JP4204359B2 - ボンディングワイヤーおよびそれを使用した集積回路デバイス - Google Patents

ボンディングワイヤーおよびそれを使用した集積回路デバイス Download PDF

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JP4204359B2
JP4204359B2 JP2003081702A JP2003081702A JP4204359B2 JP 4204359 B2 JP4204359 B2 JP 4204359B2 JP 2003081702 A JP2003081702 A JP 2003081702A JP 2003081702 A JP2003081702 A JP 2003081702A JP 4204359 B2 JP4204359 B2 JP 4204359B2
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copper
bonding wire
wire
coating layer
layer
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JP2004006740A (ja
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毅 野中
信吾 改森
正則 井岡
正人 深萱
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株式会社野毛電気工業
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Description

【０００１】
【発明の属する技術分野】
本発明は、集積回路素子（ＩＣ、ＬＳＩ、トランジスタなど）上の電極と、回路配線基板（リードフレーム、セラミックス基板、プリント基板など）の導体配線とを接続するボンディングワイヤー、および該ボンディングワイヤーを使用した集積回路デバイスに関するものである。
【０００２】
【従来の技術】
集積回路素子と回路配線基板との接続方法としては、ボールボンディング法、ウェッジボンディング法、半田接続法、抵抗溶接法などが行われているが、その中でも金細線のボンディングワイヤーを用いたボールボンディング法が一般的である。
【０００３】
一般的なボールボンディング法のプロセスは以下の通りである。すなわち、移動自在なキャピラリー（以下「ボンディングツール」という）にガイドされたボンディングワイヤーの先端部を、電極トーチとの間で放電させることで溶融しボールを形成する。その後、第１ボンディング点である集積回路素子上の電極に、超音波を印加しつつ前記ボールを押圧して接合を形成する。さらにワイヤーを引き出しながら、ボンディングツールを第２ボンディング点である回路配線基板の電極に移動して同様に接続する（このときボールの形成は無い）。接続後ボンディングツールを上昇させワイヤーをクランプで引っぱることによりワイヤーを切断する。
【０００４】
従来、ボンディングワイヤーの素材としては金が使用されている。しかし、高価であるため安価な他の金属からなるボンディングワイヤーの開発が望まれている。
また、集積回路素子と回路配線が接続された後は、回路の保護のために封止がされるが、封止方法としては樹脂封止が広く用いられている。樹脂封止では、溶融樹脂を回路配線に流し回路を覆った後樹脂の硬化がされるが、その際樹脂流によりワイヤーの一部が流され、隣接ワイヤー間が接触短絡することがある。特に、集積回路デバイスの高集積化や小型化を達成するため、ボンディングワイヤーの配線において、隣接ワイヤー間隔の狭小化が押し進められた結果この問題が増加しており、樹脂流により流されにくい剛性の強いボンディングワイヤーが望まれている。
【０００５】
安価な金属からなり剛性の強いボンディングワイヤーとして、銅を素材としたボンディングワイヤーが開発されており、例えば特公平８−２８３８２号公報などに開示されている。しかし銅のボンディングワイヤーは表面の酸化が起こりやすいために長時間保存することが難しいことや、ボンディング時に基板からの熱伝導で酸化が進行し、接合性が悪くなるという問題を有する。
【０００６】
