TWI588513B - 梯度聚合物結構及方法 - Google Patents
梯度聚合物結構及方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 76
- 229920000642 polymer Polymers 0.000 title description 17
- 239000000203 mixture Substances 0.000 claims description 222
- 230000003287 optical effect Effects 0.000 claims description 188
- 229920001400 block copolymer Polymers 0.000 claims description 175
- -1 polyoxymethylene Polymers 0.000 claims description 90
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 60
- 239000000463 material Substances 0.000 claims description 59
- 239000007787 solid Substances 0.000 claims description 54
- 239000002904 solvent Substances 0.000 claims description 39
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 35
- 229920006324 polyoxymethylene Polymers 0.000 claims description 35
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 33
- 230000015572 biosynthetic process Effects 0.000 claims description 17
- DKZRLCHWDNEKRH-UHFFFAOYSA-N 1-nonoxynonane Chemical group CCCCCCCCCOCCCCCCCCC DKZRLCHWDNEKRH-UHFFFAOYSA-N 0.000 claims description 16
- 239000012943 hotmelt Substances 0.000 claims description 11
- 229910020175 SiOH Inorganic materials 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 239000000565 sealant Substances 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 6
- 230000001788 irregular Effects 0.000 claims description 6
- 238000003786 synthesis reaction Methods 0.000 claims description 6
- 239000006227 byproduct Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000003100 immobilizing effect Effects 0.000 claims 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 161
- 229920005989 resin Polymers 0.000 description 158
- 239000011347 resin Substances 0.000 description 158
- 239000000243 solution Substances 0.000 description 108
- 239000010410 layer Substances 0.000 description 95
- 239000008247 solid mixture Substances 0.000 description 95
- 239000012071 phase Substances 0.000 description 63
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 48
- 238000006243 chemical reaction Methods 0.000 description 46
- 239000004032 superbase Substances 0.000 description 46
- 150000007525 superbases Chemical class 0.000 description 43
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 42
- 238000010992 reflux Methods 0.000 description 40
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 36
- 125000006612 decyloxy group Chemical group 0.000 description 36
- 239000003054 catalyst Substances 0.000 description 35
- 238000009833 condensation Methods 0.000 description 34
- 230000005494 condensation Effects 0.000 description 34
- 239000000758 substrate Substances 0.000 description 33
- 239000003381 stabilizer Substances 0.000 description 30
- 238000005481 NMR spectroscopy Methods 0.000 description 26
- 229920001577 copolymer Polymers 0.000 description 26
- 238000010438 heat treatment Methods 0.000 description 25
- 239000011541 reaction mixture Substances 0.000 description 24
- 230000008569 process Effects 0.000 description 23
- 238000003860 storage Methods 0.000 description 23
- 239000003960 organic solvent Substances 0.000 description 22
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 21
- 238000000576 coating method Methods 0.000 description 21
- 150000001875 compounds Chemical class 0.000 description 21
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 21
- 239000011701 zinc Substances 0.000 description 21
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 20
- 239000011572 manganese Substances 0.000 description 20
- 125000000217 alkyl group Chemical group 0.000 description 19
- 229910052950 sphalerite Inorganic materials 0.000 description 19
- 229910052984 zinc sulfide Inorganic materials 0.000 description 19
- 229910052757 nitrogen Inorganic materials 0.000 description 18
- 230000009477 glass transition Effects 0.000 description 17
- 238000002156 mixing Methods 0.000 description 17
- 229920003255 poly(phenylsilsesquioxane) Polymers 0.000 description 17
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 16
- 229910052725 zinc Inorganic materials 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 15
