CN105023902A - 半导体用接合线 - Google Patents
半导体用接合线 Download PDFInfo
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- CN105023902A CN105023902A CN201510431505.8A CN201510431505A CN105023902A CN 105023902 A CN105023902 A CN 105023902A CN 201510431505 A CN201510431505 A CN 201510431505A CN 105023902 A CN105023902 A CN 105023902A
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- palladium
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- copper
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C5/04—Alloys based on a platinum group metal
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- C22C5/02—Alloys based on gold
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Abstract
Description
Claims (12)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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JP2009177315A JP5497360B2 (ja) | 2009-07-30 | 2009-07-30 | 半導体用ボンディングワイヤー |
JP2009-177315 | 2009-07-30 | ||
JP2009-226464 | 2009-09-30 | ||
JP2009226464A JP4637256B1 (ja) | 2009-09-30 | 2009-09-30 | 半導体用ボンディングワイヤー |
CN201080019191.6A CN102422404B (zh) | 2009-07-30 | 2010-07-16 | 半导体用接合线 |
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CN201080019191.6A Division CN102422404B (zh) | 2009-07-30 | 2010-07-16 | 半导体用接合线 |
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CN105023902A true CN105023902A (zh) | 2015-11-04 |
CN105023902B CN105023902B (zh) | 2018-01-30 |
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CN201080019191.6A Active CN102422404B (zh) | 2009-07-30 | 2010-07-16 | 半导体用接合线 |
CN201510431505.8A Active CN105023902B (zh) | 2009-07-30 | 2010-07-16 | 半导体用接合线 |
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CN201080019191.6A Active CN102422404B (zh) | 2009-07-30 | 2010-07-16 | 半导体用接合线 |
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US (1) | US8742258B2 (zh) |
EP (1) | EP2461358B1 (zh) |
KR (1) | KR101707244B1 (zh) |
CN (2) | CN102422404B (zh) |
MY (1) | MY164643A (zh) |
SG (1) | SG178063A1 (zh) |
WO (1) | WO2011013527A1 (zh) |
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- 2010-07-16 SG SG2012004065A patent/SG178063A1/en unknown
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CN105355616A (zh) * | 2015-11-20 | 2016-02-24 | 广东梅雁吉祥实业投资股份有限公司 | 一种抗氧化金属制品 |
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CN110527864A (zh) * | 2016-04-28 | 2019-12-03 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
CN107978577A (zh) * | 2017-11-22 | 2018-05-01 | 汕头市骏码凯撒有限公司 | 一种低阻抗、高可靠性的复合钯钌铜线及其制造方法 |
CN107978577B (zh) * | 2017-11-22 | 2019-11-01 | 汕头市骏码凯撒有限公司 | 一种低阻抗的复合钯钌铜线及其制造方法 |
CN110317969A (zh) * | 2018-03-28 | 2019-10-11 | 住友金属矿山株式会社 | 焊料接合电极以及焊料接合电极的覆膜形成用铜合金靶 |
CN110970283A (zh) * | 2018-09-28 | 2020-04-07 | 芝浦机械电子株式会社 | 等离子体处理装置 |
CN110970283B (zh) * | 2018-09-28 | 2022-08-26 | 芝浦机械电子株式会社 | 等离子体处理装置 |
CN113226610A (zh) * | 2018-12-28 | 2021-08-06 | 电化株式会社 | 陶瓷-铜复合体、陶瓷电路基板、功率模块及陶瓷-铜复合体的制造方法 |
CN113226610B (zh) * | 2018-12-28 | 2022-08-16 | 电化株式会社 | 陶瓷-铜复合体、陶瓷电路基板、功率模块及陶瓷-铜复合体的制造方法 |
CN113646450A (zh) * | 2019-02-08 | 2021-11-12 | 田中电子工业株式会社 | 钯覆盖铜接合线、引线接合结构、半导体装置及半导体装置的制造方法 |
US11876066B2 (en) | 2019-02-08 | 2024-01-16 | Tanaka Denshi Kogyo K.K. | Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device |
CN113966539B (zh) * | 2019-06-28 | 2024-05-14 | 住友电气工业株式会社 | 铜覆钢线、绞合线、绝缘电线以及电缆 |
Also Published As
Publication number | Publication date |
---|---|
US8742258B2 (en) | 2014-06-03 |
WO2011013527A1 (ja) | 2011-02-03 |
EP2461358B1 (en) | 2017-10-18 |
SG178063A1 (en) | 2012-03-29 |
CN105023902B (zh) | 2018-01-30 |
CN102422404A (zh) | 2012-04-18 |
CN102422404B (zh) | 2015-08-12 |
EP2461358A1 (en) | 2012-06-06 |
KR101707244B1 (ko) | 2017-02-15 |
US20120118610A1 (en) | 2012-05-17 |
MY164643A (en) | 2018-01-30 |
US20130306352A2 (en) | 2013-11-21 |
KR20120035093A (ko) | 2012-04-13 |
EP2461358A4 (en) | 2015-10-14 |
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