KR101417577B1 - 수지밀봉장치 및 수지밀봉방법 - Google Patents

수지밀봉장치 및 수지밀봉방법 Download PDF

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Publication number
KR101417577B1
KR101417577B1 KR1020130000884A KR20130000884A KR101417577B1 KR 101417577 B1 KR101417577 B1 KR 101417577B1 KR 1020130000884 A KR1020130000884 A KR 1020130000884A KR 20130000884 A KR20130000884 A KR 20130000884A KR 101417577 B1 KR101417577 B1 KR 101417577B1
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KR
South Korea
Prior art keywords
mold
resin
sealing
region
metal mold
Prior art date
Application number
KR1020130000884A
Other languages
English (en)
Korean (ko)
Other versions
KR20130093532A (ko
Inventor
히토시 고토
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20130093532A publication Critical patent/KR20130093532A/ko
Application granted granted Critical
Publication of KR101417577B1 publication Critical patent/KR101417577B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould

Landscapes

  • Engineering & Computer Science (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
KR1020130000884A 2012-02-14 2013-01-04 수지밀봉장치 및 수지밀봉방법 KR101417577B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-029989 2012-02-14
JP2012029989A JP5877083B2 (ja) 2012-02-14 2012-02-14 樹脂封止装置及び樹脂封止方法

Publications (2)

Publication Number Publication Date
KR20130093532A KR20130093532A (ko) 2013-08-22
KR101417577B1 true KR101417577B1 (ko) 2014-07-08

Family

ID=48920852

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130000884A KR101417577B1 (ko) 2012-02-14 2013-01-04 수지밀봉장치 및 수지밀봉방법

Country Status (4)

Country Link
JP (1) JP5877083B2 (ja)
KR (1) KR101417577B1 (ja)
CN (1) CN103240817A (ja)
TW (1) TW201332737A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6057880B2 (ja) * 2013-11-28 2017-01-11 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給装置
JP6430342B2 (ja) * 2015-08-11 2018-11-28 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法並びに成形型
JP6827283B2 (ja) * 2016-08-03 2021-02-10 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP6723185B2 (ja) * 2017-03-29 2020-07-15 Ｔｏｗａ株式会社 成形型、樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法
CN110341109A (zh) * 2019-07-10 2019-10-18 安徽宏飞钓具有限公司 一种仿生鱼饵生产用可精确定位的模具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100193592B1 (ko) 1994-11-21 1999-06-15 나까자와 모또요시 릴리스필름을 이용한 수지몰드장치와 수지몰드방법 및 거기에 이용되는 릴리스필름

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015667A (ja) * 1998-06-30 2000-01-18 Nissha Printing Co Ltd 射出成形用金型と絵柄付成形品の製造方法
JP4230679B2 (ja) * 2000-06-26 2009-02-25 株式会社東芝 半導体樹脂モールド装置および半導体樹脂モールド方法
JP4084844B2 (ja) * 2005-09-27 2008-04-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP4764745B2 (ja) * 2006-03-02 2011-09-07 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP5247668B2 (ja) * 2009-12-09 2013-07-24 ルネサスエレクトロニクス株式会社 半導体パッケージ製造装置及び半導体パッケージの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100193592B1 (ko) 1994-11-21 1999-06-15 나까자와 모또요시 릴리스필름을 이용한 수지몰드장치와 수지몰드방법 및 거기에 이용되는 릴리스필름

Also Published As

Publication number Publication date
KR20130093532A (ko) 2013-08-22
CN103240817A (zh) 2013-08-14
JP2013166272A (ja) 2013-08-29
JP5877083B2 (ja) 2016-03-02
TW201332737A (zh) 2013-08-16

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