CN103240817A - 树脂密封装置及树脂密封方法 - Google Patents

树脂密封装置及树脂密封方法 Download PDF

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Publication number
CN103240817A
CN103240817A CN2013100512645A CN201310051264A CN103240817A CN 103240817 A CN103240817 A CN 103240817A CN 2013100512645 A CN2013100512645 A CN 2013100512645A CN 201310051264 A CN201310051264 A CN 201310051264A CN 103240817 A CN103240817 A CN 103240817A
Authority
CN
China
Prior art keywords
mould
resin
adsorption section
patrix
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013100512645A
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English (en)
Chinese (zh)
Inventor
后藤等
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Publication of CN103240817A publication Critical patent/CN103240817A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CN2013100512645A 2012-02-14 2013-02-16 树脂密封装置及树脂密封方法 Pending CN103240817A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012029989A JP5877083B2 (ja) 2012-02-14 2012-02-14 樹脂封止装置及び樹脂封止方法
JP2012-029989 2012-02-14

Publications (1)

Publication Number Publication Date
CN103240817A true CN103240817A (zh) 2013-08-14

Family

ID=48920852

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013100512645A Pending CN103240817A (zh) 2012-02-14 2013-02-16 树脂密封装置及树脂密封方法

Country Status (4)

Country Link
JP (1) JP5877083B2 (ja)
KR (1) KR101417577B1 (ja)
CN (1) CN103240817A (ja)
TW (1) TW201332737A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104708752A (zh) * 2013-11-28 2015-06-17 东和株式会社 压缩成形装置的树脂材料供给方法及供给装置
CN106426710A (zh) * 2015-08-11 2017-02-22 东和株式会社 树脂成型装置及树脂成型方法以及成型模
CN107685412A (zh) * 2016-08-03 2018-02-13 东和株式会社 成型模、树脂成型装置及树脂成型品的制造方法
CN108688050A (zh) * 2017-03-29 2018-10-23 东和株式会社 成型模、树脂成型装置、树脂成型方法及树脂成型品的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110341109A (zh) * 2019-07-10 2019-10-18 安徽宏飞钓具有限公司 一种仿生鱼饵生产用可精确定位的模具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015667A (ja) * 1998-06-30 2000-01-18 Nissha Printing Co Ltd 射出成形用金型と絵柄付成形品の製造方法
CN1941308A (zh) * 2005-09-27 2007-04-04 东和株式会社 电子元件的树脂密封成形方法及装置
JP2007230138A (ja) * 2006-03-02 2007-09-13 Apic Yamada Corp 樹脂モールド装置および樹脂モールド方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69501632T2 (de) 1994-11-21 1998-07-23 Apic Yamada Corp Harzformmaschine mit Trennfolie
JP4230679B2 (ja) * 2000-06-26 2009-02-25 株式会社東芝 半導体樹脂モールド装置および半導体樹脂モールド方法
JP5247668B2 (ja) * 2009-12-09 2013-07-24 ルネサスエレクトロニクス株式会社 半導体パッケージ製造装置及び半導体パッケージの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015667A (ja) * 1998-06-30 2000-01-18 Nissha Printing Co Ltd 射出成形用金型と絵柄付成形品の製造方法
CN1941308A (zh) * 2005-09-27 2007-04-04 东和株式会社 电子元件的树脂密封成形方法及装置
JP2007230138A (ja) * 2006-03-02 2007-09-13 Apic Yamada Corp 樹脂モールド装置および樹脂モールド方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104708752A (zh) * 2013-11-28 2015-06-17 东和株式会社 压缩成形装置的树脂材料供给方法及供给装置
CN104708752B (zh) * 2013-11-28 2017-06-06 东和株式会社 压缩成形装置的树脂材料供给方法及供给装置
CN106426710A (zh) * 2015-08-11 2017-02-22 东和株式会社 树脂成型装置及树脂成型方法以及成型模
CN106426710B (zh) * 2015-08-11 2019-02-19 东和株式会社 树脂成型装置及树脂成型方法以及成型模
CN107685412A (zh) * 2016-08-03 2018-02-13 东和株式会社 成型模、树脂成型装置及树脂成型品的制造方法
CN107685412B (zh) * 2016-08-03 2020-03-06 东和株式会社 成型模、树脂成型装置及树脂成型品的制造方法
CN108688050A (zh) * 2017-03-29 2018-10-23 东和株式会社 成型模、树脂成型装置、树脂成型方法及树脂成型品的制造方法
CN108688050B (zh) * 2017-03-29 2020-12-11 东和株式会社 成型模、树脂成型装置、树脂成型方法及树脂成型品的制造方法

Also Published As

Publication number Publication date
KR101417577B1 (ko) 2014-07-08
KR20130093532A (ko) 2013-08-22
TW201332737A (zh) 2013-08-16
JP2013166272A (ja) 2013-08-29
JP5877083B2 (ja) 2016-03-02

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Application publication date: 20130814