JP2008274322A - 蒸着装置 - Google Patents
蒸着装置 Download PDFInfo
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- JP2008274322A JP2008274322A JP2007116370A JP2007116370A JP2008274322A JP 2008274322 A JP2008274322 A JP 2008274322A JP 2007116370 A JP2007116370 A JP 2007116370A JP 2007116370 A JP2007116370 A JP 2007116370A JP 2008274322 A JP2008274322 A JP 2008274322A
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- line
- crucible
- type evaporation
- vapor deposition
- evaporation source
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 34
- 238000001704 evaporation Methods 0.000 claims description 122
- 230000008020 evaporation Effects 0.000 claims description 120
- 239000000463 material Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000005192 partition Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 abstract description 16
- 230000008016 vaporization Effects 0.000 abstract 4
- 239000000758 substrate Substances 0.000 description 19
- 238000009434 installation Methods 0.000 description 13
- 238000001816 cooling Methods 0.000 description 10
- 239000012044 organic layer Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 0 *CCC(*)C1CCCC1 Chemical compound *CCC(*)C1CCCC1 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
【解決手段】蒸着装置の構成として、Y方向に並べて設けられた複数のライン型蒸発源3と、複数のライン型蒸発源3を、当該ライン型蒸発源の並び方向Y及び/又は長手方向Xに個別に移動可能に支持する移動支持手段(11〜16)とを備える。
【選択図】図2
Description
Claims (6)
- 所定の方向に並べて設けられた複数のライン型蒸発源と、
前記複数のライン型蒸発源を、当該ライン型蒸発源の並び方向及び/又は長手方向に個別に移動可能に支持する移動支持手段と
を備えることを特徴とする蒸着装置。 - 前記ライン型蒸発源の移動方式が自動式である
ことを特徴とする請求項1記載の蒸着装置。 - 前記ライン型蒸発源は、蒸発材料を収容するルツボと、前記ルツボから蒸発する前記蒸発材料を噴き出すノズルとを含み、前記ルツボと前記ノズルを分離可能に構成してなる
ことを特徴とする請求項1記載の蒸着装置。 - 前記ライン型蒸発源の長手方向の側面に前記ルツボの出し入れ口を設けてなる
ことを特徴とする請求項3記載の蒸着装置。 - 前記ルツボと前記ノズルとの間に隔壁を設けてなる
ことを特徴とする請求項3記載の蒸着装置。 - 前記ライン型蒸発源は、前記ルツボに収容された前記蒸発材料を加熱するための加熱源と、前記ルツボの温度を検出する温度検出手段とを有し、前記ルツボ、前記ノズル、前記加熱源及び前記温度検出手段を含むルツボユニットを、前記ノズルから分離可能に構成してなる
ことを特徴とする請求項3記載の蒸着装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007116370A JP2008274322A (ja) | 2007-04-26 | 2007-04-26 | 蒸着装置 |
TW097110208A TWI447245B (zh) | 2007-04-26 | 2008-03-21 | Evaporation device |
US12/108,674 US20080264342A1 (en) | 2007-04-26 | 2008-04-24 | Deposition apparatus |
KR1020080038671A KR101431043B1 (ko) | 2007-04-26 | 2008-04-25 | 증착 장치 |
CNA2008100948193A CN101294271A (zh) | 2007-04-26 | 2008-04-28 | 沉积设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007116370A JP2008274322A (ja) | 2007-04-26 | 2007-04-26 | 蒸着装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008274322A true JP2008274322A (ja) | 2008-11-13 |
Family
ID=39885494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007116370A Pending JP2008274322A (ja) | 2007-04-26 | 2007-04-26 | 蒸着装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080264342A1 (ja) |
