CN104907222B - 液态的膜材料的吐出装置 - Google Patents

液态的膜材料的吐出装置 Download PDF

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Publication number
CN104907222B
CN104907222B CN201410691416.2A CN201410691416A CN104907222B CN 104907222 B CN104907222 B CN 104907222B CN 201410691416 A CN201410691416 A CN 201410691416A CN 104907222 B CN104907222 B CN 104907222B
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CN
China
Prior art keywords
tank
membrane material
path
heating channel
nozzle head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410691416.2A
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English (en)
Chinese (zh)
Other versions
CN104907222A (zh
Inventor
西牧润
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Publication of CN104907222A publication Critical patent/CN104907222A/zh
Application granted granted Critical
Publication of CN104907222B publication Critical patent/CN104907222B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work

Landscapes

  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN201410691416.2A 2014-03-11 2014-11-25 液态的膜材料的吐出装置 Expired - Fee Related CN104907222B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014047141A JP6436634B2 (ja) 2014-03-11 2014-03-11 液状の膜材料の吐出装置
JP2014-047141 2014-03-11

Publications (2)

Publication Number Publication Date
CN104907222A CN104907222A (zh) 2015-09-16
CN104907222B true CN104907222B (zh) 2018-02-16

Family

ID=54076904

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410691416.2A Expired - Fee Related CN104907222B (zh) 2014-03-11 2014-11-25 液态的膜材料的吐出装置

Country Status (4)

Country Link
JP (1) JP6436634B2 (enExample)
KR (1) KR101730506B1 (enExample)
CN (1) CN104907222B (enExample)
TW (1) TWI558468B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107262330B (zh) * 2017-05-20 2019-05-07 郑州轻工业学院 一种带ccd计算机视觉定位的smt涂绘装置
JP6980339B2 (ja) * 2017-09-05 2021-12-15 住友重機械工業株式会社 液体材料吐出装置及び液体材料吐出方法
KR102008709B1 (ko) * 2017-12-27 2019-08-09 (주)임펙 엔터프라이즈 코팅액 공급 장치 및 방법과 이를 위한 토출밸브
JP6964010B2 (ja) * 2018-01-26 2021-11-10 日東シンコー株式会社 コーティング剤供給装置
KR102850878B1 (ko) * 2023-11-29 2025-08-27 주식회사 도우인시스 건식강화용 선택적 2중 코팅기

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101605698A (zh) * 2007-02-12 2009-12-16 伊利诺斯工具制品有限公司 用于传送热熔粘合剂或者其他热塑性材料的模块系统及其压力控制系统
CN203370688U (zh) * 2013-07-19 2014-01-01 中国科学院理化技术研究所 涂布装置
CN103543702A (zh) * 2012-07-13 2014-01-29 诺信公司 利用集成流量控制的热熔分配单元和方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09103727A (ja) * 1995-10-13 1997-04-22 Misuzu:Kk フローコータの温度制御装置
JP2001314801A (ja) * 2000-05-09 2001-11-13 Seven Tec:Kk 液剤施工システム
JP3543813B2 (ja) * 2002-07-31 2004-07-21 セイコーエプソン株式会社 液滴吐出方法及び液滴吐出装置、液晶装置の製造方法及び液晶装置、並びに電子機器
JP2004087800A (ja) * 2002-08-27 2004-03-18 Tokyo Electron Ltd 成膜装置および成膜装置の供給ノズル吐出制御方法
JP2005131829A (ja) 2003-10-28 2005-05-26 Sony Corp 液体吐出性能維持方法及び液体吐出装置
KR100634288B1 (ko) * 2003-12-01 2006-10-16 야스히로 모리 고체물질의 표면 개질방법 및 표면 개질된 고체물질
JP4438678B2 (ja) * 2005-04-22 2010-03-24 セイコーエプソン株式会社 液滴吐出方法と液滴吐出装置、薄膜形成方法及びデバイス並びに電子機器
JP4911345B2 (ja) * 2005-07-25 2012-04-04 セイコーエプソン株式会社 パターニング方法、並びにこれを用いた電子装置の製造方法
JP2007216108A (ja) 2006-02-15 2007-08-30 Hitachi Plant Technologies Ltd 塗布装置
JP2008264767A (ja) * 2007-03-28 2008-11-06 Toshiba Corp 液滴噴射塗布装置及び塗布体の製造方法
JP5169120B2 (ja) * 2007-10-05 2013-03-27 リコープリンティングシステムズ株式会社 液滴塗布装置
FI122502B (fi) * 2007-12-20 2012-02-29 Beneq Oy Menetelmä ja laite lasin pinnoittamiseksi
JP2012096524A (ja) * 2010-05-24 2012-05-24 Panasonic Corp 循環式インクジェット装置
JP2012250230A (ja) * 2011-06-02 2012-12-20 Tokyo Ohka Kogyo Co Ltd 加熱装置、塗布装置及び加熱方法
JP2013110236A (ja) * 2011-11-21 2013-06-06 Sumitomo Heavy Ind Ltd 薄膜パターン形成装置及び薄膜パターン形成方法
JP5524154B2 (ja) * 2011-09-09 2014-06-18 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5698638B2 (ja) 2011-09-27 2015-04-08 富士フイルム株式会社 液体付与装置及びインクジェット記録装置
JP2014030807A (ja) * 2012-08-06 2014-02-20 Sumitomo Heavy Ind Ltd 薄膜形成装置及び基板製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101605698A (zh) * 2007-02-12 2009-12-16 伊利诺斯工具制品有限公司 用于传送热熔粘合剂或者其他热塑性材料的模块系统及其压力控制系统
CN103543702A (zh) * 2012-07-13 2014-01-29 诺信公司 利用集成流量控制的热熔分配单元和方法
CN203370688U (zh) * 2013-07-19 2014-01-01 中国科学院理化技术研究所 涂布装置

Also Published As

Publication number Publication date
JP6436634B2 (ja) 2018-12-12
KR101730506B1 (ko) 2017-04-26
TWI558468B (zh) 2016-11-21
JP2015170831A (ja) 2015-09-28
CN104907222A (zh) 2015-09-16
KR20150106323A (ko) 2015-09-21
TW201534401A (zh) 2015-09-16

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Granted publication date: 20180216