- 125000003118 aryl group Chemical group 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 150000003384 small molecules Chemical class 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 229910052684 Cerium Inorganic materials 0.000 description 13
- 239000000460 chlorine Substances 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 229910052748 manganese Inorganic materials 0.000 description 13
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 12
- 239000004809 Teflon Substances 0.000 description 12
- 229920006362 Teflon® Polymers 0.000 description 12
- 229910052771 Terbium Inorganic materials 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 12
- 239000008393 encapsulating agent Substances 0.000 description 12
- 239000003623 enhancer Substances 0.000 description 12
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 11
- 125000003545 alkoxy group Chemical group 0.000 description 11
- 238000000429 assembly Methods 0.000 description 11
- 230000000712 assembly Effects 0.000 description 11
- 239000002585 base Substances 0.000 description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 11
- 230000000704 physical effect Effects 0.000 description 11
- 229910052801 chlorine Inorganic materials 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 238000004132 cross linking Methods 0.000 description 10
- 239000004205 dimethyl polysiloxane Substances 0.000 description 10
- 239000011777 magnesium Substances 0.000 description 10
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- 238000010533 azeotropic distillation Methods 0.000 description 9
- 150000001639 boron compounds Chemical class 0.000 description 9
- 229910052793 cadmium Inorganic materials 0.000 description 9
- 238000006482 condensation reaction Methods 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 9
- 125000006611 nonyloxy group Chemical group 0.000 description 9
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 8
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 8
- 239000011575 calcium Substances 0.000 description 8
- 229910052731 fluorine Inorganic materials 0.000 description 8
- 229910052749 magnesium Inorganic materials 0.000 description 8
- 229910052707 ruthenium Inorganic materials 0.000 description 8
- 229910052712 strontium Inorganic materials 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 6
- 229910052787 antimony Inorganic materials 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 229910052791 calcium Inorganic materials 0.000 description 6
- 239000013522 chelant Substances 0.000 description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 125000005375 organosiloxane group Chemical group 0.000 description 6
- QULYNCCPRWKEMF-UHFFFAOYSA-N parachlorobenzotrifluoride Chemical compound FC(F)(F)C1=CC=C(Cl)C=C1 QULYNCCPRWKEMF-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 5
- 229910004283 SiO 4 Inorganic materials 0.000 description 5
- 239000008346 aqueous phase Substances 0.000 description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- PZKBIVOXIFYDRI-UHFFFAOYSA-N CC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound CC(C(OCC)(OCC)OCC)CCCCCCCC PZKBIVOXIFYDRI-UHFFFAOYSA-N 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 229910052693 Europium Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 4
- 150000001642 boronic acid derivatives Chemical group 0.000 description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 4
- 229910052794 bromium Inorganic materials 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- ZCSHNCUQKCANBX-UHFFFAOYSA-N lithium diisopropylamide Chemical compound [Li+].CC(C)[N-]C(C)C ZCSHNCUQKCANBX-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 4
- 125000001624 naphthyl group Chemical group 0.000 description 4
- 150000002923 oximes Chemical class 0.000 description 4
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 4
- HXITXNWTGFUOAU-UHFFFAOYSA-N phenylboronic acid Chemical compound OB(O)C1=CC=CC=C1 HXITXNWTGFUOAU-UHFFFAOYSA-N 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 229920002620 polyvinyl fluoride Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 229910003450 rhodium oxide Inorganic materials 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 4
