TW201304022A - 晶片黏著機 - Google Patents

晶片黏著機 Download PDF

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TW201304022A
TW201304022A TW100131257A TW100131257A TW201304022A TW 201304022 A TW201304022 A TW 201304022A TW 100131257 A TW100131257 A TW 100131257A TW 100131257 A TW100131257 A TW 100131257A TW 201304022 A TW201304022 A TW 201304022A
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illumination
adhesive
camera
syringe
lead frame
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TWI456671B (zh
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Yoshiaki Makita
shingo Fukasawa
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Hitachi High Tech Instr Co Ltd
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Abstract

[課題]本發明是提供一種晶片黏著機，可排除將黏著劑塗抹攝影用的辨認用照相機的移動動作，具有較高的處理能力且高信賴性。[技術內容]本發明，具備：導線架、及位於此導線架的上部並朝內部封入膠狀黏著劑的注射器、及被固定於此注射器側方的辨認用照相機、及設在此辨認用照相機的附近的照明、及設在與此照明相面對的位置的反射板，前述反射板是將來自前述照明的光照射於前述導線架的膠狀黏著劑的塗抹面。且，辨認用照相機及前述照明及反射板是在以朝X方向被搬運的導線架的上部中的前述注射器為境的-Y側配置反射板，在+Y側配置辨認用照相機及照明，並且在前述反射板的反射面進行消光的白色塗抹。

