SG11201401635PA - Injection system for an apparatus for depositing thin layers by vacuum evaporation - Google Patents

Injection system for an apparatus for depositing thin layers by vacuum evaporation

Info

Publication number
SG11201401635PA
SG11201401635PA SG11201401635PA SG11201401635PA SG11201401635PA SG 11201401635P A SG11201401635P A SG 11201401635PA SG 11201401635P A SG11201401635P A SG 11201401635PA SG 11201401635P A SG11201401635P A SG 11201401635PA SG 11201401635P A SG11201401635P A SG 11201401635PA
Authority
SG
Singapore
Prior art keywords
injection system
vacuum evaporation
thin layers
depositing thin
depositing
Prior art date
Application number
SG11201401635PA
Other languages
English (en)
Inventor
Jean-Louis Guyaux
Jérôme Villette
Nicolas Briant
David Esteve
Original Assignee
Riber
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riber filed Critical Riber
Publication of SG11201401635PA publication Critical patent/SG11201401635PA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225Oblique incidence of vaporised material on substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228Gas flow assisted PVD deposition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/246Replenishment of source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
SG11201401635PA 2011-10-21 2012-10-18 Injection system for an apparatus for depositing thin layers by vacuum evaporation SG11201401635PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1159560A FR2981667B1 (fr) 2011-10-21 2011-10-21 Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide
PCT/FR2012/052388 WO2013057443A1 (fr) 2011-10-21 2012-10-18 Systeme d'injection pour dispositif de depot de couches minces par evaporation sous vide

Publications (1)

Publication Number Publication Date
SG11201401635PA true SG11201401635PA (en) 2014-09-26

Family

ID=47221468

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201401635PA SG11201401635PA (en) 2011-10-21 2012-10-18 Injection system for an apparatus for depositing thin layers by vacuum evaporation

Country Status (9)