特開昭６２−９７３６０号公報には、銅ボンディングワイヤーの表面酸化を防ぐ方法として、金、銀、白金、パラジウム、ニッケル、コバルト、クロム、チタンなどの貴金属や耐食性金属で銅を被覆したボンディングワイヤーが提案されている。このようなワイヤーは、金ボンディングワイヤーより安価であると同時に表面酸化が起こらず良好な接合性が得られるとされている。
【０００７】
【特許文献１】
特公平８−２８３８２号公報
【特許文献２】
特開昭６２−９７３６０号公報
【０００８】
【発明が解決しようとする課題】
ところが、集積回路デバイスのさらなる高集積化、小型化、すなわち隣接ワイヤー間隔の狭小化を考慮して、本発明者が金またはパラジウムで銅を被覆した銅ボンディングワイヤーを評価したところ、以下に述べる新たな問題が有ることが分かった。
【０００９】
（１） 隣接ワイヤー間隔の狭小化には径の小さいボールの形成が不可欠であるが、金被覆銅ボンディングワイヤーでは、小径ボール（ワイヤー直径のおよそ３倍以下を目安とする。）を形成しようとすると真球とならず槍状となり、且つ、形状の再現性も不安定となり接合信頼性が低下する。
【００１０】
（２） パラジウム被覆銅ボンディングワイヤーでは、金被覆銅ワイヤーとは異なり形成するボールが槍状となることなく小径ボールを形成できる。しかしボール径が大きい場合および小径ボールの範疇であってもボール径が比較的大きい場合には、ボールの中心がワイヤーの軸からずれてゴルフクラブ状となる不良が発生する。この不良率は径が大きい程、高くなる。
【００１１】
（３） パラジウム被覆銅ボンディングワイヤーにおいて、パラジウム被覆をメッキにより銅を主成分とする芯材上に形成する場合、メッキ工程で、パラジウムメッキ液に銅が溶解しやすく、これによりメッキ液の劣化（メッキ能力の低下）が起こりやすい。この結果、メッキ品質が低下するとともに、メッキ液の交換頻度が上がり生産コスト増につながる。
【００１２】
（４）パラジウム被覆銅ボンディングワイヤーでは、パラジウム被覆層と芯材との密着性が弱く、パラジウム被覆層が剥がれ易い。被覆層が剥がれると、その部分の芯材が酸化されやすくなり接合性能が低下する他、被覆層の欠片がボンディングツール内で詰まるのでボンディング性が低下する。また落下した被覆層の欠片により集積回路デバイスの不良が発生する、伸線工程を経てワイヤーを製造する場合断線が生じやすいので生産性が低下するなどの問題が発生する。被覆層がメッキにより形成される場合は、化学蒸着方法、物理蒸着方法などの他の方法による場合より密着性は優れるが、密着性のさらなる向上が望まれている。
【００１３】
本発明は、このような従来技術の問題点を解決し、広いボール径範囲にわたって、真球のボールを安定的に形成し、かつメッキをする際にメッキ液の劣化をもたらさずに製造することができ、好ましくは、さらに被覆層と芯材との密着性にすぐれるボンディングワイヤーおよびそれを使用した集積回路デバイスを提供することを目的とする。
【００１４】
【課題を解決するための手段】
本発明は、銅を主成分とする芯材を、銅よりも高融点の耐酸化性金属で被覆して形成されるボンディングワイヤーにおいて、該芯材と該耐酸化性金属からなる層（被覆層）との間に、銅とは異なる金属の層を設けることにより、前記の従来技術の問題を解決することを特徴とする。
【００１５】
すなわち本発明は、銅を主成分とする芯材、該芯材上に形成された銅以外の金属（以下、異種金属とする）からなる異種金属層、および該異種金属層の上に形成され、銅よりも高融点の耐酸化性金属からなる被覆層を有することを特徴とするボンディングワイヤーおよびそれを使用した集積回路デバイスである。
【００１６】
本発明者は、銅を主成分とする芯材を有するボンディングワイヤーにおいて、被覆層の材質がボール形成時の形状安定性に与える影響について鋭意研究した結果、被覆層の材質として、芯材の銅より高融点の金属を用いた場合、金メッキ銅ワイヤーのように小径ボールの形成時にボールが槍状になるという不具合がなく、真球のボールが得られやすいとの知見を得た。被覆層の材質の融点が銅よりも高い場合、該材質の銅ワイヤーヘの拡散、溶解が抑えられるためボールの真球性が保持されると考えられる。
【００１７】
さらに本発明者は、芯材と被覆層との間に、異種金属層、例えば金層を設けると、ボンディングワイヤー製造過程においてメッキにより被覆層を形成する場合に、メッキ液への銅の溶解を防ぎメッキ液の劣化が起こりにくいとの知見を得た。
また異種金属層を設けると、被覆層と芯材との密着性を向上させることができる他、ボール径のより広い範囲で、ボール形状が真球を保つとの知見も得た。
