CN103988306B - 图像拾取面板和图像拾取处理系统 - Google Patents

图像拾取面板和图像拾取处理系统 Download PDF

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Publication number
CN103988306B
CN103988306B CN201280060473.XA CN201280060473A CN103988306B CN 103988306 B CN103988306 B CN 103988306B CN 201280060473 A CN201280060473 A CN 201280060473A CN 103988306 B CN103988306 B CN 103988306B
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China
Prior art keywords
image pickup
light
photodetection
wiring layer
photodetection portion
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Expired - Fee Related
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CN201280060473.XA
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English (en)
Chinese (zh)
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CN103988306A (zh
Inventor
大鸟居英
代田典久
富樫治夫
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2006Measuring radiation intensity with scintillation detectors using a combination of a scintillator and photodetector which measures the means radiation intensity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2018Scintillation-photodiode combinations
    • G01T1/20185Coupling means between the photodiode and the scintillator, e.g. optical couplings using adhesives with wavelength-shifting fibres
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2018Scintillation-photodiode combinations
    • G01T1/20188Auxiliary details, e.g. casings or cooling
    • G01T1/2019Shielding against direct hits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/202Measuring radiation intensity with scintillation detectors the detector being a crystal
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/202Measuring radiation intensity with scintillation detectors the detector being a crystal
    • G01T1/2023Selection of materials
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/24Measuring radiation intensity with semiconductor detectors
    • G01T1/247Detector read-out circuitry
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1898Indirect radiation image sensors, e.g. using luminescent members
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/811Interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers

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  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201280060473.XA 2011-12-15 2012-12-07 图像拾取面板和图像拾取处理系统 Expired - Fee Related CN103988306B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-274780 2011-12-15
JP2011274780A JP5895504B2 (ja) 2011-12-15 2011-12-15 撮像パネルおよび撮像処理システム
PCT/JP2012/082436 WO2013089209A2 (en) 2011-12-15 2012-12-07 Image pickup panel and image pickup processing system

Publications (2)

Publication Number Publication Date
CN103988306A CN103988306A (zh) 2014-08-13
CN103988306B true CN103988306B (zh) 2017-03-08

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CN201280060473.XA Expired - Fee Related CN103988306B (zh) 2011-12-15 2012-12-07 图像拾取面板和图像拾取处理系统

Country Status (6)

Country Link
US (3) US9164182B2 (https=)
JP (1) JP5895504B2 (https=)
KR (1) KR102090343B1 (https=)
CN (1) CN103988306B (https=)
TW (1) TWI491058B (https=)
WO (1) WO2013089209A2 (https=)

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CN109416406B (zh) * 2016-07-05 2023-06-20 深圳帧观德芯科技有限公司 具有不同热膨胀系数的接合材料
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Also Published As

Publication number Publication date
KR102090343B1 (ko) 2020-03-17
US9651683B2 (en) 2017-05-16
WO2013089209A2 (en) 2013-06-20
US10663604B2 (en) 2020-05-26
US20140326892A1 (en) 2014-11-06
TW201330303A (zh) 2013-07-16
US20160033655A1 (en) 2016-02-04
JP5895504B2 (ja) 2016-03-30
WO2013089209A3 (en) 2013-08-15
JP2013124976A (ja) 2013-06-24
TWI491058B (zh) 2015-07-01
CN103988306A (zh) 2014-08-13
US20170219722A1 (en) 2017-08-03
KR20140113638A (ko) 2014-09-24
US9164182B2 (en) 2015-10-20

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