Country Link
US (1) US20140245955A1 (enExample)
EP (1) EP2769001B1 (enExample)
JP (1) JP6170927B2 (enExample)
KR (1) KR102108173B1 (enExample)
CN (1) CN103906856B (enExample)
FR (1) FR2981667B1 (enExample)
IN (1) IN2014DN03425A (enExample)
SG (1) SG11201401635PA (enExample)
WO (1) WO2013057443A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016070941A1 (en) * 2014-11-07 2016-05-12 Applied Materials, Inc. Material source arrangment and nozzle for vacuum deposition
KR102082192B1 (ko) * 2014-11-07 2020-02-27 어플라이드 머티어리얼스, 인코포레이티드 증발된 재료를 증착하기 위한 장치, 분배 파이프, 진공 증착 챔버, 및 증발된 재료를 증착하기 위한 방법
CN107078215B (zh) * 2014-11-07 2020-09-22 应用材料公司 用于真空沉积的材料源配置与材料分布配置
EP3245313B1 (en) * 2015-07-13 2018-12-05 Applied Materials, Inc. Evaporation source.
CN105088145B (zh) * 2015-08-19 2017-03-29 京东方科技集团股份有限公司 用于oled蒸发源的坩埚及其制造方法
CN205443432U (zh) * 2016-04-07 2016-08-10 鄂尔多斯市源盛光电有限责任公司 一种线性蒸发源、蒸发源系统及蒸镀装置
JP6823954B2 (ja) * 2016-07-08 2021-02-03 株式会社ジャパンディスプレイ 成膜装置および成膜方法
CN106868456B (zh) * 2017-03-21 2019-03-12 京东方科技集团股份有限公司 蒸发源和蒸镀设备
JP6543664B2 (ja) * 2017-09-11 2019-07-10 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 真空堆積チャンバ
CN109943806A (zh) * 2017-12-20 2019-06-28 合肥欣奕华智能机器有限公司 一种线性蒸发源装置及蒸镀装置
CN109817842B (zh) * 2019-01-16 2021-10-01 京东方科技集团股份有限公司 一种真空干燥装置、显示用基板的制备方法
JP2022107982A (ja) * 2021-01-12 2022-07-25 キヤノントッキ株式会社 蒸発源装置、成膜装置、成膜方法及び電子デバイスの製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2688500A (en) * 1952-01-02 1954-09-07 Laval Separator Co De Coupling for pipes
US3661117A (en) * 1969-12-03 1972-05-09 Stanford Research Inst Apparatus for depositing thin lines
US4016310A (en) * 1975-04-23 1977-04-05 Xerox Corporation Coater hardware and method for obtaining uniform photoconductive layers on a xerographic photoreceptor
US4756465A (en) * 1985-04-15 1988-07-12 Latviisky Gosudarstvenny Institut Method of cold welding
DE3636891A1 (de) * 1986-10-30 1988-05-11 Armin Dommer Verfahren und vorrichtung zum stumpfschweissen von kunststoff-rohrabschnitten oder kunststoff-formstuecken
US5186120A (en) * 1989-03-22 1993-02-16 Mitsubishi Denki Kabushiki Kaisha Mixture thin film forming apparatus
JP3139179B2 (ja) * 1992-10-12 2001-02-26 オイレス工業株式会社 球帯状シール体
US5458725A (en) * 1993-08-17 1995-10-17 Motorola, Inc. Gas distribution system
FR2800754B1 (fr) * 1999-11-08 2003-05-09 Joint Industrial Processors For Electronics Dispositif evaporateur d'une installation de depot chimique en phase vapeur
US20060127599A1 (en) * 2002-02-12 2006-06-15 Wojak Gregory J Process and apparatus for preparing a diamond substance
DE10256038A1 (de) * 2002-11-30 2004-06-17 Applied Films Gmbh & Co. Kg Bedampfungsvorrichtung
JP4015064B2 (ja) * 2003-05-28 2007-11-28 トッキ株式会社 蒸着装置
KR100659762B1 (ko) * 2005-01-17 2006-12-19 삼성에스디아이 주식회사 증발원, 증착장치 및 이를 이용한 증착방법
KR101153161B1 (ko) * 2005-04-01 2012-06-18 주성엔지니어링(주) 가스분사장치 및 이를 포함하는 액정표시소자의 제조장치
EP1752555A1 (de) * 2005-07-28 2007-02-14 Applied Materials GmbH & Co. KG Verdampfervorrichtung
JP5213341B2 (ja) * 2007-03-20 2013-06-19 東京エレクトロン株式会社 気化器,気化モジュール,成膜装置
JP2008274322A (ja) * 2007-04-26 2008-11-13 Sony Corp 蒸着装置
JP5043776B2 (ja) * 2008-08-08 2012-10-10 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US8512806B2 (en) * 2008-08-12 2013-08-20 Momentive Performance Materials Inc. Large volume evaporation source
US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
JP4831841B2 (ja) * 2009-07-10 2011-12-07 三菱重工業株式会社 真空蒸着装置及び方法
KR100977374B1 (ko) * 2009-08-03 2010-08-20 텔리오솔라 테크놀로지스 인크 대면적 박막형 cigs 태양전지 고속증착 및 양산장비, 그 공정방법
JP5642952B2 (ja) * 2009-09-07 2014-12-17 花王株式会社 包装箱
DE102010046389A1 (de) * 2009-09-25 2011-05-19 Creaphys Gmbh Verdampfereinrichtung für eine Beschichtungsanlage und Beschichtungsanlage
WO2011082179A1 (en) * 2009-12-28 2011-07-07 Global Solar Energy, Inc. Apparatus and methods of mixing and depositing thin film photovoltaic compositions
FR2956412B1 (fr) * 2010-02-16 2012-04-06 Astron Fiamm Safety Vanne d'obturation a volume constant d'une source de depot en phase vapeur
JP5367195B2 (ja) * 2011-03-15 2013-12-11 シャープ株式会社 蒸着装置、蒸着方法、及び有機el表示装置の製造方法

Also Published As

Publication number Publication date
CN103906856A (zh) 2014-07-02
KR20140092816A (ko) 2014-07-24
CN103906856B (zh) 2016-11-09
EP2769001A1 (fr) 2014-08-27
FR2981667B1 (fr) 2014-07-04
KR102108173B1 (ko) 2020-05-08
WO2013057443A1 (fr) 2013-04-25
IN2014DN03425A (enExample) 2015-06-05
US20140245955A1 (en) 2014-09-04
JP2015501379A (ja) 2015-01-15
JP6170927B2 (ja) 2017-07-26
EP2769001B1 (fr) 2017-12-20
FR2981667A1 (fr) 2013-04-26

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