CN103137640B - 固态成像设备、照相机和固态成像设备的设计方法 - Google Patents
固态成像设备、照相机和固态成像设备的设计方法 Download PDFInfo
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- CN103137640B CN103137640B CN201210505763.2A CN201210505763A CN103137640B CN 103137640 B CN103137640 B CN 103137640B CN 201210505763 A CN201210505763 A CN 201210505763A CN 103137640 B CN103137640 B CN 103137640B
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- semiconductor substrate
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- imaging device
- state imaging
- pixel array
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/153—Two-dimensional or three-dimensional array CCD image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-266274 | 2011-12-05 | ||
| JP2011266274A JP6018376B2 (ja) | 2011-12-05 | 2011-12-05 | 固体撮像装置およびカメラ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610195655.8A Division CN105762162A (zh) | 2011-12-05 | 2012-11-30 | 固态成像设备、照相机和固态成像设备的设计方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103137640A CN103137640A (zh) | 2013-06-05 |
| CN103137640B true CN103137640B (zh) | 2016-04-20 |
Family
ID=48497236
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210505763.2A Active CN103137640B (zh) | 2011-12-05 | 2012-11-30 | 固态成像设备、照相机和固态成像设备的设计方法 |
| CN201610195655.8A Pending CN105762162A (zh) | 2011-12-05 | 2012-11-30 | 固态成像设备、照相机和固态成像设备的设计方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610195655.8A Pending CN105762162A (zh) | 2011-12-05 | 2012-11-30 | 固态成像设备、照相机和固态成像设备的设计方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9026972B2 (enExample) |
| JP (1) | JP6018376B2 (enExample) |
| CN (2) | CN103137640B (enExample) |
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| JP2651874B2 (ja) | 1989-12-28 | 1997-09-10 | 長谷川香料株式会社 | 果肉入りゼラチンゼリーの製法 |
| US9406711B2 (en) * | 2012-06-15 | 2016-08-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for backside illuminated image sensors |
| WO2014002367A1 (ja) * | 2012-06-25 | 2014-01-03 | パナソニック株式会社 | 固体撮像装置 |
| JP6162999B2 (ja) | 2013-04-15 | 2017-07-12 | キヤノン株式会社 | 固体撮像装置およびカメラ |
| JP2014225536A (ja) | 2013-05-15 | 2014-12-04 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| JP6094511B2 (ja) * | 2014-02-25 | 2017-03-15 | ソニー株式会社 | 撮像素子および撮像装置 |
| JP6144425B2 (ja) * | 2014-07-15 | 2017-06-07 | ブリルニクス インク | 固体撮像装置、固体撮像装置の製造方法、および電子機器 |
| JP6541361B2 (ja) | 2015-02-05 | 2019-07-10 | キヤノン株式会社 | 固体撮像装置 |
| FR3033220B1 (fr) * | 2015-02-27 | 2017-03-10 | Commissariat Energie Atomique | Recepteur d'horloge de liaison optique |
| JP6491519B2 (ja) * | 2015-04-02 | 2019-03-27 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| WO2017057397A1 (ja) * | 2015-09-30 | 2017-04-06 | 株式会社ニコン | 撮像素子および電子カメラ |
| JP6752585B2 (ja) * | 2016-02-19 | 2020-09-09 | キヤノン株式会社 | 撮像装置、撮像システム |
| JP6738200B2 (ja) | 2016-05-26 | 2020-08-12 | キヤノン株式会社 | 撮像装置 |
| CN116525632A (zh) | 2016-10-18 | 2023-08-01 | 索尼半导体解决方案公司 | 光检测设备 |
| JP7058479B2 (ja) * | 2016-10-18 | 2022-04-22 | ソニーセミコンダクタソリューションズ株式会社 | 光検出器 |
| US10431614B2 (en) | 2017-02-01 | 2019-10-01 | Semiconductor Components Industries, Llc | Edge seals for semiconductor packages |
| WO2019087471A1 (ja) * | 2017-10-30 | 2019-05-09 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子 |
| JP7353729B2 (ja) | 2018-02-09 | 2023-10-02 | キヤノン株式会社 | 半導体装置、半導体装置の製造方法 |
| JP7527755B2 (ja) * | 2018-02-09 | 2024-08-05 | キヤノン株式会社 | 光電変換装置および撮像システム |
| US11463644B2 (en) | 2018-08-31 | 2022-10-04 | Canon Kabushiki Kaisha | Imaging device, imaging system, and drive method of imaging device |
| JP7452962B2 (ja) | 2018-11-16 | 2024-03-19 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| KR102742350B1 (ko) | 2018-11-21 | 2024-12-16 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 고체 촬상 소자 |
| JP6775206B2 (ja) * | 2019-02-27 | 2020-10-28 | パナソニックIpマネジメント株式会社 | 撮像装置 |
| JP6957559B2 (ja) | 2019-06-24 | 2021-11-02 | キヤノン株式会社 | 半導体装置および機器 |
| WO2020262131A1 (ja) * | 2019-06-26 | 2020-12-30 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| JP7551304B2 (ja) * | 2020-03-05 | 2024-09-17 | キヤノン株式会社 | 半導体装置及び機器 |
| US11233088B2 (en) * | 2020-06-12 | 2022-01-25 | Omnivision Technologies, Inc. | Metal routing in image sensor using hybrid bonding |
| KR102887278B1 (ko) | 2020-12-17 | 2025-11-17 | 삼성전자주식회사 | 이미지 센서 |
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| US20080224146A1 (en) * | 2004-03-30 | 2008-09-18 | Canon Kabushiki Kaisha | Semiconductor Apparatus, Solid State Image Pickup Device Using the Same, and Method of Manufacturing Them |
| JP2009170448A (ja) * | 2008-01-10 | 2009-07-30 | Nikon Corp | 固体撮像素子 |
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| JP2001332714A (ja) * | 2000-05-22 | 2001-11-30 | Canon Inc | 固体撮像装置 |
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-
2011
- 2011-12-05 JP JP2011266274A patent/JP6018376B2/ja active Active
-
2012
- 2012-11-02 US US13/667,880 patent/US9026972B2/en active Active
- 2012-11-30 CN CN201210505763.2A patent/CN103137640B/zh active Active
- 2012-11-30 CN CN201610195655.8A patent/CN105762162A/zh active Pending
-
2015
- 2015-03-19 US US14/662,582 patent/US9257472B2/en active Active
Patent Citations (3)
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| US20040263657A1 (en) * | 2003-06-27 | 2004-12-30 | Fuji Photo Film Co., Ltd. | Solid state image pickup device |
| US20080224146A1 (en) * | 2004-03-30 | 2008-09-18 | Canon Kabushiki Kaisha | Semiconductor Apparatus, Solid State Image Pickup Device Using the Same, and Method of Manufacturing Them |
| JP2009170448A (ja) * | 2008-01-10 | 2009-07-30 | Nikon Corp | 固体撮像素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150194457A1 (en) | 2015-07-09 |
| JP6018376B2 (ja) | 2016-11-02 |
| JP2013118345A (ja) | 2013-06-13 |
| CN105762162A (zh) | 2016-07-13 |
| CN103137640A (zh) | 2013-06-05 |
| US9026972B2 (en) | 2015-05-05 |
| US20130141617A1 (en) | 2013-06-06 |
| US9257472B2 (en) | 2016-02-09 |
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