- 239000008096 xylene Substances 0.000 description 4
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 3
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 3
- 229910052688 Gadolinium Inorganic materials 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910052777 Praseodymium Inorganic materials 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- CUJRVFIICFDLGR-UHFFFAOYSA-N acetylacetonate Chemical compound CC(=O)[CH-]C(C)=O CUJRVFIICFDLGR-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000001110 calcium chloride Substances 0.000 description 3
- 229910001628 calcium chloride Inorganic materials 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000000518 rheometry Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 238000013517 stratification Methods 0.000 description 3
- 238000005382 thermal cycling Methods 0.000 description 3
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 2
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 2
- OEBXWWBYZJNKRK-UHFFFAOYSA-N 1-methyl-2,3,4,6,7,8-hexahydropyrimido[1,2-a]pyrimidine Chemical compound C1CCN=C2N(C)CCCN21 OEBXWWBYZJNKRK-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical class [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical class [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- WAEMQWOKJMHJLA-UHFFFAOYSA-N Manganese(2+) Chemical compound [Mn+2] WAEMQWOKJMHJLA-UHFFFAOYSA-N 0.000 description 2
- 229910020068 MgAl Inorganic materials 0.000 description 2
- 229910016006 MoSi Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920002675 Polyoxyl Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910003668 SrAl Inorganic materials 0.000 description 2
- LINDOXZENKYESA-UHFFFAOYSA-N TMG Natural products CNC(N)=NC LINDOXZENKYESA-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000002877 alkyl aryl group Chemical group 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000003849 aromatic solvent Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000004630 atomic force microscopy Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003012 bilayer membrane Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- ZADPBFCGQRWHPN-UHFFFAOYSA-N boronic acid Chemical compound OBO ZADPBFCGQRWHPN-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- MJSNUBOCVAKFIJ-LNTINUHCSA-N chromium;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Cr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O MJSNUBOCVAKFIJ-LNTINUHCSA-N 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000002633 crown compound Substances 0.000 description 2
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PXRMLPZQBFWPCV-UHFFFAOYSA-N dioxasilirane Chemical compound O1O[SiH2]1 PXRMLPZQBFWPCV-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 150000002429 hydrazines Chemical class 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- KPADFPAILITQBG-UHFFFAOYSA-N non-4-ene Chemical compound CCCCC=CCCC KPADFPAILITQBG-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 2
- 230000002028 premature Effects 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 241000894007 species Species 0.000 description 2
- BGHCVCJVXZWKCC-UHFFFAOYSA-N tetradecane Chemical compound CCCCCCCCCCCCCC BGHCVCJVXZWKCC-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 239000003643 water by type Substances 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- KYPCCSCZXRYUAE-UHFFFAOYSA-N (2,6-dimethoxy-4-methylphenyl)boronic acid Chemical compound COC1=CC(C)=CC(OC)=C1B(O)O KYPCCSCZXRYUAE-UHFFFAOYSA-N 0.000 description 1
- UQMOSSMYPIJNTO-UHFFFAOYSA-N (2-hydroxy-3-methylphenyl)boronic acid Chemical compound CC1=CC=CC(B(O)O)=C1O UQMOSSMYPIJNTO-UHFFFAOYSA-N 0.000 description 1
- BJPNVVXTUYMJPN-UHFFFAOYSA-N (3-chloro-2-methylphenyl)boronic acid Chemical compound CC1=C(Cl)C=CC=C1B(O)O BJPNVVXTUYMJPN-UHFFFAOYSA-N 0.000 description 1
- OVVBLFYHZAMJIK-UHFFFAOYSA-N (3-ethoxy-5-fluorophenyl)boronic acid Chemical compound CCOC1=CC(F)=CC(B(O)O)=C1 OVVBLFYHZAMJIK-UHFFFAOYSA-N 0.000 description 1
