CN102881613A - 芯片接合机 - Google Patents

芯片接合机 Download PDF

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CN102881613A
CN102881613A CN2011102645996A CN201110264599A CN102881613A CN 102881613 A CN102881613 A CN 102881613A CN 2011102645996 A CN2011102645996 A CN 2011102645996A CN 201110264599 A CN201110264599 A CN 201110264599A CN 102881613 A CN102881613 A CN 102881613A
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CN102881613B (zh
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莳田美明
深泽信吾
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Jie Jin Science and Technology Ltd.
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Hitachi High Tech Instruments Co Ltd
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Abstract

本发明提供避免用于拍摄粘接剂涂敷的识别用摄像机的移动动作，且具有高生产率高可靠性的芯片接合机。本发明的芯片接合机具备：引线框；位于该引线框的上方且在内部装入有膏状粘接剂的注射器；固定在该注射器的侧方的识别用摄像机；设置在该识别用摄像机的附近的照明；以及设置在面对该照明的位置上的反射板，上述反射板将来自上述照明的光线照射到上述引线框的膏状粘接剂的涂敷面。此外，上述识别用摄像机、上述照明、以及反射板以位于沿X方向输送的引线框的上方的上述注射器为边界，在-Y侧配置反射板，在+Y侧配置识别用摄像机与照明，同时将上述反射板的反射面做成消光的白色涂层。

