CN104220399B - 氧化物烧结体和使用其的配线基板 - Google Patents

氧化物烧结体和使用其的配线基板 Download PDF

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Publication number
CN104220399B
CN104220399B CN201380019005.2A CN201380019005A CN104220399B CN 104220399 B CN104220399 B CN 104220399B CN 201380019005 A CN201380019005 A CN 201380019005A CN 104220399 B CN104220399 B CN 104220399B
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sintered body
oxidate sintered
oxide sintered
constant
oxidate
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CN104220399A (zh
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小塚久司
菱田智子
山田嗣人
大林和重
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3227—Lanthanum oxide or oxide-forming salts thereof
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    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
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    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
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    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/76—Crystal structural characteristics, e.g. symmetry
    • C04B2235/768—Perovskite structure ABO3
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    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/80—Phases present in the sintered or melt-cast ceramic products other than the main phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
CN201380019005.2A 2012-04-06 2013-04-02 氧化物烧结体和使用其的配线基板 Active CN104220399B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-087078 2012-04-06
JP2012087078 2012-04-06
PCT/JP2013/002283 WO2013150779A1 (ja) 2012-04-06 2013-04-02 酸化物焼結体及びそれを用いた配線基板

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CN104220399A CN104220399A (zh) 2014-12-17
CN104220399B true CN104220399B (zh) 2016-05-18

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US (1) US9136033B2 (enExample)
EP (2) EP3078648B1 (enExample)
JP (1) JP5851591B2 (enExample)
KR (1) KR101645838B1 (enExample)
CN (1) CN104220399B (enExample)
CA (1) CA2869627C (enExample)
DK (2) DK3078648T3 (enExample)
IN (1) IN2014DN08273A (enExample)
WO (1) WO2013150779A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6152481B2 (ja) * 2014-12-15 2017-06-21 日本特殊陶業株式会社 導電性酸化物焼結体、導電用部材、ガスセンサ、圧電素子、及び、圧電素子の製造方法
JP6571383B2 (ja) 2015-05-13 2019-09-04 日本特殊陶業株式会社 ガスセンサ
JP6440566B2 (ja) 2015-05-13 2018-12-19 日本特殊陶業株式会社 酸素センサ電極用導電性酸化物焼結体、及び、それを用いた酸素センサ
JP6192689B2 (ja) * 2015-07-13 2017-09-06 日本特殊陶業株式会社 ガスセンサ素子、及び、ガスセンサ
JP6523878B2 (ja) 2015-08-31 2019-06-05 日本特殊陶業株式会社 ガスセンサ制御装置
JP6577408B2 (ja) * 2016-04-20 2019-09-18 日本特殊陶業株式会社 ガスセンサ素子およびガスセンサ
JP6734733B2 (ja) * 2016-08-12 2020-08-05 日本特殊陶業株式会社 ガスセンサ用導電性酸化物焼結体、導電性酸化物焼結体、配線基板及びガスセンサ
JP2019105505A (ja) * 2017-12-12 2019-06-27 日本特殊陶業株式会社 ガスセンサ素子およびガスセンサ

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JP2954643B2 (ja) 1990-04-03 1999-09-27 バブコツク日立株式会社 ボイラ装置
JP2880044B2 (ja) * 1993-05-26 1999-04-05 日立金属株式会社 磁気ヘッド用非磁性基板材料
JPH10275724A (ja) * 1997-03-31 1998-10-13 Hitachi Metals Ltd 磁気ヘッド用非磁性材料
JP3286906B2 (ja) 1997-10-21 2002-05-27 株式会社村田製作所 負の抵抗温度特性を有する半導体セラミック素子
TW457498B (en) * 1998-12-03 2001-10-01 Murata Manufacturing Co Semiconductor ceramic and semiconductor ceramic device
US6358875B1 (en) * 1999-01-25 2002-03-19 Murata Manufacturing Co., Ltd. Semiconductive ceramic material, semiconductive ceramic, and semiconductive ceramic element
JP2000252104A (ja) * 1999-03-04 2000-09-14 Murata Mfg Co Ltd 半導体セラミックおよび半導体セラミック素子
JP3780851B2 (ja) * 2000-03-02 2006-05-31 株式会社村田製作所 チタン酸バリウムおよびその製造方法ならびに誘電体セラミックおよびセラミック電子部品
JP2002087882A (ja) 2000-09-14 2002-03-27 Matsushita Electric Ind Co Ltd 半導体磁器組成物とこれを用いた半導体磁器素子及びその製造方法
EP1408018A1 (en) * 2002-10-09 2004-04-14 The Boc Group, Inc. Supported perovskite-type oxides and methods for preparation thereof
TW200927698A (en) * 2007-09-28 2009-07-01 Tdk Corp Dielectric ceramic composition and electronic device
JP5546995B2 (ja) * 2010-08-17 2014-07-09 日本特殊陶業株式会社 導電性酸化物焼結体、これを用いたサーミスタ素子、及びこれを用いた温度センサ
JP2012056809A (ja) 2010-09-10 2012-03-22 Ngk Spark Plug Co Ltd ペロブスカイト型導電性酸化物材料及びそれを用いた電極
JP2012056810A (ja) 2010-09-10 2012-03-22 Ngk Spark Plug Co Ltd ペロブスカイト型導電性酸化物材料及びそれを用いた電極

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KR101645838B1 (ko) 2016-08-04
DK2835363T3 (en) 2018-04-23
US20150099142A1 (en) 2015-04-09
EP2835363A1 (en) 2015-02-11
CA2869627C (en) 2018-06-12
EP2835363B1 (en) 2018-03-07
EP3078648A1 (en) 2016-10-12
CA2869627A1 (en) 2013-10-10
KR20140141639A (ko) 2014-12-10
IN2014DN08273A (enExample) 2015-05-15
EP2835363A4 (en) 2015-11-18
JPWO2013150779A1 (ja) 2015-12-17
WO2013150779A1 (ja) 2013-10-10
EP3078648B1 (en) 2019-11-13
US9136033B2 (en) 2015-09-15
DK3078648T3 (da) 2020-01-27
JP5851591B2 (ja) 2016-02-03
CN104220399A (zh) 2014-12-17

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