CN104254423B - 偏流板和喷流装置 - Google Patents

偏流板和喷流装置 Download PDF

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Publication number
CN104254423B
CN104254423B CN201380022382.1A CN201380022382A CN104254423B CN 104254423 B CN104254423 B CN 104254423B CN 201380022382 A CN201380022382 A CN 201380022382A CN 104254423 B CN104254423 B CN 104254423B
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CN
China
Prior art keywords
fluid
deflector
pipeline
plate
flowing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380022382.1A
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English (en)
Chinese (zh)
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CN104254423A (zh
Inventor
西田信吾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of CN104254423A publication Critical patent/CN104254423A/zh
Application granted granted Critical
Publication of CN104254423B publication Critical patent/CN104254423B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201380022382.1A 2012-04-27 2013-03-19 偏流板和喷流装置 Active CN104254423B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-103249 2012-04-27
JP2012103249A JP5601342B2 (ja) 2012-04-27 2012-04-27 偏流板及び噴流装置
PCT/JP2013/057832 WO2013161453A1 (ja) 2012-04-27 2013-03-19 偏流板及び噴流装置

Publications (2)

Publication Number Publication Date
CN104254423A CN104254423A (zh) 2014-12-31
CN104254423B true CN104254423B (zh) 2015-11-25

Family

ID=49482790

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380022382.1A Active CN104254423B (zh) 2012-04-27 2013-03-19 偏流板和喷流装置

Country Status (10)

Country Link
US (1) US9622395B2 (enExample)
EP (1) EP2842683B1 (enExample)
JP (1) JP5601342B2 (enExample)
KR (1) KR101524993B1 (enExample)
CN (1) CN104254423B (enExample)
IN (1) IN2014DN09117A (enExample)
MY (1) MY182200A (enExample)
PH (1) PH12014502409A1 (enExample)
SG (1) SG11201406926XA (enExample)
WO (1) WO2013161453A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5614518B1 (ja) * 2013-03-29 2014-10-29 千住金属工業株式会社 偏流板及び噴流装置
DE102013110731B3 (de) * 2013-09-27 2014-11-06 Ersa Gmbh Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten
CN104594990B (zh) * 2015-02-27 2017-06-23 天纳克（苏州）排放系统有限公司 混合管及其排气处理装置
CN106975816A (zh) * 2017-03-28 2017-07-25 深圳市联合超越电子设备有限公司 喷口角度可调的喷流装置
CN113262392B (zh) * 2021-04-25 2022-08-09 泰尔茂医疗产品(杭州)有限公司 连接器
CN118699619B (zh) * 2024-06-27 2025-11-21 武汉船用机械有限责任公司 导管的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154371A (en) * 1981-03-19 1982-09-24 Tdk Corp Method and device for soldering
US4540114A (en) * 1982-04-02 1985-09-10 Zevatron Gmbh Gesellschaft Fur Fertigungseinrichtungen Der Elektronik Apparatus for soldering workpieces
CN201089051Y (zh) * 2007-08-03 2008-07-23 陈许松 无铅波峰焊锡机
CN101698259A (zh) * 2009-09-30 2010-04-28 苏州明富自动化设备有限公司 一种焊锡喷锡装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137570A (ja) * 1986-11-27 1988-06-09 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH01114165A (ja) 1987-10-27 1989-05-02 Mitsubishi Electric Corp 垂直偏向回路
JPH01143762A (ja) 1987-11-26 1989-06-06 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH0641722Y2 (ja) 1988-01-29 1994-11-02 千住金属工業株式会社 噴流はんだ槽
JPH0314059A (ja) 1989-06-13 1991-01-22 Nec Corp バスシステム
JPH0314059U (enExample) * 1989-06-20 1991-02-13
JPH10313171A (ja) * 1997-05-12 1998-11-24 Nihon Dennetsu Keiki Co Ltd はんだ付け装置
JPH1144409A (ja) * 1997-07-23 1999-02-16 Kozo Sekimoto 燃焼炉
JP4136887B2 (ja) 2003-06-17 2008-08-20 千住システムテクノロジー株式会社 半田槽用ポンプ及びそれを使用する半田槽
TWI364341B (en) * 2003-10-10 2012-05-21 Senju Metal Industry Co Wave soldering tank
EP1850646B1 (en) 2005-02-07 2010-07-28 Senju Metal Industry Co., Ltd. Jet solder bath
ATE524266T1 (de) * 2006-04-05 2011-09-15 Senju Metal Industry Co Wellenlötbehälter
JP2009019781A (ja) * 2007-07-10 2009-01-29 Showa Denko Kk 熱交換器
JP5332654B2 (ja) 2009-01-27 2013-11-06 千住金属工業株式会社 噴流はんだ槽

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154371A (en) * 1981-03-19 1982-09-24 Tdk Corp Method and device for soldering
US4540114A (en) * 1982-04-02 1985-09-10 Zevatron Gmbh Gesellschaft Fur Fertigungseinrichtungen Der Elektronik Apparatus for soldering workpieces
CN201089051Y (zh) * 2007-08-03 2008-07-23 陈许松 无铅波峰焊锡机
CN101698259A (zh) * 2009-09-30 2010-04-28 苏州明富自动化设备有限公司 一种焊锡喷锡装置

Also Published As

Publication number Publication date
CN104254423A (zh) 2014-12-31
EP2842683B1 (en) 2017-10-18
KR20140146219A (ko) 2014-12-24
MY182200A (en) 2021-01-18
EP2842683A1 (en) 2015-03-04
US20150305216A1 (en) 2015-10-22
SG11201406926XA (en) 2015-02-27
IN2014DN09117A (enExample) 2015-05-22
EP2842683A4 (en) 2016-04-13
PH12014502409B1 (en) 2015-01-12
JP5601342B2 (ja) 2014-10-08
JP2013230481A (ja) 2013-11-14
KR101524993B1 (ko) 2015-06-01
PH12014502409A1 (en) 2015-01-12
WO2013161453A1 (ja) 2013-10-31
US9622395B2 (en) 2017-04-11

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