Description

芯片接合机
技术领域
本发明涉及芯片接合机。
背景技术
芯片接合机是以焊锡、镀金、树脂作为接合材料，将裸片(嵌入了电路的硅基片的芯片)粘接到引线框、基板等(以下称为基板)接合的装置。在粘接该裸片与基板的芯片粘接材料(膏、膜)使用工程塑料，粘接到进行裸片的定位的引线框等。现在，以树脂作为接合材料来进行接合的方式成为主流。
在半导体的芯片接合中，为了将半导体芯片(IC，LSI)固定在引线框、陶瓷壳体、基板等上，使用焊锡、芯片接合用树脂膏(Ag环氧树脂以及Ag聚酰亚胺)作为粘接剂。
现有技术文献
专利文献1：日本特开2001-127080号公报
专利文献2：日本特开2004-288715号公报
接着，将裸片粘接到基板上的粘接剂通过涂敷由上下移动的注射器射出的膏状粘接剂而粘接。即，通过填充了膏状粘接剂的注射器，将规定量的粘接剂涂敷在规定位置上来进行粘接。
此时，在粘接前需要用识别用摄像机拍摄装有膏状粘接剂的注射器与引线框的图形识别并确认。于是在以往，使识别用摄像机移动到拍摄位置并拍摄，在检测出适当的粘接位置后再进行粘接动作。粘接后识别用摄像机再次移动到拍摄位置，进行用于确认膏状粘接剂是否被适当地涂敷的拍摄。
这样，以往的芯片接合机每将膏状粘接剂涂敷到引线框上，识别用摄像机就在拍摄位置上往复移动两次进行拍摄，存在非常浪费的工序。即，以往的芯片接合机中包含使单位时间的处理能力(生产率)降低的低效率动作。
此外，为了由识别用摄像机正确识别膏状粘接剂的涂敷位置及涂敷量，并抑制不良状况的发生，需要无莫尔条纹现象的鲜明的影像。
与此相对，虽然上述专利文献1、2具备图像识别用的识别用摄像机及照明，但是并没有考虑如何提高粘接剂涂敷作业的生产率。此外，也没有特别地考虑防止所拍摄的影像发生莫尔条纹现象的问题。
发明内容
本发明的目的在于，提供避免用于拍摄粘接剂涂敷的识别用摄像机的移动动作，且具有高生产率高可靠性的芯片接合机。
本发明为了实现上述目的，具有以下特征，具备：位于引线框的上方且在内部装入有膏状粘接剂的注射器；固定在该注射器的侧方的识别用摄像机；设置在该识别用摄像机的附近的照明；以及设置在面对该照明的位置上的反射板，上述反射板将来自上述照明的光线照射到上述芯片的膏状粘接剂的涂敷面。
此外，为了实现上述目的，优选上述识别用摄像机、上述照明、以及反射板以位于沿X方向输送的引线框的上方的上述注射器为边界，在装置跟前侧配置反射板，在装置进深侧配置识别用摄像机与照明。
此外，为了实现上述目的，优选上述照明配置在上述识别用摄像机的下部。
此外，为了实现上述目的，优选上述照明是将多个LED配置成环状而形成的照明装置，该照明装置配置在覆盖上述识别用摄像机的镜头的外周的位置上。
此外，为了实现上述目的，优选将上述反射板的反射面做成消光的白色涂层。
此外，为了实现上述目的，优选上述消光的白色涂层的厚度为0.02mm以上，0.04mm以下。
本发明的效果在于，能够提供避免用于拍摄粘接剂涂敷的识别用摄像机的移动动作，且具有高生产率高可靠性的芯片接合机。
附图说明
图1是从上方观察本发明的实施例一的芯片接合机的概念图。
图2是本发明的实施例一的初步加工部的外观立体图。
图3是本发明的实施例一的初步加工部的概略结构图。
图4是本发明的实施例二的初步加工部的概略结构图。
图5是本发明的实施例二的照明装置的正视图。
图6是表示本发明的实施例的动作的流程图。
图中：
1-晶圆供给部，2-框架供给输送部，3-芯片接合部，11-晶圆输送盒提升器，12-拾取装置，21-堆料装载器，22-框架进给器，23-卸载器，31-初步加工部，32-压接头部，33-识别用摄像机，33a-镜头，34-引线框，35-芯片，36-注射器，37-膏状粘接剂，38-照明，38a-LED，39-反射板。
具体实施方式
下面，基于附图对本发明的实施方式进行说明。
实施例一
图1是从上方观察本发明的实施例一的芯片接合机的概念图。
在图1中，芯片接合机10大致具有晶圆供给部1、框架供给输送部2、芯片接合部3。框架供给输送部2具有堆料装载器21、框架进给器22、卸载器23。通过堆料装载器21供给到框架进给器22的框架(以下成为引线框)经由框架进给器22上的两处处理位置被输送到卸载器23。
芯片接合部3具有初步加工部31与压接头部32。成为该芯片接合部3的前置工序的初步加工部31是将芯片粘接剂(以下称为膏状粘接剂)涂敷在由框架进给器22输送而来的框架上的部分。压接头部32从拾取装置12拾取芯片并上升，平行移动到框架进给器22上的接合点。接着，压接头部32使芯片下降，并将芯片结合到涂敷了膏状粘接剂的框架上。
初步加工部31的附近安装有后述的识别用摄像机33，用该识别用摄像机33来确认引线框的图形识别、以及已涂敷的膏状粘接剂是否以规定量涂敷在规定位置上。在初步加工部31的上部设有上下移动的后述的注射器36。该注射器36的内部填充有膏状粘接剂37，由空气压力膏状粘接剂37从喷嘴前端射出。
晶圆供给部1具有晶圆输送盒提升器11与拾取装置12。晶圆输送盒提升器11具有填充了晶圆环的晶圆输送盒(未图示)，依次将晶圆环供给到拾取装置12。
接着，本发明的发明人们首先研讨了识别用摄像机的固定位置。其结果，作为识别用摄像机的固定位置，以注射器为边界，固定在装置主体跟前侧(图1中初步加工部的-Y侧)并进行研讨之后，发现存在如下的不良状况。
即，进行装入在注射器内的粘接膏的追加装入时，注射器的取出方向为图2所示的-Y方向，而操作者的取出作业区域与上述方向为相同的方向。由此，若将识别用摄像机配置在装置主体跟前侧，则会妨碍注射器的取出作业。因此，以识别用摄像机固定设置在装置主体进深侧(图1中初步加工部的+Y侧)来进行各种研讨的结果，得到了如下的实施例。
图2是本发明的实施例一的初步加工部的外观立体图。
在图2中，引线框34在箭头X方向上移动。引线框34的上方配置有注射器36。在该注射器36的内部装入有膏状粘接剂37。识别用摄像机33在注射器36沿Z方向上升时测量引线框34的位置及膏状粘接剂37的涂敷量。该识别用摄像机33被倾斜地固定，以使镜头33a总是对准膏状粘接剂37的涂敷面。在识别用摄像机33的下方安装有照明38。该照明38由多个LED38a构成。来自该照明38的光线通过反射板39照射引线框34的图形识别面与膏状粘接剂37的涂敷面，该反射板39倾斜地安装在面对照明38的位置上。