- QQPLHUGOUZKARP-UHFFFAOYSA-N (3-fluoro-5-methylphenyl)boronic acid Chemical compound CC1=CC(F)=CC(B(O)O)=C1 QQPLHUGOUZKARP-UHFFFAOYSA-N 0.000 description 1
- HJJYROZZJOJOOW-UHFFFAOYSA-N (3-fluoro-5-propan-2-yloxyphenyl)boronic acid Chemical compound CC(C)OC1=CC(F)=CC(B(O)O)=C1 HJJYROZZJOJOOW-UHFFFAOYSA-N 0.000 description 1
- XWWPIVKWAIMBMU-UHFFFAOYSA-N (3-tert-butyl-5-methylphenyl)boronic acid Chemical compound CC1=CC(B(O)O)=CC(C(C)(C)C)=C1 XWWPIVKWAIMBMU-UHFFFAOYSA-N 0.000 description 1
- LUJMSRVFSBMEOY-UHFFFAOYSA-N (4-fluoro-3-methoxyphenyl)boronic acid Chemical compound COC1=CC(B(O)O)=CC=C1F LUJMSRVFSBMEOY-UHFFFAOYSA-N 0.000 description 1
- QPOZYGYRIMYFHZ-UHFFFAOYSA-N (4-methylphenoxy)-phenylborinic acid Chemical compound C1=CC(C)=CC=C1OB(O)C1=CC=CC=C1 QPOZYGYRIMYFHZ-UHFFFAOYSA-N 0.000 description 1
- 125000006527 (C1-C5) alkyl group Chemical group 0.000 description 1
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 1
- RWOVIHFIKCUATE-UHFFFAOYSA-N 1,1,1-trifluoro-4-methyltridecane Chemical compound FC(CCC(CCCCCCCCC)C)(F)F RWOVIHFIKCUATE-UHFFFAOYSA-N 0.000 description 1
- BTEUIBDFAWRTOO-UHFFFAOYSA-N 1,1,1-trifluorotridecane Chemical compound CCCCCCCCCCCCC(F)(F)F BTEUIBDFAWRTOO-UHFFFAOYSA-N 0.000 description 1
- USGNHCIMRGKVOP-UHFFFAOYSA-N 1,1,1-triphenylnonan-2-ylbenzene Chemical compound C1(=CC=CC=C1)C(C(C1=CC=CC=C1)(C1=CC=CC=C1)C1=CC=CC=C1)CCCCCCC USGNHCIMRGKVOP-UHFFFAOYSA-N 0.000 description 1
- BTEIWWXAPYLKDK-UHFFFAOYSA-N 1,1-diphenyldecylbenzene Chemical compound CCCCCCCCCC(c1ccccc1)(c1ccccc1)c1ccccc1 BTEIWWXAPYLKDK-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical group NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- GJFNRSDCSTVPCJ-UHFFFAOYSA-N 1,8-bis(dimethylamino)naphthalene Chemical compound C1=CC(N(C)C)=C2C(N(C)C)=CC=CC2=C1 GJFNRSDCSTVPCJ-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- AWBIJARKDOFDAN-UHFFFAOYSA-N 2,5-dimethyl-1,4-dioxane Chemical compound CC1COC(C)CO1 AWBIJARKDOFDAN-UHFFFAOYSA-N 0.000 description 1
- XTDKZSUYCXHXJM-UHFFFAOYSA-N 2-methoxyoxane Chemical compound COC1CCCCO1 XTDKZSUYCXHXJM-UHFFFAOYSA-N 0.000 description 1
- ZAZPDOYUCVFPOI-UHFFFAOYSA-N 2-methylpropylboronic acid Chemical compound CC(C)CB(O)O ZAZPDOYUCVFPOI-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- BGWUXZLHDLNYHW-UHFFFAOYSA-N 3-methoxy-5-nitroaniline Chemical compound COC1=CC(N)=CC([N+]([O-])=O)=C1 BGWUXZLHDLNYHW-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OKESAOJLENXIQT-UHFFFAOYSA-N B(C(=O)C1=C(C=CC(=C1)OC)F)(O)O Chemical compound B(C(=O)C1=C(C=CC(=C1)OC)F)(O)O OKESAOJLENXIQT-UHFFFAOYSA-N 0.000 description 1
- KTBISZFYFDAYGC-UHFFFAOYSA-N B(O)(O)OC1=C(C=C(C(=C1)C)Br)C Chemical compound B(O)(O)OC1=C(C=C(C(=C1)C)Br)C KTBISZFYFDAYGC-UHFFFAOYSA-N 0.000 description 1
- YFOJSGMCNWXPLW-UHFFFAOYSA-N B(O)O.CC(=C)C Chemical compound B(O)O.CC(=C)C YFOJSGMCNWXPLW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229910016066 BaSi Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- UEYMLSDWUUKDND-UHFFFAOYSA-N C(C)C(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C(C)C(C(OCC)(OCC)OCC)CCCCCCCC UEYMLSDWUUKDND-UHFFFAOYSA-N 0.000 description 1
- RVDRXAVMMMTERV-UHFFFAOYSA-N C(C)OC(=O)C=1C=C(C=C(C1)F)OB(O)O Chemical compound C(C)OC(=O)C=1C=C(C=C(C1)F)OB(O)O RVDRXAVMMMTERV-UHFFFAOYSA-N 0.000 description 1
- LNEJJQMNHUGXDW-UHFFFAOYSA-N CC(C(OCC)(OCC)C)CCCCCCCC Chemical compound CC(C(OCC)(OCC)C)CCCCCCCC LNEJJQMNHUGXDW-UHFFFAOYSA-N 0.000 description 1
- COQYUAJAXLUAHF-UHFFFAOYSA-N CC(CCCCCCCCCOC)(C)C Chemical compound CC(CCCCCCCCCOC)(C)C COQYUAJAXLUAHF-UHFFFAOYSA-N 0.000 description 1
- ICLWANDVDRTPBG-UHFFFAOYSA-N CC(CCCCCCCCCOCC)(C)C Chemical compound CC(CCCCCCCCCOCC)(C)C ICLWANDVDRTPBG-UHFFFAOYSA-N 0.000 description 1
- KCMZYCFSSYXEQR-UHFFFAOYSA-N CCCC[K] Chemical compound CCCC[K] KCMZYCFSSYXEQR-UHFFFAOYSA-N 0.000 description 1
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- 229910004762 CaSiO Inorganic materials 0.000 description 1
- 150000000703 Cerium Chemical class 0.000 description 1
