CN105431778A - 感光性树脂组合物 - Google Patents

感光性树脂组合物 Download PDF

Info

Publication number
CN105431778A
CN105431778A CN201480042096.6A CN201480042096A CN105431778A CN 105431778 A CN105431778 A CN 105431778A CN 201480042096 A CN201480042096 A CN 201480042096A CN 105431778 A CN105431778 A CN 105431778A
Authority
CN
China
Prior art keywords
epoxy resin
photosensitive polymer
polymer combination
mass parts
phenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480042096.6A
Other languages
English (en)
Chinese (zh)
Inventor
布施好章
吉野利纯
小岛正幸
大崎真也
佐藤邦明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN105431778A publication Critical patent/CN105431778A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/144—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN201480042096.6A 2013-08-02 2014-08-01 感光性树脂组合物 Pending CN105431778A (zh)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2013-161893 2013-08-02
JP2013161893 2013-08-02
JP2013-161888 2013-08-02
JP2013161885 2013-08-02
JP2013161886 2013-08-02
JP2013-161886 2013-08-02
JP2013-161890 2013-08-02
JP2013161890 2013-08-02
JP2013-161885 2013-08-02
JP2013161888 2013-08-02
PCT/JP2014/070400 WO2015016362A1 (ja) 2013-08-02 2014-08-01 感光性樹脂組成物

Publications (1)

Publication Number Publication Date
CN105431778A true CN105431778A (zh) 2016-03-23

Family

ID=52431885

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480042096.6A Pending CN105431778A (zh) 2013-08-02 2014-08-01 感光性树脂组合物

Country Status (5)

Country Link
JP (1) JP6455433B2 (ja)
KR (4) KR20160039579A (ja)
CN (1) CN105431778A (ja)
TW (2) TWI691792B (ja)
WO (1) WO2015016362A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108957954A (zh) * 2018-08-03 2018-12-07 广东泰亚达光电有限公司 一种新型激光直描成像干膜及其制备方法
WO2019173967A1 (en) * 2018-03-13 2019-09-19 Hitachi Chemical Company, Ltd. Photosensitizer, photosensitive resin composition, photosensitive element, and method of producing wiring board
WO2019173966A1 (en) * 2018-03-13 2019-09-19 Hitachi Chemical Company, Ltd. Photosensitizer, photosensitive resin composition, photosensitive element, and method of producing wiring board
CN111406233A (zh) * 2017-12-06 2020-07-10 日本化药株式会社 感光性树脂组合物、干膜抗蚀剂及树脂组合物与干膜抗蚀剂的硬化物
CN111624852A (zh) * 2019-02-28 2020-09-04 东京应化工业株式会社 感光性树脂组合物及玻璃基板的蚀刻方法
CN112485968A (zh) * 2019-09-11 2021-03-12 株式会社田村制作所 感光性树脂组合物、干膜及具有感光性树脂组合物的光固化物的印制电路板

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6710059B2 (ja) * 2015-02-26 2020-06-17 マクセルホールディングス株式会社 配列用マスク及びその製造方法、半田バンプの形成方法
JP7018168B2 (ja) 2015-12-22 2022-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法
US20190031790A1 (en) * 2016-01-12 2019-01-31 Hitachi Chemical Company, Ltd. Photosensitive resin composition, dry film using same, printed wiring board, and method for manufacturing printed wiring board
CN105428245B (zh) * 2016-01-26 2019-03-01 京东方科技集团股份有限公司 像素结构及其制备方法、阵列基板和显示装置
JPWO2018179259A1 (ja) * 2017-03-30 2020-06-18 日立化成株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及び、プリント配線板の製造方法
JP6601634B2 (ja) * 2017-03-31 2019-11-06 協立化学産業株式会社 変性樹脂及びそれを含む硬化性樹脂組成物
US11022880B2 (en) * 2017-10-25 2021-06-01 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and mercapto compound
CN112424289A (zh) * 2018-08-01 2021-02-26 东丽株式会社 树脂组合物、树脂片、固化膜、固化膜的制造方法、半导体装置及显示装置
JP7216506B2 (ja) * 2018-09-11 2023-02-01 太陽インキ製造株式会社 めっきレジスト用感光性樹脂組成物、ドライフィルムおよびプリント配線板の製造方法
JP7270204B2 (ja) * 2018-11-09 2023-05-10 互応化学工業株式会社 皮膜の製造方法及びプリント配線板
CN113929624A (zh) * 2020-07-13 2022-01-14 常州强力电子新材料股份有限公司 一种吡唑啉类化合物、感光性树脂组合物及图形化方法
CN114437406B (zh) * 2020-11-06 2024-06-04 中国石油化工股份有限公司 复配型抗氧剂和丁二烯橡胶组合物及其应用
CN115128901A (zh) 2021-03-26 2022-09-30 太阳油墨制造株式会社 感光性树脂组合物、固化物、印刷布线板、及印刷布线板的制造方法
WO2023073799A1 (ja) * 2021-10-26 2023-05-04 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1945429A (zh) * 2005-10-05 2007-04-11 旭化成电子材料元件株式会社 感光性树脂组合物及层压体
CN101681107A (zh) * 2007-05-11 2010-03-24 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀剂图形的形成方法以及印刷电路板的制造方法
CN102138104A (zh) * 2008-09-04 2011-07-27 日立化成工业株式会社 半导体封装用印刷电路板的保护膜用感光性树脂组合物
CN102385247A (zh) * 2010-09-01 2012-03-21 住友化学株式会社 感光性树脂组合物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3247091B2 (ja) 1997-11-28 2002-01-15 日立化成工業株式会社 光硬化性樹脂組成物及びこれを用いた感光性エレメント
JP4240885B2 (ja) 2001-12-28 2009-03-18 日立化成工業株式会社 フレキシブル配線板の保護膜を形成する方法
JP4651524B2 (ja) * 2005-07-22 2011-03-16 富士フイルム株式会社 パターン形成材料、並びに、パターン形成装置及びパターン形成方法
JP2007078890A (ja) * 2005-09-12 2007-03-29 Fujifilm Corp 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
JP4708238B2 (ja) * 2006-03-24 2011-06-22 富士フイルム株式会社 感光性フィルム、永久パターン形成方法、及びプリント基板
KR101395375B1 (ko) * 2006-03-29 2014-05-14 다이요 홀딩스 가부시키가이샤 광경화성ㆍ열경화성 수지 조성물 및 그의 경화물 및 그것을이용하여 얻어지는 인쇄 배선판
JP2010235739A (ja) 2009-03-31 2010-10-21 Toyo Ink Mfg Co Ltd 感光性黒色組成物
JP5325805B2 (ja) * 2010-01-29 2013-10-23 株式会社タムラ製作所 感光性樹脂組成物およびその硬化膜を用いたプリント配線板
KR101151244B1 (ko) 2010-06-07 2012-06-14 고려대학교 산학협력단 유도 전동기 공극 편심 진단 방법, 장치, 및 상기 방법을 실행시키기 위한 컴퓨터 프로그램을 기록한 매체

