统22,其布置在处理室12中并且其可以在处理室12内加热气氛。
加热系统22可以由例如处理室12中的加热棒或线圈形成。
在图示说明的实施方案中,涂覆设备20具有喷嘴24,利用喷嘴24可以用漆均匀地喷射在衬底架14上设置的衬底26。
在第一实施方案中,干燥设备18具有真空泵28,其与处理室12处于流体连通并且可抽空该室。例如,真空泵28可以将处理室12内的压力降低到0.2巴。
此外,干燥设备18可以具有用于处理室12的抽空的至少一个文丘里喷嘴。
蒸发器16以这种方式形成从而其可以在处理室12中产生溶剂氛。为此目的,其同样地与处理室12处于流体连通。
蒸发器16可以具有例如充满溶剂的气体洗涤瓶,通过该瓶供给气体流,特别是氮气流,由此蒸发溶剂。然后,将蒸发的溶剂与氮气一起引入处理室12。
当然,可以以其他方式提供溶剂氛,例如热或者机械蒸发溶剂或者使用以气态形式提供溶剂的储溶剂器。
由蒸发器16产生的溶剂氛的溶剂比例为至少50摩尔%,尤其是至少70摩尔%。
溶剂是例如丙酮或甲基乙基酮。
参照图3a至3c,下文描述了在设备的帮助下实施的用漆涂覆衬底并且平面化对衬底26施加的漆层的方法。
图3示出了待涂覆的衬底26的截面的示意截面图。在方法的开始,衬底26是未涂覆的并且无污垢。
为了简化,所示的衬底26在这种情况下以平面方式示出。然而,根据本发明的方法也同样地适用于具有垂直的、三维表面形貌的衬底。
在涂覆设备20的帮助下,将漆(其是适于所需的应用的漆和溶剂的混合物)例如通过喷射均匀地涂覆到衬底26上。
图3b表明具有涂覆的漆层的衬底26。
可以看出,在这种情况下,漆具有局部不规则32。漆颗粒34也可以在漆层30上聚集。例如,由于由喷嘴24产生的各个漆颗粒在飞向衬底26时变干和形成空心球体,可以形成这些漆颗粒34。
由于漆颗粒34以及不规则32可以损害进一步的纳米或者微米制造工艺的质量,漆颗粒34和不规则32都是不希望的。
为了去除不规则32和漆颗粒34,干燥对衬底26施加的漆(即,漆层30),由此降低漆层30的溶剂比例。
由于通过真空泵28和/或文丘里喷嘴对处理室12抽真空,这可能发生。例如,可以在处理室12中产生0.2巴的压力。因此,涂覆的衬底26暴露于真空。
通过负压蒸发漆的部分溶剂,从而降低漆层30的溶剂比例。具有降低的溶剂比例的漆层30现在具有增加的粘度,因此漆层30不能再流动。
这对于具有表面形貌的衬底尤其明显,因为过度的液体漆将流入衬底中的凹部和凹陷,因此更高的拐角和边缘将仍然没有足够的漆层。
随后在蒸发器16的帮助下,然后将气态溶剂(例如丙酮或甲基乙基酮)引入处理室12中,因此在处理室12中形成溶剂氛。
已经证明,在溶剂氛中特别适合使用的溶剂比例是至少50摩尔%,尤其是至少70摩尔%。
溶剂氛的压力优选大于或等于0.5巴,特别是大于或等于0.7巴。
如果需要的话,在加热系统22的帮助下,可以加热处理室12,从而增加溶剂氛的温度,例如,达到溶剂的沸腾温度以上的温度。
处理室12中的溶剂氛对漆层作用几分钟。已经证明,不超过480秒的停留时间特别适用,特别优选不超过420秒。
因此,将衬底26暴露于溶剂氛的时间起点或终点可以根据溶剂氛的溶剂比例超过或者低于特定值(例如50摩尔%或70摩尔%)来限定。
在具有漆层30的涂覆衬底26已经暴露于溶剂氛之后,从处理室12移除溶剂氛。当例如处理室12充满惰性气体(例如氮)时这发生。然而,该步骤也可以在真空泵28和/或文丘里喷嘴的帮助下发生。