- 229910005793 GeO 2 Inorganic materials 0.000 description 1
- 239000007818 Grignard reagent Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910017857 MgGa Inorganic materials 0.000 description 1
- 229910017639 MgSi Inorganic materials 0.000 description 1
- 238000012565 NMR experiment Methods 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- GKEMDZIGTOAZRK-UHFFFAOYSA-N [3-methoxy-5-(trifluoromethyl)phenyl]boronic acid Chemical compound COC1=CC(B(O)O)=CC(C(F)(F)F)=C1 GKEMDZIGTOAZRK-UHFFFAOYSA-N 0.000 description 1
- BUSMBMGODABSIN-UHFFFAOYSA-N [4-methoxy-3-(trifluoromethyl)phenyl]boronic acid Chemical compound COC1=CC=C(B(O)O)C=C1C(F)(F)F BUSMBMGODABSIN-UHFFFAOYSA-N 0.000 description 1
- DWKNRQOBEUJPQO-UHFFFAOYSA-N [O].C1COCCO1 Chemical compound [O].C1COCCO1 DWKNRQOBEUJPQO-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- 150000004729 acetoacetic acid derivatives Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 229910000102 alkali metal hydride Inorganic materials 0.000 description 1
- 150000008046 alkali metal hydrides Chemical class 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 125000005620 boronic acid group Chemical class 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical class CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012973 diazabicyclooctane Substances 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000002518 distortionless enhancement with polarization transfer Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 150000004795 grignard reagents Chemical class 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229940030980 inova Drugs 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- IDBFBDSKYCUNPW-UHFFFAOYSA-N lithium nitride Chemical compound [Li]N([Li])[Li] IDBFBDSKYCUNPW-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 159000000003 magnesium salts Chemical class 0.000 description 1
- WXPNTKUIDRYHOP-UHFFFAOYSA-L magnesium;3-oxobutanoate Chemical compound [Mg+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O WXPNTKUIDRYHOP-UHFFFAOYSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229930003658 monoterpene Natural products 0.000 description 1
- 235000002577 monoterpenes Nutrition 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229940062043 nitrogen 50 % Drugs 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 125000001979 organolithium group Chemical group 0.000 description 1
- 125000002734 organomagnesium group Chemical group 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 238000006146 oximation reaction Methods 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- 125000005429 oxyalkyl group Chemical group 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- NTTOTNSKUYCDAV-UHFFFAOYSA-N potassium hydride Chemical compound [KH] NTTOTNSKUYCDAV-UHFFFAOYSA-N 0.000 description 1
- 229910000105 potassium hydride Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 150000003304 ruthenium compounds Chemical group 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000000235 small-angle X-ray scattering Methods 0.000 description 1
- 238000001998 small-angle neutron scattering Methods 0.000 description 1
- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- 239000012312 sodium hydride Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 238000006277 sulfonation reaction Methods 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium group Chemical group [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 1
- JABYJIQOLGWMQW-UHFFFAOYSA-N undec-4-ene Chemical compound CCCCCCC=CCCC JABYJIQOLGWMQW-UHFFFAOYSA-N 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- ZPBLKGWQKXKXOZ-UHFFFAOYSA-N yttrium zinc Chemical compound [Zn].[Y] ZPBLKGWQKXKXOZ-UHFFFAOYSA-N 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/18—Spheres
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
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- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
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- Led Device Packages (AREA)
- Medicinal Chemistry (AREA)