【００１８】
前記のように、被覆層の材質として金などを用いた場合は真球のボールが得られにくい。しかし、本発明においては、芯材上に形成される異種金属層の材質として、金など、銅よりも融点の低い金属を用いた場合であっても、ボール径のより広い範囲でボール形状は真球を保つ。
本発明は、これらの知見に基づき完成されたものである。
【００１９】
【発明の実施の形態】
本発明のボンディングワイヤーは、芯材と被覆層との間に、異種金属層を設けることを特徴とする。先に定義したように、異種金属とは、銅以外の金属を言う。異種金属としては、前記のように、銅よりも融点の低い金属でもよい。
【００２０】
異種金属としては、金、白金およびこれらの合金が用いられる。
【００２１】
金、白金およびこれらの合金はメッキにて容易に異種金属層の形成が可能であるので好適である。
【００２２】
異種金属層には、被覆層の形成に使用するメッキ液に対して溶解性の低い金属が好ましい。この観点から、イオン化傾向が低い、不動態を作りやすい金、白金およびこれらの合金が好ましい。
【００２３】
本発明において、異種金属層はさらに被覆層により被覆されるが、ボール形成時に、異種金属層の金属は拡散によりボール表面で酸素に触れる。そこで、異種金属としては耐酸化性に優れた金属が好ましい。この観点からも、異種金属としては、金、白金が好適である。
【００２４】
パラジウム被覆銅ボンディングワイヤーにおいて、異種金属層に金または白金を用いた場合は、パラジウム被覆層の密着性がすぐれるボンディングワイヤーを得ることができる。この中では、コストの安い金が好ましい。
【００２５】
異種金属層としては、異種金属のみからなる層の他に、異種金属を主成分とし、本発明の効果を損なわない範囲で銅を含有する層も挙げられる。
【００２６】
異種金属層を形成する金属と被覆層を形成する金属は、通常異なる。ただし、異種金属層は、本発明の効果を損なわない範囲で、被覆層に含まれる金属を一部含んでもよい。また、異種金属層がストライクメッキにより形成され、被覆層が通常のメッキにより形成される場合などは、異種金属層を形成する金属と被覆層を形成する金属が、同じであってもよい。この例としては、異種金属層がパラジウムストライクメッキまたは白金ストライクメッキであり、被覆層がパラジウムメッキまたは白金メッキの場合などが挙げられる。
また、異種金属層は、芯材または被覆層に少量含まれる金属を主成分とする層であってもよい。
【００２７】
本発明のボンディングワイヤーは、その被覆層に、銅よりも融点が高く、好ましくは銅よりも融点が２００℃以上、より好ましくは３００℃以上高く、かつ銅よりも耐酸化性の金属を用いることを特徴とする。中でも、パラジウム、白金およびニッケルから選ばれた少なくとも一種が好適である。銅の融点は１０８４℃であるのに対し、パラジウムの融点は１５５４℃、白金の融点は１７７２℃、ニッケルの融点は１４５５℃である。特にパラジウムは、比較的安価でありメッキ性も良く、かつニッケルよりも耐酸化性に優れ、白金よりも加工性に優れる（伸線加工が容易である）ので好適である。もちろん、パラジウム、白金およびニッケルから選ばれた２種以上を含む合金を被覆層の材質としても良いし、銅よりも高融点で耐酸化性であれば、パラジウム、白金およびニッケルから選ばれた金属と銅との合金を被覆層の材質としても良い。被覆層の材質は、パラジウム、白金およびニッケルから選ばれた金属を主成分とし別の元素を含む合金であっても、合金の融点が銅より高ければ構わない。
【００２８】
異種金属層および被覆層を芯材上に形成した本発明のボンディングワイヤーとしては、単位断面積当たりの伸びが０．０２１％／μｍ２以上のものが、ボール形成時にボールの中心とワイヤーの軸とがずれて、いわゆるゴルフクラブ状となる不良率を低減することができるので好ましい。より好ましい単位断面積当たりの伸びは０．０２４％／μｍ２以上、さらに好ましくは０．０３０％／μｍ２以上である。
【００２９】
ここで、単位断面積当たりの伸びとは、１０ｃｍの長さのワイヤーを引っ張り速度２０ｍｍ／分で引っ張り、破断した際のワイヤーの伸びた割合（％）を、引っ張る前のワイヤーの断面積（芯材、異種金属層および被覆層の合計「μｍ２」）で割った値である。
【００３０】