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1945429A (zh) * 2005-10-05 2007-04-11 旭化成电子材料元件株式会社 感光性树脂组合物及层压体
CN101681107A (zh) * 2007-05-11 2010-03-24 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀剂图形的形成方法以及印刷电路板的制造方法
CN102138104A (zh) * 2008-09-04 2011-07-27 日立化成工业株式会社 半导体封装用印刷电路板的保护膜用感光性树脂组合物
CN102385247A (zh) * 2010-09-01 2012-03-21 住友化学株式会社 感光性树脂组合物

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111406233A (zh) * 2017-12-06 2020-07-10 日本化药株式会社 感光性树脂组合物、干膜抗蚀剂及树脂组合物与干膜抗蚀剂的硬化物
CN111406233B (zh) * 2017-12-06 2023-12-26 日本化药株式会社 感光性树脂组合物、干膜抗蚀剂及其硬化物
WO2019173967A1 (en) * 2018-03-13 2019-09-19 Hitachi Chemical Company, Ltd. Photosensitizer, photosensitive resin composition, photosensitive element, and method of producing wiring board
WO2019173966A1 (en) * 2018-03-13 2019-09-19 Hitachi Chemical Company, Ltd. Photosensitizer, photosensitive resin composition, photosensitive element, and method of producing wiring board
CN108957954A (zh) * 2018-08-03 2018-12-07 广东泰亚达光电有限公司 一种新型激光直描成像干膜及其制备方法
CN111624852A (zh) * 2019-02-28 2020-09-04 东京应化工业株式会社 感光性树脂组合物及玻璃基板的蚀刻方法
CN112485968A (zh) * 2019-09-11 2021-03-12 株式会社田村制作所 感光性树脂组合物、干膜及具有感光性树脂组合物的光固化物的印制电路板

Also Published As

Publication number Publication date
JP6455433B2 (ja) 2019-01-23
TWI683186B (zh) 2020-01-21
KR20210046830A (ko) 2021-04-28
KR20230124105A (ko) 2023-08-24
KR20210150619A (ko) 2021-12-10
TWI691792B (zh) 2020-04-21
JPWO2015016362A1 (ja) 2017-03-02
TW201937290A (zh) 2019-09-16
KR20160039579A (ko) 2016-04-11
KR102570738B1 (ko) 2023-08-25
WO2015016362A1 (ja) 2015-02-05
TW201523150A (zh) 2015-06-16

Similar Documents

Publication Publication Date Title
CN105431778A (zh) 感光性树脂组合物
CN104937492B (zh) 感光性树脂组合物、使用其的干膜、印刷配线板及印刷配线板的制造方法
KR102652536B1 (ko) 감광성 수지 조성물, 그것을 사용한 드라이 필름, 프린트 배선판, 및 프린트 배선판의 제조 방법
JP5098411B2 (ja) 感光性樹脂組成物、並びにこれを用いた感光性フィルム及び感光性永久レジスト
CN102138104A (zh) 半导体封装用印刷电路板的保护膜用感光性树脂组合物
CN101526740A (zh) 可低温固化的感光性树脂组合物
TW201035680A (en) Photosensitive resin composition
JP2016177174A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TWI775993B (zh) 硬化性樹脂組成物、乾膜、硬化物及印刷配線板
CN105408816A (zh) 感光性树脂组合物
TW201905116A (zh) 噴墨用硬化性組成物套組、硬化物、其製造方法、印刷配線板及扇出型之晶圓級封裝
CN109388020A (zh) 感光性树脂组合物、干膜、固化物和印刷电路板
JP6519134B2 (ja) 感光性樹脂組成物
JP6582804B2 (ja) 感光性樹脂組成物
TW202104419A (zh) 硬化性樹脂組成物、乾膜、硬化物以及電子零件
JP2016066006A (ja) 感光性樹脂組成物
JP2016066005A (ja) 感光性樹脂組成物
CN110521290A (zh) 感光性树脂组合物、使用了其的干式膜、印刷布线板及印刷布线板的制造方法
JP2015031849A (ja) 感光性樹脂組成物
JP7415443B2 (ja) 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及び、プリント配線板の製造方法
JP2020166211A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板、および電子部品
JP5268233B2 (ja) エポキシ樹脂、エポキシ樹脂組成物、並びにその硬化物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20160323

RJ01 Rejection of invention patent application after publication