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261596959P | 2012-02-09 | 2012-02-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201344232A TW201344232A (zh) | 2013-11-01 |
| TWI588513B true TWI588513B (zh) | 2017-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW102105170A TWI588513B (zh) | 2012-02-09 | 2013-02-08 | 梯度聚合物結構及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9705056B2 (enExample) |
| EP (1) | EP2812738B1 (enExample) |
| JP (1) | JP6358960B2 (enExample) |
| KR (1) | KR102001403B1 (enExample) |
| CN (1) | CN104220902B (enExample) |
| TW (1) | TWI588513B (enExample) |
| WO (1) | WO2013119796A1 (enExample) |
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| EP2812738B1 (en) | 2012-02-09 | 2016-10-12 | Dow Corning Corporation | Gradient polymer structures and methods |
| KR102091994B1 (ko) | 2012-12-21 | 2020-03-23 | 다우 실리콘즈 코포레이션 | 층상 중합체 구조물 및 방법 |
| WO2014150841A2 (en) * | 2013-03-15 | 2014-09-25 | Dow Corning Corporation | Powdered resin linear organopolysiloxane compositions |
| US20160009866A1 (en) * | 2013-03-15 | 2016-01-14 | Dow Corning Corporation | Compositions of Resin-Linear Organosiloxane Block Copolymers |
| WO2014197617A1 (en) * | 2013-06-05 | 2014-12-11 | Dow Corning Corporation | Compositions of resin-linear organosiloxane block copolymers |
| EP3046981B1 (en) | 2013-09-18 | 2020-04-01 | Dow Silicones Corporation | Compositions of resin-linear organosiloxane block copolymers |
| CN106796978B (zh) * | 2014-06-25 | 2019-09-17 | 美国陶氏有机硅公司 | 层状聚合物结构和方法 |
| US9930750B2 (en) * | 2014-08-20 | 2018-03-27 | Lumens Co., Ltd. | Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package |
| CN107995918A (zh) * | 2014-09-23 | 2018-05-04 | 道康宁公司 | 粘合剂组合物及其用途 |
| FR3038710B1 (fr) * | 2015-07-10 | 2021-05-28 | Cpc Tech | Capteur d'une caracteristique physique, comportant de preference une structure multicouches |
| JP7036505B2 (ja) * | 2015-09-30 | 2022-03-15 | スリーエム イノベイティブ プロパティズ カンパニー | ガラス様層を含む複合構造物及び形成方法 |
| DE102016114921A1 (de) | 2016-08-11 | 2018-02-15 | Osram Opto Semiconductors Gmbh | Silikonzusammensetzung |
| JPWO2018066559A1 (ja) * | 2016-10-04 | 2019-07-18 | 東レ・ダウコーニング株式会社 | 化粧料組成物または外用剤組成物、および化粧料原料組成物 |
| US11015025B2 (en) | 2017-07-27 | 2021-05-25 | Dow Silicones Corporation | Hydrosilylation curable polysiloxane |
| JP6562044B2 (ja) * | 2017-07-28 | 2019-08-21 | セイコーエプソン株式会社 | 電気光学装置、電子機器、及び電気光学装置の製造方法 |
| JP7130745B2 (ja) * | 2017-11-08 | 2022-09-05 | 廈門市三安光電科技有限公司 | 紫外ｌｅｄパッケージ構造 |
| WO2025170712A1 (en) | 2024-02-07 | 2025-08-14 | Dow Silicones Corporation | Epoxy-functional resin-linear polyorganosiloxane copolymer, composition containing the copolymer, and methods for their preparation and use |
| WO2025178717A1 (en) | 2024-02-20 | 2025-08-28 | Dow Silicones Corporation | Alkenyl ester – functional resin – linear polyorganosiloxane block copolymer, composition containing the copolymer, and methods for their preparation and use |
| WO2026141133A1 (ja) * | 2024-12-25 | 2026-07-02 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
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2013
- 2013-02-07 EP EP13705350.0A patent/EP2812738B1/en not_active Not-in-force
- 2013-02-07 KR KR1020147025160A patent/KR102001403B1/ko not_active Expired - Fee Related
- 2013-02-07 CN CN201380015908.3A patent/CN104220902B/zh active Active
- 2013-02-07 WO PCT/US2013/025126 patent/WO2013119796A1/en not_active Ceased
- 2013-02-07 JP JP2014556659A patent/JP6358960B2/ja active Active
- 2013-02-07 US US14/377,770 patent/US9705056B2/en active Active
- 2013-02-08 TW TW102105170A patent/TWI588513B/zh not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201344232A (zh) | 2013-11-01 |
| EP2812738A1 (en) | 2014-12-17 |
| EP2812738B1 (en) | 2016-10-12 |
| US9705056B2 (en) | 2017-07-11 |
| JP6358960B2 (ja) | 2018-07-18 |
| CN104220902A (zh) | 2014-12-17 |
| WO2013119796A1 (en) | 2013-08-15 |
| KR20140125843A (ko) | 2014-10-29 |
| KR102001403B1 (ko) | 2019-07-18 |
| JP2015511332A (ja) | 2015-04-16 |
| US20150207047A1 (en) | 2015-07-23 |
| CN104220902B (zh) | 2018-06-26 |
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