CN103906856B - 用于通过真空蒸发沉积薄膜的装置的喷射系统 - Google Patents

用于通过真空蒸发沉积薄膜的装置的喷射系统 Download PDF

Info

Publication number
CN103906856B
CN103906856B CN201280051570.2A CN201280051570A CN103906856B CN 103906856 B CN103906856 B CN 103906856B CN 201280051570 A CN201280051570 A CN 201280051570A CN 103906856 B CN103906856 B CN 103906856B
Authority
CN
China
Prior art keywords
module
container
jet module
spraying system
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280051570.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN103906856A (zh
Inventor
J-L·居约克斯
J·维莱特
N·布莱恩特
D·埃斯特韦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rui Bier
Original Assignee
Rui Bier
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rui Bier filed Critical Rui Bier
Publication of CN103906856A publication Critical patent/CN103906856A/zh
Application granted granted Critical
Publication of CN103906856B publication Critical patent/CN103906856B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225Oblique incidence of vaporised material on substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228Gas flow assisted PVD deposition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/246Replenishment of source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201280051570.2A 2011-10-21 2012-10-18 用于通过真空蒸发沉积薄膜的装置的喷射系统 Active CN103906856B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1159560 2011-10-21
FR1159560A FR2981667B1 (fr) 2011-10-21 2011-10-21 Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide
PCT/FR2012/052388 WO2013057443A1 (fr) 2011-10-21 2012-10-18 Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide

Publications (2)

Publication Number Publication Date
CN103906856A CN103906856A (zh) 2014-07-02
CN103906856B true CN103906856B (zh) 2016-11-09

Family

ID=47221468

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280051570.2A Active CN103906856B (zh) 2011-10-21 2012-10-18 用于通过真空蒸发沉积薄膜的装置的喷射系统

Country Status (9)

Country Link
US (1) US20140245955A1 (enExample)
EP (1) EP2769001B1 (enExample)
JP (1) JP6170927B2 (enExample)
KR (1) KR102108173B1 (enExample)
CN (1) CN103906856B (enExample)
FR (1) FR2981667B1 (enExample)
IN (1) IN2014DN03425A (enExample)
SG (1) SG11201401635PA (enExample)
WO (1) WO2013057443A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016070941A1 (en) * 2014-11-07 2016-05-12 Applied Materials, Inc. Material source arrangment and nozzle for vacuum deposition
KR102082192B1 (ko) * 2014-11-07 2020-02-27 어플라이드 머티어리얼스, 인코포레이티드 증발된 재료를 증착하기 위한 장치, 분배 파이프, 진공 증착 챔버, 및 증발된 재료를 증착하기 위한 방법
CN107078215B (zh) * 2014-11-07 2020-09-22 应用材料公司 用于真空沉积的材料源配置与材料分布配置
EP3245313B1 (en) * 2015-07-13 2018-12-05 Applied Materials, Inc. Evaporation source.
CN105088145B (zh) * 2015-08-19 2017-03-29 京东方科技集团股份有限公司 用于oled蒸发源的坩埚及其制造方法
CN205443432U (zh) * 2016-04-07 2016-08-10 鄂尔多斯市源盛光电有限责任公司 一种线性蒸发源、蒸发源系统及蒸镀装置
JP6823954B2 (ja) * 2016-07-08 2021-02-03 株式会社ジャパンディスプレイ 成膜装置および成膜方法
CN106868456B (zh) * 2017-03-21 2019-03-12 京东方科技集团股份有限公司 蒸发源和蒸镀设备
JP6543664B2 (ja) * 2017-09-11 2019-07-10 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 真空堆積チャンバ
CN109943806A (zh) * 2017-12-20 2019-06-28 合肥欣奕华智能机器有限公司 一种线性蒸发源装置及蒸镀装置
CN109817842B (zh) * 2019-01-16 2021-10-01 京东方科技集团股份有限公司 一种真空干燥装置、显示用基板的制备方法
JP2022107982A (ja) * 2021-01-12 2022-07-25 キヤノントッキ株式会社 蒸発源装置、成膜装置、成膜方法及び電子デバイスの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1519391A (zh) * 2002-11-30 2004-08-11 应用菲林股份有限两合公司 蒸镀装置
CN1904129A (zh) * 2005-07-28 2007-01-31 应用薄膜有限公司 蒸发器装置
DE102010046389A1 (de) * 2009-09-25 2011-05-19 Creaphys Gmbh Verdampfereinrichtung für eine Beschichtungsanlage und Beschichtungsanlage