以上这样的初步加工部31进行以下的动作来涂敷膏状粘接剂。
即，引线框34从箭头X方向移动而来。若引线框34到了注射器36的正下方就停止，从固定的识别用摄像机33所拍摄的图像来确认引线框34的停止位置是否适当。若确认停止位置是规定的位置，则注射器36下降，并在引线框34的规定位置上涂敷膏状粘接剂37。若由注射器36完成了膏状粘接剂37的涂敷，且注射器36沿Z方向上升，则通过识别用摄像机33来确认膏状粘接剂37是否为适当的量，或者有无液滴。若确认为适当的量且不存在液滴，则进入下一个涂敷操作。
另外，在本图中以虚线表示的注射器36是涂敷膏状粘接剂时的位置，实线是注射器36上升到上部(Z方向)时的位置。因此，表示本图中的依靠识别用摄像机33的拍摄为了使注射器36不遮挡照明38的光线，在注射器36上升后再观察已涂敷的膏状粘接剂的量的状态。
图3是从侧面观察初步加工部的图。
在图3中，在注射器36上升的阶段，用固定的识别用摄像机33观察膏状粘接剂的已涂敷部分。此时，来自照明38的光线如虚线所示地朝向反射板39照射，并由该反射板39反射回来的光线照射膏状粘接剂涂敷面。
另外，照明38由多个LED构成(在本实施例中以6个LED进行研讨)。为了使来自该照明38的光照射引线框34的膏状粘接剂涂敷面，而设置具有光泽面(镜面处理)的反射板时，发现拍摄的图像产生紊乱、变形。这是所谓的图像的莫尔条纹现象，是在存在规律的重复图纹等情况下产生的图像变形。
本发明的发明人们对产生该莫尔条纹现象的原因进行了各种讨论，认为进行了镜面处理的反射板39上存在原因，而对反射板39进行消光的白色涂层处理(涂层厚度约为0.03mm左右)，结果未产生莫尔条纹现象，获得了良好的影像。另外，涂层厚度为0.02～0.04mm时能获得良好的结果。
这样，在本实施例中通过避免用于拍摄的识别用摄像机的移动，从而不仅获得了高生产率的粘接剂涂敷作业，还能够使识别用摄像机的固定位置为不影响注射器取出的位置。
并且，在本实施例中，通过能够防止所拍摄影像的莫尔条纹现象，从而能够进行高可靠性的粘接剂涂敷。
实施例二
图4是本发明的实施例二的初步加工部的概略结构图。
在图4中，在引线框34的上部配置了注射器36。该注射器36中装入有膏状粘接剂37。识别用摄像机33在注射器36上升时观察引线框34的位置及膏状粘接剂37的涂敷量。安装在识别用摄像机33上的镜头33a的外周上安装有环状的照明38(关于该照明38，在图5中进行详细说明)。该照明38由多个LED38a构成。来自该照明38的光线通过反射板39照射引线框34的图形识别面与膏状粘接剂37的涂敷面，该反射板39倾斜地安装在面对照明38的位置上。
以上那样的初步加工部31进行以下动作来涂敷膏状粘接剂。
即，若引线框34到了注射器36的正下方就停止，从固定的识别用摄像机33拍摄的图像来确认引线框34的停止位置是否适当。若确认停止位置是规定的位置，则注射器36下降，并在引线框34的规定位置上涂敷膏状粘接剂37。若由注射器36完成了膏状粘接剂37的涂敷，且注射器36沿Z方向上升，则通过识别用摄像机33来确认膏状粘接剂37是否为适当的量。若确认是适当的量则进入下一个涂敷操作。
另外，在本图中以虚线表示的注射器36是涂敷膏状粘接剂时的位置，实线是注射器36上升到上部(Z方向)时的位置。因此，表示本图中的依靠识别用摄像机33的拍摄为了使注射器36不遮挡照明38的光线，在注射器36上升后再观察已涂敷的膏状粘接剂的量的状态。
图5是本发明的实施例二的照明装置的正视图。
在图5中，以覆盖识别用摄像机33的镜头33a的方式安装有环状的照明38。该环状的照明38是在形成为环状的容器内配置了多个LED的单体照明装置(在本实施例中以6个LED进行研讨)。
当然，在本实施例中为了使识别用摄像机33所拍摄的图像中不产生莫尔条纹现象，在反射板39上实施了消光的白色涂层。
这样，根据本实施例，由于照明为环状，能够使光线集中照射粘接剂的涂敷部分，所以能够获得鲜明且无莫尔条纹现象的影像。
图6是表示本发明的实施例的动作的流程图。
在图6中，
(步骤101)：引线框被输送来到初步加工部的规定位置，且进入用于涂敷膏状粘接剂的准备状态。
(步骤102)：用识别用摄像机确认输送而来的引线框是否配置在规定位置上。
(步骤103)：在摄像机的视野内确认存在框架位置的偏移，则计算距规定位置的偏移量，在涂敷膏状粘接剂时进行位置修正。另一方面，在摄像机的视野之外或无法识别的情况下，作为错误停止作业(步骤104)。
(步骤105)：注射器下降，将规定量的膏状粘接剂涂敷到引线框上。
(步骤106)：在结束了膏状粘接剂的涂敷的注射器上升后，识别用摄像机确认已涂敷的膏状粘接剂的状态。
(步骤107)：在确认膏状粘接剂的量少，或者磨伤的情况下，作为涂敷不良错误停止作业(步骤108)。若确认没有问题，则结束膏状粘接剂的涂敷工序。
根据这样的本实施例，由于膏状粘接剂的涂敷作业总是被识别用摄像机监视，所以不会出现引线框的位置偏移，能够进行规定量的膏状粘接剂涂敷。假设即使出现了引线框的位置偏移，由于在膏状粘接剂涂敷时进行偏移的修正，所以也不会发生因偏移引起的涂敷作业错误。此外，因为在达到识别用摄像机的视野之外这样的位置偏移、膏状粘接剂的涂敷量为规定量之外，或者因涂敷量少而发生的涂敷面的磨伤的情况下，立即作为涂敷错误并中断作业，所以不合格品不会流入市场。
根据以上所述的本发明，由于不存在识别用摄像机的移动，所以提高了生产率并提高了生产性。此外，由于注射器的喷嘴前端也可以由识别用摄像机来确认，所以提高了注射器的维修性。
并且，由于能够确认膏状粘接剂是否正常地涂敷，以及确认液滴的状态，所以能够实现品质的提高。并且，通过本实施例的反射板，由于能够以不存在因莫尔条纹现象引起的紊乱、变形的图像来进行涂敷面的确认，所以能够实现品质的进一步提高。

