CN104241510A - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN104241510A
CN104241510A CN201410247326.4A CN201410247326A CN104241510A CN 104241510 A CN104241510 A CN 104241510A CN 201410247326 A CN201410247326 A CN 201410247326A CN 104241510 A CN104241510 A CN 104241510A
Authority
CN
China
Prior art keywords
light
emitting device
emitting
emitting element
emitting elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410247326.4A
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English (en)
Chinese (zh)
Inventor
三次智纪
小关健司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to CN201911315174.6A priority Critical patent/CN111063785A/zh
Priority to CN202110086719.1A priority patent/CN112838156A/zh
Publication of CN104241510A publication Critical patent/CN104241510A/zh
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
CN201410247326.4A 2013-06-05 2014-06-05 发光装置 Pending CN104241510A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201911315174.6A CN111063785A (zh) 2013-06-05 2014-06-05 发光装置的制造方法
CN202110086719.1A CN112838156A (zh) 2013-06-05 2014-06-05 发光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-118558 2013-06-05
JP2013118558A JP6186904B2 (ja) 2013-06-05 2013-06-05 発光装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202110086719.1A Division CN112838156A (zh) 2013-06-05 2014-06-05 发光装置
CN201911315174.6A Division CN111063785A (zh) 2013-06-05 2014-06-05 发光装置的制造方法

Publications (1)

Publication Number Publication Date
CN104241510A true CN104241510A (zh) 2014-12-24

Family

ID=50828810

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201410247326.4A Pending CN104241510A (zh) 2013-06-05 2014-06-05 发光装置
CN201911315174.6A Pending CN111063785A (zh) 2013-06-05 2014-06-05 发光装置的制造方法
CN202110086719.1A Pending CN112838156A (zh) 2013-06-05 2014-06-05 发光装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201911315174.6A Pending CN111063785A (zh) 2013-06-05 2014-06-05 发光装置的制造方法
CN202110086719.1A Pending CN112838156A (zh) 2013-06-05 2014-06-05 发光装置

Country Status (4)

Country Link
US (2) US20140362570A1 (enExample)
EP (1) EP2811517B1 (enExample)
JP (1) JP6186904B2 (enExample)
CN (3) CN104241510A (enExample)

Cited By (7)

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CN107039410A (zh) * 2015-11-30 2017-08-11 日亚化学工业株式会社 发光装置的制造方法
CN107887488A (zh) * 2016-09-30 2018-04-06 日亚化学工业株式会社 线状发光装置的制造方法以及线状发光装置
CN108417685A (zh) * 2017-02-09 2018-08-17 日亚化学工业株式会社 发光装置
CN109860381A (zh) * 2017-11-30 2019-06-07 日亚化学工业株式会社 发光装置及其制造方法
CN110915004A (zh) * 2017-07-28 2020-03-24 欧司朗Oled股份有限公司 用于制造光电子半导体器件的方法及光电子半导体器件
CN111834348A (zh) * 2019-04-22 2020-10-27 日亚化学工业株式会社 发光装置的制造方法以及发光装置
CN113130725A (zh) * 2015-03-31 2021-07-16 科锐Led公司 具有包封的发光二极管和方法

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JP6805532B2 (ja) * 2015-06-18 2020-12-23 日亜化学工業株式会社 発光装置
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JP6699580B2 (ja) 2017-02-09 2020-05-27 日亜化学工業株式会社 発光装置
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JP7177336B2 (ja) * 2018-07-20 2022-11-24 日亜化学工業株式会社 発光装置
JP7190889B2 (ja) * 2018-12-07 2022-12-16 スタンレー電気株式会社 発光装置及び発光装置モジュール
JP7190890B2 (ja) * 2018-12-07 2022-12-16 スタンレー電気株式会社 発光装置
JP7307874B2 (ja) 2019-04-26 2023-07-13 日亜化学工業株式会社 発光装置及び発光モジュール
WO2021147064A1 (zh) * 2020-01-23 2021-07-29 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN119630152A (zh) * 2020-03-31 2025-03-14 光宝光电(常州)有限公司 封装结构
CN113851502A (zh) * 2020-06-10 2021-12-28 华为机器有限公司 显示面板、显示装置及显示面板的制备方法
EP4231346A4 (en) * 2020-11-20 2024-10-16 Seoul Semiconductor Co., Ltd. ELECTROLUMINESCENT DEVICE
JP7744597B2 (ja) * 2023-03-27 2025-09-26 日亜化学工業株式会社 発光装置及びその製造方法
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JP7769239B2 (ja) * 2023-09-29 2025-11-13 日亜化学工業株式会社 発光装置

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Cited By (11)

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Publication number Priority date Publication date Assignee Title
CN113130725A (zh) * 2015-03-31 2021-07-16 科锐Led公司 具有包封的发光二极管和方法
CN113130725B (zh) * 2015-03-31 2024-09-24 科锐Led公司 具有包封的发光二极管和方法
CN107039410A (zh) * 2015-11-30 2017-08-11 日亚化学工业株式会社 发光装置的制造方法
CN107039410B (zh) * 2015-11-30 2021-11-16 日亚化学工业株式会社 发光装置的制造方法
CN107887488A (zh) * 2016-09-30 2018-04-06 日亚化学工业株式会社 线状发光装置的制造方法以及线状发光装置
CN108417685A (zh) * 2017-02-09 2018-08-17 日亚化学工业株式会社 发光装置
CN108417685B (zh) * 2017-02-09 2023-02-28 日亚化学工业株式会社 发光装置
CN110915004A (zh) * 2017-07-28 2020-03-24 欧司朗Oled股份有限公司 用于制造光电子半导体器件的方法及光电子半导体器件
CN109860381A (zh) * 2017-11-30 2019-06-07 日亚化学工业株式会社 发光装置及其制造方法
CN109860381B (zh) * 2017-11-30 2024-05-03 日亚化学工业株式会社 发光装置及其制造方法
CN111834348A (zh) * 2019-04-22 2020-10-27 日亚化学工业株式会社 发光装置的制造方法以及发光装置

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