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2688500A (en) * 1952-01-02 1954-09-07 Laval Separator Co De Coupling for pipes
US3661117A (en) * 1969-12-03 1972-05-09 Stanford Research Inst Apparatus for depositing thin lines
US4016310A (en) * 1975-04-23 1977-04-05 Xerox Corporation Coater hardware and method for obtaining uniform photoconductive layers on a xerographic photoreceptor
US4756465A (en) * 1985-04-15 1988-07-12 Latviisky Gosudarstvenny Institut Method of cold welding
DE3636891A1 (de) * 1986-10-30 1988-05-11 Armin Dommer Verfahren und vorrichtung zum stumpfschweissen von kunststoff-rohrabschnitten oder kunststoff-formstuecken
US5186120A (en) * 1989-03-22 1993-02-16 Mitsubishi Denki Kabushiki Kaisha Mixture thin film forming apparatus
JP3139179B2 (ja) * 1992-10-12 2001-02-26 オイレス工業株式会社 球帯状シール体
US5458725A (en) * 1993-08-17 1995-10-17 Motorola, Inc. Gas distribution system
FR2800754B1 (fr) * 1999-11-08 2003-05-09 Joint Industrial Processors For Electronics Dispositif evaporateur d'une installation de depot chimique en phase vapeur
US20060127599A1 (en) * 2002-02-12 2006-06-15 Wojak Gregory J Process and apparatus for preparing a diamond substance
JP4015064B2 (ja) * 2003-05-28 2007-11-28 トッキ株式会社 蒸着装置
KR100659762B1 (ko) * 2005-01-17 2006-12-19 삼성에스디아이 주식회사 증발원, 증착장치 및 이를 이용한 증착방법
KR101153161B1 (ko) * 2005-04-01 2012-06-18 주성엔지니어링(주) 가스분사장치 및 이를 포함하는 액정표시소자의 제조장치
JP5213341B2 (ja) * 2007-03-20 2013-06-19 東京エレクトロン株式会社 気化器,気化モジュール,成膜装置
JP2008274322A (ja) * 2007-04-26 2008-11-13 Sony Corp 蒸着装置
JP5043776B2 (ja) * 2008-08-08 2012-10-10 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US8512806B2 (en) * 2008-08-12 2013-08-20 Momentive Performance Materials Inc. Large volume evaporation source
US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
JP4831841B2 (ja) * 2009-07-10 2011-12-07 三菱重工業株式会社 真空蒸着装置及び方法
KR100977374B1 (ko) * 2009-08-03 2010-08-20 텔리오솔라 테크놀로지스 인크 대면적 박막형 cigs 태양전지 고속증착 및 양산장비, 그 공정방법
JP5642952B2 (ja) * 2009-09-07 2014-12-17 花王株式会社 包装箱
WO2011082179A1 (en) * 2009-12-28 2011-07-07 Global Solar Energy, Inc. Apparatus and methods of mixing and depositing thin film photovoltaic compositions
FR2956412B1 (fr) * 2010-02-16 2012-04-06 Astron Fiamm Safety Vanne d'obturation a volume constant d'une source de depot en phase vapeur
JP5367195B2 (ja) * 2011-03-15 2013-12-11 シャープ株式会社 蒸着装置、蒸着方法、及び有機el表示装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1519391A (zh) * 2002-11-30 2004-08-11 应用菲林股份有限两合公司 蒸镀装置
CN1904129A (zh) * 2005-07-28 2007-01-31 应用薄膜有限公司 蒸发器装置
DE102010046389A1 (de) * 2009-09-25 2011-05-19 Creaphys Gmbh Verdampfereinrichtung für eine Beschichtungsanlage und Beschichtungsanlage

Also Published As

Publication number Publication date
CN103906856A (zh) 2014-07-02
KR20140092816A (ko) 2014-07-24
EP2769001A1 (fr) 2014-08-27
FR2981667B1 (fr) 2014-07-04
KR102108173B1 (ko) 2020-05-08
SG11201401635PA (en) 2014-09-26
WO2013057443A1 (fr) 2013-04-25
IN2014DN03425A (enExample) 2015-06-05
US20140245955A1 (en) 2014-09-04
JP2015501379A (ja) 2015-01-15
JP6170927B2 (ja) 2017-07-26
EP2769001B1 (fr) 2017-12-20
FR2981667A1 (fr) 2013-04-26

Similar Documents

Publication Publication Date Title
CN103906856B (zh) 用于通过真空蒸发沉积薄膜的装置的喷射系统
US11713506B2 (en) Evaporator, deposition arrangement, deposition apparatus and methods of operation thereof
EP3077567B1 (en) Depositing arrangement, deposition apparatus and methods of operation thereof
JP5877245B2 (ja) 気相蒸着方法及び気相蒸着装置
JP5877244B2 (ja) 気相蒸着材料ソース及びその作製方法
JP5766720B2 (ja) 気相蒸着供給源のための加熱システム
KR101959417B1 (ko) 진공 증착을 위한 재료 소스 배열체 및 재료 분배 배열체
CN112074623A (zh) 蒸发源、用于操作蒸发源的方法和沉积系统
KR20120035788A (ko) 유기물 공급장치 및 이를 이용한 유기물 증착장치
KR20060111040A (ko) 대용량도가니를 사용하는 대면적 유기박막 소자의 양산용증발원
KR20170083587A (ko) 진공 증착을 위한 재료 소스 배열체 및 노즐
CN107002232A (zh) 用于蒸发目的的坩锅组件
JP7201573B2 (ja) 蒸発した材料を堆積させるための蒸発源、及び蒸発した材料を堆積させるための方法
TW202035741A (zh) 用以蒸發一材料之蒸發設備及使用蒸發裝置蒸發材料之方法
JP2020063476A (ja) 蒸着装置
KR20150101564A (ko) Oled 증착기 소스
JP2007534842A (ja) 連続熱真空蒸着装置および方法
JP2006063447A (ja) 有機物蒸着装置
JP2023002533A (ja) 堆積源を冷却する方法、堆積源を冷却するためのチャンバ、及び、堆積システム

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant