CN104220902B - 梯度聚合物结构和方法 - Google Patents
梯度聚合物结构和方法 Download PDFInfo
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- CN104220902B CN104220902B CN201380015908.3A CN201380015908A CN104220902B CN 104220902 B CN104220902 B CN 104220902B CN 201380015908 A CN201380015908 A CN 201380015908A CN 104220902 B CN104220902 B CN 104220902B
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/18—Spheres
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Silicon Polymers (AREA)
- Laminated Bodies (AREA)
- Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261596959P | 2012-02-09 | 2012-02-09 | |
| US61/596,959 | 2012-02-09 | ||
| PCT/US2013/025126 WO2013119796A1 (en) | 2012-02-09 | 2013-02-07 | Gradient polymer structures and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104220902A CN104220902A (zh) | 2014-12-17 |
| CN104220902B true CN104220902B (zh) | 2018-06-26 |
Family
ID=47741314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380015908.3A Active CN104220902B (zh) | 2012-02-09 | 2013-02-07 | 梯度聚合物结构和方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9705056B2 (enExample) |
| EP (1) | EP2812738B1 (enExample) |
| JP (1) | JP6358960B2 (enExample) |
| KR (1) | KR102001403B1 (enExample) |
| CN (1) | CN104220902B (enExample) |
| TW (1) | TWI588513B (enExample) |
| WO (1) | WO2013119796A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6358960B2 (ja) | 2012-02-09 | 2018-07-18 | ダウ シリコーンズ コーポレーション | 勾配ポリマー構造及び方法 |
| JP6387355B2 (ja) | 2012-12-21 | 2018-09-05 | ダウ シリコーンズ コーポレーション | 層状ポリマー構造及び方法 |
| US20160009866A1 (en) * | 2013-03-15 | 2016-01-14 | Dow Corning Corporation | Compositions of Resin-Linear Organosiloxane Block Copolymers |
| KR20150133779A (ko) * | 2013-03-15 | 2015-11-30 | 다우 코닝 코포레이션 | 분말 형태의 고체 실리콘-함유 핫 멜트 조성물을 침착하는 단계 및 그의 봉지재를 형성하는 단계를 포함하는, 광학 조립체의 제조 방법 |
| WO2014197617A1 (en) * | 2013-06-05 | 2014-12-11 | Dow Corning Corporation | Compositions of resin-linear organosiloxane block copolymers |
| WO2015042285A1 (en) | 2013-09-18 | 2015-03-26 | Dow Corning Corporation | Compositions of resin-linear organosiloxane block copolymers |
| WO2015200587A1 (en) * | 2014-06-25 | 2015-12-30 | Dow Corning Corporation | Layered polymer structures and methods |
| US9930750B2 (en) * | 2014-08-20 | 2018-03-27 | Lumens Co., Ltd. | Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package |
| KR20170058999A (ko) * | 2014-09-23 | 2017-05-29 | 다우 코닝 코포레이션 | 접착제 조성물 및 이의 용도 |
| FR3038710B1 (fr) * | 2015-07-10 | 2021-05-28 | Cpc Tech | Capteur d'une caracteristique physique, comportant de preference une structure multicouches |
| JP7036505B2 (ja) * | 2015-09-30 | 2022-03-15 | スリーエム イノベイティブ プロパティズ カンパニー | ガラス様層を含む複合構造物及び形成方法 |
| DE102016114921A1 (de) * | 2016-08-11 | 2018-02-15 | Osram Opto Semiconductors Gmbh | Silikonzusammensetzung |
| JPWO2018066559A1 (ja) * | 2016-10-04 | 2019-07-18 | 東レ・ダウコーニング株式会社 | 化粧料組成物または外用剤組成物、および化粧料原料組成物 |
| EP3658639A1 (en) | 2017-07-27 | 2020-06-03 | Dow Silicones Corporation | Hydrosilylation curable polysiloxane |
| JP6562044B2 (ja) * | 2017-07-28 | 2019-08-21 | セイコーエプソン株式会社 | 電気光学装置、電子機器、及び電気光学装置の製造方法 |
| KR102334936B1 (ko) * | 2017-11-08 | 2021-12-02 | 시아먼 산안 옵토일렉트로닉스 테크놀로지 캄파니 리미티드 | 자외선 led 패키징 구조 |
| WO2025170712A1 (en) | 2024-02-07 | 2025-08-14 | Dow Silicones Corporation | Epoxy-functional resin-linear polyorganosiloxane copolymer, composition containing the copolymer, and methods for their preparation and use |
