CN103730332B - 剥离干燥装置及方法 - Google Patents

剥离干燥装置及方法 Download PDF

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Publication number
CN103730332B
CN103730332B CN201310473237.7A CN201310473237A CN103730332B CN 103730332 B CN103730332 B CN 103730332B CN 201310473237 A CN201310473237 A CN 201310473237A CN 103730332 B CN103730332 B CN 103730332B
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CN
China
Prior art keywords
substrate
chuck
chemicals
dry
temperature
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201310473237.7A
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English (en)
Chinese (zh)
Other versions
CN103730332A (zh
Inventor
史蒂芬·M·萨拉德
戴恩·海姆斯
艾伦·M·斯科普
拉莎娜·莉玛丽
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Lam Research Corp
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Lam Research Corp
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201310473237.7A 2012-10-11 2013-10-11 剥离干燥装置及方法 Expired - Fee Related CN103730332B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/650,044 2012-10-11
US13/650,044 US8898928B2 (en) 2012-10-11 2012-10-11 Delamination drying apparatus and method

Publications (2)

Publication Number Publication Date
CN103730332A CN103730332A (zh) 2014-04-16
CN103730332B true CN103730332B (zh) 2017-05-10

Family

ID=50454356

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310473237.7A Expired - Fee Related CN103730332B (zh) 2012-10-11 2013-10-11 剥离干燥装置及方法

Country Status (6)

Country Link
US (1) US8898928B2 (https=)
JP (1) JP6321937B2 (https=)
KR (1) KR20140047009A (https=)
CN (1) CN103730332B (https=)
SG (1) SG2013075718A (https=)
TW (1) TWI602234B (https=)

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JP6849368B2 (ja) * 2016-09-30 2021-03-24 芝浦メカトロニクス株式会社 基板処理装置
JP6951229B2 (ja) * 2017-01-05 2021-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
CN116646279A (zh) 2017-01-05 2023-08-25 株式会社斯库林集团 基板清洗装置及基板清洗方法
JP6966899B2 (ja) * 2017-08-31 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
JP6954793B2 (ja) * 2017-09-25 2021-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理液及び基板処理装置
JP7018792B2 (ja) * 2018-03-22 2022-02-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
JP7037402B2 (ja) * 2018-03-26 2022-03-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7013309B2 (ja) * 2018-04-10 2022-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102728304B1 (ko) * 2018-11-14 2024-11-11 삼성전자주식회사 기판 건조 방법, 포토레지스트 현상 방법, 그들을 포함하는 포토리소그래피 방법, 및 기판 건조 장치
KR102775038B1 (ko) * 2019-03-28 2025-03-05 삼성디스플레이 주식회사 감압 건조 장치
EP3832391A1 (en) * 2019-12-03 2021-06-09 ASML Netherlands B.V. Clamp assembly
KR20220037632A (ko) * 2020-09-18 2022-03-25 세메스 주식회사 기판 처리 장치 및 방법
KR102622985B1 (ko) * 2020-12-31 2024-01-11 세메스 주식회사 기판 처리 장치
US20220403509A1 (en) * 2021-06-17 2022-12-22 Tokyo Electron Limited Vacuum processing apparatus and oxidizing gas removal method
CN115355668A (zh) * 2022-06-24 2022-11-18 嘉兴智正医药科技有限公司 一种微针制备用冷冻干燥机
CN115611232A (zh) * 2022-12-15 2023-01-17 清华大学 纳米悬臂梁及其制备工艺
CN117433254B (zh) * 2023-12-21 2024-02-23 山西普恒制药有限公司 一种冻干粉生产装置

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CN102148133A (zh) * 2010-12-06 2011-08-10 北京七星华创电子股份有限公司 单晶圆干燥装置及方法

Also Published As

Publication number Publication date
US20140101964A1 (en) 2014-04-17
KR20140047009A (ko) 2014-04-21
TW201430938A (zh) 2014-08-01
SG2013075718A (en) 2014-05-29
JP6321937B2 (ja) 2018-05-09
JP2014090167A (ja) 2014-05-15
TWI602234B (zh) 2017-10-11
CN103730332A (zh) 2014-04-16
US8898928B2 (en) 2014-12-02

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Granted publication date: 20170510