Claims (9)

1.一种芯片接合机，其特征在于，具备：位于引线框的上方且在内部装入有膏状粘接剂的注射器；固定在该注射器的侧方的识别用摄像机；设置在该识别用摄像机的附近的照明；以及设置在面对该照明的位置上的反射板，
上述反射板将来自上述照明的光线照射到上述芯片的膏状粘接剂的涂敷面。
2.根据权利要求1所述的芯片接合机，其特征在于，
上述识别用摄像机、上述照明、以及反射板以位于沿X方向输送的引线框的上方的上述注射器为边界，在-Y侧配置反射板，在+Y侧配置识别用摄像机与照明。
3.根据权利要求1所述的芯片接合机，其特征在于，
上述照明配置在上述识别用摄像机的下部。
4.根据权利要求2所述的芯片接合机，其特征在于，
上述照明配置在上述识别用摄像机的下部。
5.根据权利要求1所述的芯片接合机，其特征在于，
上述照明是将多个LED配置成环状而形成的照明装置，该照明装置配置在覆盖上述识别用摄像机的镜头的外周的位置上。
6.根据权利要求2所述的芯片接合机，其特征在于，
上述照明是将多个LED配置成环状而形成的照明装置，该照明装置配置在覆盖上述识别用摄像机的镜头的外周的位置上。
7.根据权利要求3所述的芯片接合机，其特征在于，
上述照明是将多个LED配置成环状而形成的照明装置，该照明装置配置在覆盖上述识别用摄像机的镜头的外周的位置上。
8.根据权利要求1所述的芯片接合机，其特征在于，
将上述反射板的反射面做成消光的白色涂层。
9.根据权利要求5所述的芯片接合机，其特征在于，
上述消光的白色涂层的厚度为0.02mm以上0.04mm以下。
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CN110648942A (zh) * 2018-06-27 2020-01-03 捷进科技有限公司 芯片贴装机及半导体器件的制造方法

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