KR102001403B1 - 구배 중합체 구조물 및 방법 - Google Patents

구배 중합체 구조물 및 방법 Download PDF

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Publication number
KR102001403B1
KR102001403B1 KR1020147025160A KR20147025160A KR102001403B1 KR 102001403 B1 KR102001403 B1 KR 102001403B1 KR 1020147025160 A KR1020147025160 A KR 1020147025160A KR 20147025160 A KR20147025160 A KR 20147025160A KR 102001403 B1 KR102001403 B1 KR 102001403B1
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composition
region
refractive index
resin
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KR20140125843A (ko
Inventor
마사아키 아마코
제프리 브루스 가드너
스티븐 스위어
신 요시다
Original Assignee
다우 코닝 도레이 캄파니 리미티드
다우 실리콘즈 코포레이션
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Publication of KR20140125843A publication Critical patent/KR20140125843A/ko
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/18—Spheres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Led Device Packages (AREA)
KR1020147025160A 2012-02-09 2013-02-07 구배 중합체 구조물 및 방법 Expired - Fee Related KR102001403B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261596959P 2012-02-09 2012-02-09
US61/596,959 2012-02-09
PCT/US2013/025126 WO2013119796A1 (en) 2012-02-09 2013-02-07 Gradient polymer structures and methods

Publications (2)

Publication Number Publication Date
KR20140125843A KR20140125843A (ko) 2014-10-29
KR102001403B1 true KR102001403B1 (ko) 2019-07-18

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Country Status (7)

Country Link
US (1) US9705056B2 (enExample)
EP (1) EP2812738B1 (enExample)
JP (1) JP6358960B2 (enExample)
KR (1) KR102001403B1 (enExample)
CN (1) CN104220902B (enExample)
TW (1) TWI588513B (enExample)
WO (1) WO2013119796A1 (enExample)

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JP6358960B2 (ja) 2012-02-09 2018-07-18 ダウ シリコーンズ コーポレーション 勾配ポリマー構造及び方法
JP6387355B2 (ja) 2012-12-21 2018-09-05 ダウ シリコーンズ コーポレーション 層状ポリマー構造及び方法
US20160009866A1 (en) * 2013-03-15 2016-01-14 Dow Corning Corporation Compositions of Resin-Linear Organosiloxane Block Copolymers
KR20150133779A (ko) * 2013-03-15 2015-11-30 다우 코닝 코포레이션 분말 형태의 고체 실리콘-함유 핫 멜트 조성물을 침착하는 단계 및 그의 봉지재를 형성하는 단계를 포함하는, 광학 조립체의 제조 방법
WO2014197617A1 (en) * 2013-06-05 2014-12-11 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
WO2015042285A1 (en) 2013-09-18 2015-03-26 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
WO2015200587A1 (en) * 2014-06-25 2015-12-30 Dow Corning Corporation Layered polymer structures and methods
US9930750B2 (en) * 2014-08-20 2018-03-27 Lumens Co., Ltd. Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
KR20170058999A (ko) * 2014-09-23 2017-05-29 다우 코닝 코포레이션 접착제 조성물 및 이의 용도
FR3038710B1 (fr) * 2015-07-10 2021-05-28 Cpc Tech Capteur d'une caracteristique physique, comportant de preference une structure multicouches
JP7036505B2 (ja) * 2015-09-30 2022-03-15 スリーエム イノベイティブ プロパティズ カンパニー ガラス様層を含む複合構造物及び形成方法
DE102016114921A1 (de) * 2016-08-11 2018-02-15 Osram Opto Semiconductors Gmbh Silikonzusammensetzung
JPWO2018066559A1 (ja) * 2016-10-04 2019-07-18 東レ・ダウコーニング株式会社 化粧料組成物または外用剤組成物、および化粧料原料組成物
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JP6562044B2 (ja) * 2017-07-28 2019-08-21 セイコーエプソン株式会社 電気光学装置、電子機器、及び電気光学装置の製造方法
KR102334936B1 (ko) * 2017-11-08 2021-12-02 시아먼 산안 옵토일렉트로닉스 테크놀로지 캄파니 리미티드 자외선 led 패키징 구조
WO2025170712A1 (en) 2024-02-07 2025-08-14 Dow Silicones Corporation Epoxy-functional resin-linear polyorganosiloxane copolymer, composition containing the copolymer, and methods for their preparation and use
WO2025178717A1 (en) 2024-02-20 2025-08-28 Dow Silicones Corporation Alkenyl ester – functional resin – linear polyorganosiloxane block copolymer, composition containing the copolymer, and methods for their preparation and use

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Patent Citations (1)

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Also Published As

Publication number Publication date
US20150207047A1 (en) 2015-07-23
JP6358960B2 (ja) 2018-07-18
TW201344232A (zh) 2013-11-01
KR20140125843A (ko) 2014-10-29
TWI588513B (zh) 2017-06-21
EP2812738A1 (en) 2014-12-17
CN104220902A (zh) 2014-12-17
CN104220902B (zh) 2018-06-26
EP2812738B1 (en) 2016-10-12
WO2013119796A1 (en) 2013-08-15
US9705056B2 (en) 2017-07-11
JP2015511332A (ja) 2015-04-16

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