已经将不规则32弄平并且漆层30上的漆颗粒34已经由溶剂氛中的气态溶剂溶解,因此产生了漆层30的均匀和平坦表面。因此,漆层30(几乎)没有不规则32和漆颗粒34。图3c中示出暴露于溶剂氛之后的衬底26。
现在可以加热具有漆层30的涂覆衬底26,因此对漆层30进行软烘。
然后进一步加工(例如暴露于光)具有漆层30的涂覆的衬底26。
溶剂氛的压力、温度和溶剂比例以及衬底暴露于该溶剂氛的时间和其他参数以举例的方式给出并且必须例如适于所使用的溶剂和所使用的漆以便达到最佳结果。
图2示出设备10的第二实施方案。它基本上对应于根据图1的第一实施方案,因此类似和功能上等同的部分由相同的附图标记标示。下文仅讨论区别。
第二实施方案的设备10的干燥设备18不具有真空泵,而是加热设备36。
加热设备36设置在例如衬底架14中并且可以加热衬底26和可以对其施加的漆层30。
根据第二实施方案通过设备10实施的方法同样地基本上对应于已经描述的方法。然而,以另一种方式降低对衬底26施加的漆(即,漆层30)的溶剂比例。
加热设备36加热具有漆层30的涂覆的衬底26,因此,漆层30中的溶剂部分地蒸发,由此漆层30的溶剂比例降低。
此外,通过在处理室12和设备10的周围环境之间的通风井中设置的风扇40可以从处理室12排出处理室12中产生的溶剂氛。
当然,所说明的实施方案的特征可以根据需要彼此组合。例如,设备10包括加热设备36以及真空泵28两者是可行的。由于在将溶剂氛引入处理室12之前可以排空处理室12,因此能够产生极纯的溶剂氛。
同样可行的是通过这些相同的加热元件形成加热设备36和加热系统22,利用这些加热元件,可以加热处理室12、和因此加热溶剂氛以及涂覆的衬底26。

Claims (13)

1.一种用漆涂覆衬底(26)的方法,其中待涂覆的衬底是半导体,所述方法包括以下步骤:
-对衬底(26)均匀地施加漆,
-降低对衬底(26)施加的漆(30)的溶剂比例,
-将涂覆的衬底(26)暴露于溶剂氛;
其中,直到衬底暴露于溶剂氛时和衬底暴露于溶剂氛期间,所施加的漆的溶剂比例保持在一范围内,在所述范围内所施加的漆的粘度足够高以确保漆不再流动。
2.根据权利要求1所述的方法,其特征在于,在暴露于所述溶剂氛之后加热所述涂覆的衬底,因此,所施加的漆(30)经历软烘。
3.根据权利要求1或2所述的方法,其特征在于,为了降低对衬底(26)施加的漆(30)的溶剂比例,将所述涂覆的衬底暴露于真空。
4.根据权利要求1或2所述的方法,其特征在于,为了降低对衬底(26)施加的漆(30)的溶剂比例,加热所述涂覆的衬底(26)。
5.根据权利要求1或2所述的方法,其特征在于,所述溶剂氛具有至少50摩尔%的溶剂比例。
6.根据权利要求5所述的方法,其特征在于,所述溶剂氛具有至少70摩尔%的溶剂比例。
7.根据权利要求1或2所述的方法,其特征在于,所述溶剂氛的溶剂是丙酮或者甲基乙基酮。
8.根据权利要求1或2所述的方法,其特征在于,所述溶剂氛的温度为溶剂的沸点以上。
9.根据权利要求1或2所述的方法,其特征在于,所述溶剂氛的压力大于或者等于0.5巴。
10.根据权利要求9所述的方法,其特征在于,所述溶剂氛的压力大于或者等于0.7巴。
11.根据权利要求1或2所述的方法,其特征在于,涂覆的衬底(26)暴露于所述溶剂氛480秒或更少。
12.根据权利要求11所述的方法,其特征在于,涂覆的衬底(26)暴露于所述溶剂氛420秒或更少。
13.根据权利要求1或2所述的方法,其特征在于,通过喷射将漆均匀地施加到衬底上。
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