JP (1) | JP2008274322A (ja) |
KR (1) | KR101431043B1 (ja) |
CN (1) | CN101294271A (ja) |
TW (1) | TWI447245B (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010270363A (ja) * | 2009-05-21 | 2010-12-02 | Ulvac Japan Ltd | 真空蒸着装置 |
JP2011052301A (ja) * | 2009-09-04 | 2011-03-17 | Hitachi Zosen Corp | 真空蒸着用蒸着材料の蒸発、昇華方法および真空蒸着用るつぼ装置 |
WO2012124524A1 (ja) * | 2011-03-11 | 2012-09-20 | シャープ株式会社 | 蒸着粒子射出装置および蒸着装置 |
JP2013519787A (ja) * | 2010-02-16 | 2013-05-30 | アストロン フィアム セーフティー | 気相蒸着供給源のための加熱システム |
JP2014075301A (ja) * | 2012-10-05 | 2014-04-24 | Semiconductor Energy Lab Co Ltd | 成膜装置、成膜方法 |
JP2014105375A (ja) * | 2012-11-29 | 2014-06-09 | Optorun Co Ltd | 真空蒸着源及びそれを用いた真空蒸着方法 |
JP2014125681A (ja) * | 2012-12-26 | 2014-07-07 | Au Optronics Corp | 蒸着装置 |
JP2017500445A (ja) * | 2013-12-13 | 2017-01-05 | ソニック システム リミテッド | 蒸発源移送ユニット、蒸着装置及び蒸着方法 |
WO2017086588A1 (ko) * | 2015-11-19 | 2017-05-26 | 주식회사 다원시스 | 유도 가열을 이용한 증착 장치 및 증착 시스템 |
WO2020044521A1 (ja) * | 2018-08-30 | 2020-03-05 | シャープ株式会社 | 蒸着装置及び蒸着装置の蒸着方法 |
Families Citing this family (25)
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CN101565813B (zh) * | 2009-05-18 | 2012-08-08 | 南京华显高科有限公司 | MgO薄膜电子束蒸发制备方法及装置 |
KR101084234B1 (ko) | 2009-11-30 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 증착원, 이를 구비하는 증착 장치 및 박막 형성 방법 |
KR101232910B1 (ko) * | 2010-10-06 | 2013-02-13 | 엘아이지에이디피 주식회사 | 유기물 공급장치, 이를 이용한 유기물 증착장치 및 방법 |
TW201251165A (en) * | 2011-06-07 | 2012-12-16 | Ind Tech Res Inst | Photovoltaic organic light emitting diodes device and manufacturing method thereof |
FR2981667B1 (fr) * | 2011-10-21 | 2014-07-04 | Riber | Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide |
JP2013216955A (ja) * | 2012-04-11 | 2013-10-24 | Hitachi High-Technologies Corp | 真空蒸着装置 |
KR101436900B1 (ko) * | 2012-10-25 | 2014-09-02 | 주식회사 에스에프에이 | Oled 제조용 박막 증착장치 및 그 방법 |
CN102877031A (zh) * | 2012-10-26 | 2013-01-16 | 四川大学 | 一种大面积共蒸发源的阵列设计 |
KR102046563B1 (ko) * | 2012-12-13 | 2019-11-20 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 그것을 이용한 박막 증착 방법 |
KR102155735B1 (ko) * | 2013-07-25 | 2020-09-15 | 삼성디스플레이 주식회사 | 증착장치용 증착원 |
KR20150026011A (ko) * | 2013-08-30 | 2015-03-11 | 삼성디스플레이 주식회사 | 증착원 |
TWI473894B (zh) * | 2013-09-11 | 2015-02-21 | Au Optronics Corp | 蒸鍍設備 |
KR102192500B1 (ko) * | 2013-10-24 | 2020-12-17 | 히다치 조센 가부시키가이샤 | 진공증착장치용 매니폴드 |
FR3020381B1 (fr) * | 2014-04-24 | 2017-09-29 | Riber | Cellule d'evaporation |
US10184168B2 (en) * | 2015-01-20 | 2019-01-22 | Kennametal Inc. | IMC evaporator boat-thermal insulation cartridge assembly |
CN104911548B (zh) | 2015-06-30 | 2017-05-03 | 合肥鑫晟光电科技有限公司 | 一种真空蒸镀装置及蒸镀方法 |