ボンディングワイヤーでは通常、伸線して最終線径が得られた後にアニール（「最終アニール」）を行って伸びを調整するが、最終アニール以外に、被覆層形成後の伸線工程の途中でも、アニール（中間アニールと呼ぶ）を施すことにより、最終アニールのみでは困難な高い伸びのボンディングワイヤー、例えば０．０３０％／μｍ２以上の高い単位断面積当たりの伸びを有するボンディングワイヤーを得ることができる。
【００３１】
この高い伸びを有するワイヤーは、ボールがゴルフクラブ状となる不良率を低減することができるとの効果以外にも、ワイヤーループ形状のコントロール性の改善、第２ボンドの接合強度が大きくなるなどの利点を有する。ワイヤーループ形状のコントロール性の改善により、隣接ワイヤー間の接触不良やルーピング中の接合部の破損などを低減することができる。
【００３２】
本発明のボンディングワイヤーの芯材は、銅を主成分とする。銅を主成分とする芯材には、銅のみからなる芯材も含まれる。しかし、芯材には、銅以外の元素が合計で０．００１質量％以上、１質量％以下含まれていることが、高い伸び特性を出すために好ましい。（なお、本明細書において、質量％は重量％と同義である。）この不純物量が０．０１質量％以上であればさらに好適である。
【００３３】
芯材に含有する不純物としてはべリリウム、錫、亜鉛、ジルコニウム、銀、クロム、鉄、酸素、硫黄、水素などが挙げられる。不純物の混合量を特定の値以上とすることにより、不純物が少ない場合では実現しにくい高い伸び特性が得られる。また、高い伸び特性を特に目指さない場合においても、不純物が少ない場合に比べて加工時の断線などを大幅に減少させることができる。ただし、銅以外の元素量が多すぎると電気抵抗が高くなるなど電気特性面でマイナスとなる他、ボール形成時にボール表面がクレーター状になる、という不具合が発生する。この観点から銅以外の元素の合計は１質量％以下であることが望ましい。
【００３４】
本発明のボンディングワイヤーは、本発明の効果を損なわない範囲で、芯材上に異種金属層、被覆層以外の層を有してもよい。異種金属層、被覆層以外の層は、被覆層の外側に設けることもできるし、芯材と異種金属層間または異種金属層と被覆層間に設けることもできる。また、異種金属層、被覆層はそれぞれ複数の層を有してもよい。
【００３５】
本発明のボンディングワイヤーの直径は、特に限定されない。小ボール径を目的とする場合、１５〜４０μｍが好適である。
異種金属層の厚みは特に限定されない。通常、０．００１μｍ〜０．１μｍの範囲が好ましく、さらに好ましくは０．００１〜０．０３μｍである。通常、被覆層の厚みの０．００１〜０．１倍程度あれば十分である。
【００３６】
被覆層の厚みも、特に限定されない。ワイヤー径にもよるが、芯材の径の１〜０．０００１倍程度が好適であり、より好適には、０．３〜０．０１倍程度である。また、ワイヤーを垂直に切断した際の断面において、Ｙ（断面積比）＝（被覆層断面積／芯材断面積）とした場合、０．００７≦Ｙ≦０．０５となる厚みがより好ましい。さらに好ましくは、０．０１≦Ｙ≦０．０４である。大きな径のボールを形成するとき、ゴルフクラブ状となりやすい傾向があるが、このように限定することで、真球のボールを形成することができ、ボールがゴルフクラブ状となる不良率を低減することができる。断面積比Ｙは、層の厚みを変えることで容易に調整することができる。
【００３７】
芯材上に、異種金属層および被覆層を形成する方法としては、電気メッキにより異種金属層を形成し、その上に電気メッキにより被覆層を形成する方法が好適である。
【００３８】
なお異種金属層を電気メッキにて形成する場合、そのメッキとしては、一般にストライクメッキ、フラッシュメッキおよび下地メッキと呼ばれる密着性を重視したメッキ（本明細書においては、これら全てをストライクメッキという）が好ましい。これらのメッキのメッキ液は、通常のメッキの場合と異なり、一般に金属濃度が低く、高電位で安定したメッキができる電導塩組成を有している。特に金ストライクメッキ、白金ストライクメッキ、およびそれらの合金のストライクメッキが好ましい。
【００３９】
また、太い銅線に、先ず異種金属のメッキまたはストライクメッキを施し、その後被覆層の材質である金属の厚メッキを施したものを、複数回伸線して狙いのワイヤー径、層厚を出す方法が経済的で好ましい。特に、電気メッキと伸線の組合せは、厚みの均一性および表面の平滑性の点でもすぐれ、ボンディングツールのワイヤー通過穴内面との摩擦が小さくワイヤーのフィード性が良好である。さらには、芯材、異種金属層、被覆層の間の密着力が高いために、剥がれた被覆層や異種金属層の欠片がボンディングツール内で詰まる問題も解消できる。
【００４０】
特開昭６２−９７３６０号公報に開示されている実施例のように化学蒸着方法、物理蒸着方法による形成法は、製造コストが高くなる場合が多いが、異種金属層のような薄膜を形成する場合は、コストが許容できる場合も有る。従って、化学蒸着方法、物理蒸着方法による異種金属層の形成も考えられる。
【００４１】
異種金属層を有しないボンディングワイヤーの製造工程においては、前記のように、電気メッキによる被覆層の形成時に、メッキ液へ芯材の銅が溶解し、メッキ液が劣化する。しかし、異種金属層がある場合は、銅へのメッキではなく、異種金属層上へのメッキとなるため、銅の溶け込みによるメッキ液劣化の心配がなく好適である。
【００４２】
【実施例】
以下本発明を、実施例を用いてより具体的に説明するが、この実施例は、本発明の範囲を限定するものではない。
【００４３】
実施例
純度９９．９９５％、直径２００μｍの銅ワイヤーに、電気メッキにて約０．０１μｍの金ストライクメッキを形成した後、０．８μｍのパラジウムメッキを形成した。これを伸線することにより銅の芯材の径２５μｍ、パラジウム層（被覆層）０．１μｍ、金層（異種金属層）約０．００１μｍの銅ボンディングワイヤーを作製した。これを用いてボンダー（（株）カイジョー製 型番ＦＢ１３７）で各径のボールを形成し、その際の不良率と主な不良形状を調査した。ここで、ボール径はその条件で形成される真球の径にて決定した。ボール形成の条件としては、ワイヤー先端とスパークロッド間距離を４００μｍとし、窒素を１リットル／分の流量でワイヤー先端部に吹き付け、その周辺の酸素濃度を低下させた状態で行った。結果を表１に示す。
【００４４】
比較例１
金層（異種金属層）が形成されていない以外は実施例と同構成のボンディングワイヤーを用い、同条件下でボールを形成し、実施例と同様に不良率と主な不良形状を調査した。結果を表１に示す。
【００４５】
比較例２
純度９９．９９５％、直径２００μｍの銅ワイヤーに、電気メッキにて０．８μｍの金メッキ被覆層を形成した。これを伸線することにより銅の芯材の径２５μｍ、金メッキ厚０．１μｍの銅ボンディングワイヤーを作製した。これを用いて、実施例と同様に不良率と主な不良形状を調査した。結果を表１に示す。
【００４６】
表１に示すように異種金属層としての金ストライクメッキ層がある実施例のボンディングワイヤーの方が、比較例より良好なボール形成性を有すことが分かる。
【００４７】
【表１】
Figure 0004204359
【００４８】
【発明の効果】
本発明のボンディングワイヤーは、ボールの形成能がよく、広いボール径範囲にわたって真球のボールを安定的に形成する。すなわち、接合信頼性にすぐれる。また、被覆層をメッキにて形成する場合、該メッキ工程においてメッキ液の劣化をおこさないとの利点を有するので、製造コストの安価なボンディングワイヤーである。また被覆層の密着性が良いので、この観点からも接合信頼性に優れるボンディングワイヤーである。
【００４９】
さらに、芯材に剛性がある銅を用いるため、樹脂封止時に樹脂流によりワイヤーが流されにくく、隣接ワイヤーとの接触の可能性が少ない。
そして、安価ですぐれたボンディングワイヤーとして、集積回路素子上の電極と回路配線基板の導体配線との接続などに用いられ、このようなボンディングワイヤーを使用した集積回路デバイスは、信頼性にすぐれ、かつ安価なデバイスとして広い用途に用いられる。

Claims (5)

  1. 銅を主成分とする芯材、該芯材上に形成され金または白金からなる異種金属層、および、該異種金属層の上に形成され、銅よりも融点が２００℃以上高い耐酸化性金属からなる被覆層を有することを特徴とするボンディングワイヤー。
  2. 異種金属層を形成する金属が、金であることを特徴とする請求項１に記載のボンディングワイヤー。
  3. 被覆層を形成する金属が、パラジウム、白金、ニッケルまたはこれらを主成分とする合金から選ばれる金属であることを特徴とする請求項１または請求項２に記載のボンディングワイヤー。
  4. 被覆層を形成する金属が、パラジウムであることを特徴とする請求項３に記載のボンディングワイヤー。
  5. 請求項１ないし請求項４のいずれか１項に記載のボンディングワイヤーを使用したことを特徴とする集積回路デバイス。
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