CN103108537B - 电子部件安装装置以及电子部件安装方法 - Google Patents

电子部件安装装置以及电子部件安装方法 Download PDF

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Publication number
CN103108537B
CN103108537B CN201210378101.3A CN201210378101A CN103108537B CN 103108537 B CN103108537 B CN 103108537B CN 201210378101 A CN201210378101 A CN 201210378101A CN 103108537 B CN103108537 B CN 103108537B
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CN
China
Prior art keywords
unit
electronic
electronic unit
substrate
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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CN201210378101.3A
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English (en)
Chinese (zh)
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CN103108537A (zh
Inventor
藤本和弥
佐藤佳孝
池部仁
高桥正人
齐藤乐
儿玉裕介
高桥大志
佐藤德朋
小林仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012025614A external-priority patent/JP2013093536A/ja
Application filed by Juki Corp filed Critical Juki Corp
Publication of CN103108537A publication Critical patent/CN103108537A/zh
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/029—Feeding axial lead components, e.g. using vibrating bowls, magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201210378101.3A 2011-10-07 2012-10-08 电子部件安装装置以及电子部件安装方法 Active CN103108537B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011223346 2011-10-07
JP2011-223346 2011-10-07
JP2012025614A JP2013093536A (ja) 2011-10-07 2012-02-08 電子部品実装装置及び電子部品実装方法
JP2012-025614 2012-02-08

Publications (2)

Publication Number Publication Date
CN103108537A CN103108537A (zh) 2013-05-15
CN103108537B true CN103108537B (zh) 2017-03-15

Family

ID=48316000

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210378101.3A Active CN103108537B (zh) 2011-10-07 2012-10-08 电子部件安装装置以及电子部件安装方法

Country Status (2)

Country Link
KR (1) KR102028743B1 (ko)
CN (1) CN103108537B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6251503B2 (ja) * 2013-07-05 2017-12-20 Juki株式会社 部品交換台車、電子部品実装装置及び電子部品供給装置
CN106134308B (zh) * 2014-03-28 2019-10-11 株式会社富士 切断敲弯装置及对基板作业机
JP6486617B2 (ja) * 2014-06-19 2019-03-20 Juki株式会社 電子部品実装装置、及び電子部品実装方法
JP6479497B2 (ja) * 2015-02-16 2019-03-06 Juki株式会社 電子部品実装装置及び電子部品実装方法
CN110602939B (zh) * 2015-03-26 2020-10-27 株式会社富士 元件安装线的最优化装置及元件安装线的最优化方法
WO2017138113A1 (ja) * 2016-02-10 2017-08-17 ヤマハ発動機株式会社 表面実装機、認識誤差補正方法
JP2018067658A (ja) * 2016-10-20 2018-04-26 Juki株式会社 実装装置及び実装方法
JP6804741B2 (ja) * 2017-03-23 2020-12-23 株式会社Ｆｕｊｉ 実装装置及び実装方法
CN107202796B (zh) * 2017-07-11 2023-07-07 深圳宜美智科技股份有限公司 Pcb板自动检测机
JP6916883B2 (ja) * 2017-08-04 2021-08-11 株式会社Ｆｕｊｉ テープフィーダ
CN110091591B (zh) * 2018-04-18 2020-07-10 广东聚华印刷显示技术有限公司 玻璃夹具的偏移校正方法、装置和系统
JP7093255B2 (ja) * 2018-07-09 2022-06-29 Juki株式会社 実装装置及び実装方法
JP7285162B2 (ja) * 2019-08-05 2023-06-01 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN113587808B (zh) * 2021-06-22 2022-04-12 荣耀终端有限公司 一种电子设备及检测系统
WO2023277339A1 (ko) * 2021-07-02 2023-01-05 리얼룩앤컴퍼니 주식회사 감지표식을 이용한 장비 조립 편차 보정 및 공정 오차 보정 장치 및, 이를 이용한 조립 편차 보정 및 공정 수행 오차 보정 방법
CN113251931B (zh) * 2021-07-07 2021-09-21 苏州维嘉科技股份有限公司 加工设备的零部件位置检测方法及零部件位置检测装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164699A (ja) * 2000-11-28 2002-06-07 Juki Corp 電子部品搭載装置
US6647138B1 (en) * 1999-04-02 2003-11-11 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method and mounting apparatus
CN101547590A (zh) * 2008-03-28 2009-09-30 松下电器产业株式会社 贴装设备及贴装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02233000A (ja) * 1989-03-07 1990-09-14 Mitsubishi Electric Corp 電子部品挿入機
JPH05335782A (ja) 1992-05-27 1993-12-17 Sony Corp 電子部品実装機
JP3402675B2 (ja) 1993-08-04 2003-05-06 ロート製薬株式会社 コンタクトレンズ用溶剤
JPH0791914A (ja) 1993-10-12 1995-04-07 Yamatake Honeywell Co Ltd 回路基板の原点検出方法及び装置
JPH0983121A (ja) 1995-09-13 1997-03-28 Yamagata Casio Co Ltd 電子部品搭載方法及び装置並びに基板
JPH11154799A (ja) * 1997-11-21 1999-06-08 Matsushita Electric Ind Co Ltd 電子部品の実装装置および実装方法
JP2007220837A (ja) * 2006-02-16 2007-08-30 Juki Corp 電子部品実装方法及び装置
JP5304370B2 (ja) * 2009-03-24 2013-10-02 シンフォニアテクノロジー株式会社 Ｉｃチップ供給装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6647138B1 (en) * 1999-04-02 2003-11-11 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method and mounting apparatus
JP2002164699A (ja) * 2000-11-28 2002-06-07 Juki Corp 電子部品搭載装置
CN101547590A (zh) * 2008-03-28 2009-09-30 松下电器产业株式会社 贴装设备及贴装方法

Also Published As

Publication number Publication date
KR102028743B1 (ko) 2019-10-04
KR20130038176A (ko) 2013-04-17
CN103108537A (zh) 2013-05-15

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