| WO2025178717A1 (en) | 2024-02-20 | 2025-08-28 | Dow Silicones Corporation | Alkenyl ester – functional resin – linear polyorganosiloxane block copolymer, composition containing the copolymer, and methods for their preparation and use |
Citations (5)
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| WO2005067524A2 (en) * | 2004-01-15 | 2005-07-28 | Nanosys, Inc. | Nanocrystal doped matrixes |
| EP1927634A1 (en) * | 2006-11-28 | 2008-06-04 | Shinetsu Chemical Co., Ltd. | Emulsion coating agent composition and coated products thereof |
| CN101631833A (zh) * | 2007-02-22 | 2010-01-20 | 道康宁公司 | 增强硅树脂薄膜及其制备方法 |
| WO2011084250A2 (en) * | 2009-12-21 | 2011-07-14 | Dow Corning Corporation | Methods for fabricating flexible waveguides using alkyl-functional silsesquioxane resins |
| WO2011094250A2 (en) * | 2010-01-26 | 2011-08-04 | Rahim Mir S | Sports training system |
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| JP6309898B2 (ja) | 2012-01-16 | 2018-04-11 | ダウ シリコーンズ コーポレーション | 光学物品及び形成方法 |
| JP6358960B2 (ja) | 2012-02-09 | 2018-07-18 | ダウ シリコーンズ コーポレーション | 勾配ポリマー構造及び方法 |
| JP6218757B2 (ja) | 2012-03-09 | 2017-10-25 | ダウ コーニング コーポレーションDow Corning Corporation | 樹脂−直鎖状オルガノシロキサンブロックコポリマーの組成物 |
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| JP2015515516A (ja) * | 2012-03-21 | 2015-05-28 | ダウ コーニング コーポレーションDow Corning Corporation | 樹脂−直鎖状オルガノシロキサンブロックコポリマーの組成物 |
-
2013
- 2013-02-07 JP JP2014556659A patent/JP6358960B2/ja active Active
- 2013-02-07 WO PCT/US2013/025126 patent/WO2013119796A1/en not_active Ceased
- 2013-02-07 EP EP13705350.0A patent/EP2812738B1/en not_active Not-in-force
- 2013-02-07 KR KR1020147025160A patent/KR102001403B1/ko not_active Expired - Fee Related
- 2013-02-07 US US14/377,770 patent/US9705056B2/en active Active
- 2013-02-07 CN CN201380015908.3A patent/CN104220902B/zh active Active
- 2013-02-08 TW TW102105170A patent/TWI588513B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005067524A2 (en) * | 2004-01-15 | 2005-07-28 | Nanosys, Inc. | Nanocrystal doped matrixes |
| EP1927634A1 (en) * | 2006-11-28 | 2008-06-04 | Shinetsu Chemical Co., Ltd. | Emulsion coating agent composition and coated products thereof |
| CN101631833A (zh) * | 2007-02-22 | 2010-01-20 | 道康宁公司 | 增强硅树脂薄膜及其制备方法 |
| WO2011084250A2 (en) * | 2009-12-21 | 2011-07-14 | Dow Corning Corporation | Methods for fabricating flexible waveguides using alkyl-functional silsesquioxane resins |
| WO2011094250A2 (en) * | 2010-01-26 | 2011-08-04 | Rahim Mir S | Sports training system |
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| Title |
|---|
| poly(methylstyrene-dimethylsiloxane) block copolymer as bilevel resists;Hartney M.A. and Novembre A.E.;《1985 microlithography conferences. International Society for Optics and Photonics》;19851231;参见DISCUSSION第1-3段 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150207047A1 (en) | 2015-07-23 |
| JP6358960B2 (ja) | 2018-07-18 |
| TW201344232A (zh) | 2013-11-01 |
| KR20140125843A (ko) | 2014-10-29 |
| TWI588513B (zh) | 2017-06-21 |
| EP2812738A1 (en) | 2014-12-17 |
| CN104220902A (zh) | 2014-12-17 |
| EP2812738B1 (en) | 2016-10-12 |
| KR102001403B1 (ko) | 2019-07-18 |
| WO2013119796A1 (en) | 2013-08-15 |
| US9705056B2 (en) | 2017-07-11 |
| JP2015511332A (ja) | 2015-04-16 |
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