KR102365900B1 (ko) | 2015-07-17 | 2022-02-22 | 삼성디스플레이 주식회사 | 증착 장치 |
KR102480457B1 (ko) * | 2015-07-27 | 2022-12-22 | 삼성디스플레이 주식회사 | 증착 장치 |
CN105088146B (zh) * | 2015-08-25 | 2018-01-12 | 京东方科技集团股份有限公司 | 蒸镀装置 |
CN105112855A (zh) * | 2015-09-29 | 2015-12-02 | 京东方科技集团股份有限公司 | 蒸镀坩埚和蒸镀系统 |
CN105698532B (zh) * | 2016-03-24 | 2017-12-29 | 中国计量科学研究院 | 一种高温固定点装置 |
CN106435483A (zh) * | 2016-12-12 | 2017-02-22 | 福州大学 | 一种高精度oled器件的制备装置及制备方法 |
CN108677147B (zh) * | 2018-06-13 | 2020-04-21 | 京东方科技集团股份有限公司 | 蒸镀装置及蒸镀方法 |
CN109609909B (zh) * | 2019-01-03 | 2021-01-26 | 京东方科技集团股份有限公司 | 蒸镀方法及系统 |
DE102019110950A1 (de) | 2019-04-29 | 2020-10-29 | Kennametal Inc. | Hartmetallzusammensetzungen und deren Anwendungen |
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JP2003147510A (ja) * | 2001-11-15 | 2003-05-21 | Ulvac Japan Ltd | 蒸発源 |
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2007
- 2007-04-26 JP JP2007116370A patent/JP2008274322A/ja active Pending
-
2008
- 2008-03-21 TW TW097110208A patent/TWI447245B/zh not_active IP Right Cessation
- 2008-04-24 US US12/108,674 patent/US20080264342A1/en not_active Abandoned
- 2008-04-25 KR KR1020080038671A patent/KR101431043B1/ko not_active IP Right Cessation
- 2008-04-28 CN CNA2008100948193A patent/CN101294271A/zh active Pending
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JP2003257644A (ja) * | 2002-03-05 | 2003-09-12 | Sanyo Electric Co Ltd | 有機エレクトロルミネッセンス表示装置の製造方法 |
JP2004111305A (ja) * | 2002-09-20 | 2004-04-08 | Ulvac Japan Ltd | 有機薄膜形成方法 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010270363A (ja) * | 2009-05-21 | 2010-12-02 | Ulvac Japan Ltd | 真空蒸着装置 |
JP2011052301A (ja) * | 2009-09-04 | 2011-03-17 | Hitachi Zosen Corp | 真空蒸着用蒸着材料の蒸発、昇華方法および真空蒸着用るつぼ装置 |
JP2013519787A (ja) * | 2010-02-16 | 2013-05-30 | アストロン フィアム セーフティー | 気相蒸着供給源のための加熱システム |
WO2012124524A1 (ja) * | 2011-03-11 | 2012-09-20 | シャープ株式会社 | 蒸着粒子射出装置および蒸着装置 |
JP2014075301A (ja) * | 2012-10-05 | 2014-04-24 | Semiconductor Energy Lab Co Ltd | 成膜装置、成膜方法 |
JP2014105375A (ja) * | 2012-11-29 | 2014-06-09 | Optorun Co Ltd | 真空蒸着源及びそれを用いた真空蒸着方法 |
JP2014125681A (ja) * | 2012-12-26 | 2014-07-07 | Au Optronics Corp | 蒸着装置 |
JP2017500445A (ja) * | 2013-12-13 | 2017-01-05 | ソニック システム リミテッド | 蒸発源移送ユニット、蒸着装置及び蒸着方法 |
WO2017086588A1 (ko) * | 2015-11-19 | 2017-05-26 | 주식회사 다원시스 | 유도 가열을 이용한 증착 장치 및 증착 시스템 |
WO2020044521A1 (ja) * | 2018-08-30 | 2020-03-05 | シャープ株式会社 | 蒸着装置及び蒸着装置の蒸着方法 |
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CN101294271A (zh) | 2008-10-29 |
TW200914635A (en) | 2009-04-01 |
TWI447245B (zh) | 2014-08-01 |
KR20080096451A (ko) | 2008-10-30 |
US20080264342A1 (en) | 2008-10-30 |
KR101431043B1 (ko) | 2014-08-20 |
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