Description

晶片黏著機
本發明是有關於晶片黏著機。
晶片黏著機，是將焊錫、鍍金、樹脂作為黏著材料，將晶片(植入電子電路的矽基板的晶片)與導線架和基板等(以下稱為基板)黏著的裝置。將此晶片及基板黏著的晶片黏結材(膠、薄膜)是使用工程塑料，與進行晶片的定位的導線架等黏著。現在，將樹脂作為黏著材料進行黏著的方式是成為主流。
在半導體的晶片黏著中，為了將半導體晶片(IC、LSI)附著在導線架、陶瓷殼、基板等，而使用焊錫和晶片黏結用樹脂膠(Ag環氧及Ag聚醯亞胺)作為黏著劑。
[先行技術文獻] [專利文獻]
[專利文獻1]　日本特開2001-127080號公報
[專利文獻2]　日本特開2004-288715號公報
其次，將晶片黏著在基板的黏著劑是藉由塗抹由上下動的注射器所射出的膠狀黏著劑而被黏著。即，藉由已封入膠狀黏著劑的注射器使黏著劑在預定的位置被塗抹預定量而被黏著。
此時，在黏著前有需要由辨認用照相機攝影確認已注入膠狀黏著劑的注射器及導線架的圖型辨認。在此，習知是將辨認用照相機移動直到攝影位置為止之後進行攝影，檢出適切的黏著位置之後才進行黏著動作。黏著後使辨認用照相機再度移動至攝影位置，進行供確認膠狀黏著劑是否適切地被塗抹用的攝影。
如此，習知的晶片黏著機是每次將膠狀黏著劑塗抹於導線架時就使辨認用照相機朝攝影位置2次往復移動地進行攝影，具有非常地多餘的過程。即，在習知的晶片黏著機中每單位時間包含了使處理能力低下的無效率的動作。
且為了使由辨認用照相機所進行的膠狀黏著劑的塗抹位置和塗抹量正確地被辨認，並抑制不良的發生，需要無波紋現象的鮮明的影像。
對於此，上述專利文獻1、2雖具備畫像辨認用的辨認用照相機和照明，但是未考慮提高黏著劑塗抹作業處理能力。且，特別是未考慮防止被攝影的影像的波紋現象發生。
本發明的目的，是提供一種晶片黏著機，可排除將黏著劑塗抹攝影用的辨認用照相機的移動動作，具有較高的處理能力且高信賴性。
為了達成上述目的，本發明的晶片黏著機，具備：位於導線架的上部並朝內部封入膠狀黏著劑的注射器、及被固定於此注射器的側方的辨認用照相機、及設在此辨認用照相機的附近的照明、及設在與此照明相面對位置的反射板，其特徵為：前述反射板是將來自前述照明的光照射於前述晶片的膠狀黏著劑的塗抹面。
且上述目的，是前述辨認用照相機及前述照明及反射板是在以朝X方向被搬運的導線架的上部中的前述注射器作為境的裝置前方側配置反射板，在裝置後方側配置辨認用照相機及照明較佳。
且上述目的，是使前述照明被配置於前述辨認用照相機的下部較佳。
且上述目的，是由複數個LED呈環狀配置形成前述照明作為照明裝置，將此照明裝置配置於覆蓋前述辨認用照相機的透鏡的外周的位置較佳。
且上述目的，是在前述反射板的反射面進行消光的白色塗抹較佳。
且上述目的，是前述前述消光的白色塗抹的厚度為0.02mm以上0.04mm以下較佳。
本發明的目的，是提供一種晶片黏著機，可排除將黏著劑塗抹攝影用的辨認用照相機的移動動作，具有較高的處理能力且高信賴性。
以下，依據圖面，說明本發明的實施例。
[實施例1]
第1圖是將本發明的實施例1的晶片黏著機從上所見的概念圖。
在第1圖中，晶片黏著機10若大致區分的話具有：晶圓供給部1、及框供給‧搬運部2、及晶片黏著部3。框供給‧搬運部2是具有：堆疊裝載器21、及框進給機22、及卸載器23。藉由堆疊裝載器21被供給至框進給機22的框(以下稱為導線架)，是透過框進給機22上的2處的處理位置朝卸載器23被搬運。
晶片黏著部3，是具有預製部31及黏著頭部32。成為此晶片黏著部3的前過程的預製部31，是在藉由框進給機22被搬運來的框塗抹晶片黏著劑(以下稱為膠狀黏著劑)的部分。黏著頭部32，是從拾取裝置12將晶片拾取後上昇，並平行移動直到框進給機22上的黏著點為止。且，黏著頭部32，是將晶片下降並黏著於已被塗抹膠狀黏著劑的框上。
在預製部31的附近安裝有後述的辨認用照相機33，由此辨認用照相機33確認導線架的圖型辨認及被塗抹的膠狀黏著劑是在預定位置被塗抹預定量。如後述，在預製部31的上部設有上下動的注射器36。在此注射器36的內部被封入膠狀黏著劑37，藉由空氣壓使膠狀黏著劑37從噴嘴先端被射出。
晶圓供給部1，是具有晶圓卡匣昇降機11及拾取裝置12。晶圓卡匣昇降機11，是具有晶圓環被充填的晶圓卡匣(無圖示)，依序將晶圓環供給至拾取裝置12。
其次，本發明的發明人等，首先檢討辨認用照相機的固定位置。其結果，對於辨認用照相機的固定位置，檢討若固定於以注射器為境的裝置本體前方側(第1圖中預製部的-Y側)時，發現具有如以下的問題。
即，欲進行已被封入注射器內的黏著膠的追加封入時，注射器的取出方向成為第2圖所示的-Y方向，而使作業者的取出作業領域成為與上述同方向。
因此，在裝置本體前方側配置辨認用照相機的話會成為注射器取出作業的阻礙。因此，藉由檢討將辨認用照相機設置固定在裝置本體後方側(第1圖中預製部的+Y側)等的各種的結果，而獲得如以下的實施例。
第2圖是本發明的實施例1的預製部的外觀立體圖。
在第2圖中，導線架34是朝箭頭X方向移動。在導線架34的上部配置有注射器36。在此注射器36的內部被封入膠狀黏著劑37。辨認用照相機33是當注射器36朝Z方向上昇時用來測量導線架34的位置和膠狀黏著劑37的塗抹量。此辨認用照相機33是被傾斜地固定，使透鏡33a時常對準膠狀黏著劑37的塗抹面。在辨認用照相機33的下方安裝有照明38。此照明38是由複數個LED38a所構成。來自此照明38的光是透過被傾斜安裝在與照明38相面對位置的反射板39來照射導線架34的圖型辨認面及膠狀黏著劑37的塗抹面。
如以上的預製部31是如以下地動作來塗抹膠狀黏著劑。
即，導線架34是從箭頭X方向移動來。若導線架34來到注射器36的正下的話就停止，從由被固定的辨認用照相機33被攝影的畫像確認導線架34的停止位置是否適切。若確認停止位置是預定的位置的話，使注射器36下降將膠狀黏著劑37塗抹在導線架34的預定位置。完成由注射器36所進行的膠狀黏著劑37的塗抹後，注射器36朝Z方向上昇的話，藉由辨認用照相機33確認膠狀黏著劑37是否適切量，或液滴的有無等。若確認適切量且無液滴的話，朝下一個塗抹作業前進。
又，在本圖中點線顯示的注射器36是將膠狀黏著劑塗抹時的位置，實線是注射器36朝上部(Z方向)上昇時的位置。因此，由本圖中的辨認用照相機33所進行的攝影是使注射器36不會遮住照明38的光的方式將注射器36上昇，並顯示觀察被塗抹的膠狀黏著劑的量的狀態。
第3圖是將預製部從側面所見的圖。
在第3圖中，是在注射器36上昇的階段，由被固定的辨認用照相機33觀察膠狀黏著劑的被塗抹部分。此時來自照明38的光是如點線所示朝向反射板39照射，藉由此反射板39反射的光來照射膠狀黏著劑塗抹面。
但是照明38是由複數個的LED所構成(在本實施例中由6個LED進行檢討)。為了將來自此照明38的光照射在導線架34的膠狀黏著劑塗抹面而設置具有光澤面(鏡面處理)的反射板時，發現在被攝影的畫像中會發生變形和歪斜。這是所謂的畫像的波紋現象，具有規則地反覆的模樣等的情況時所發生畫像的變形等。
對於此波紋現象的原因，本發明的發明人等進行各種檢討，考慮原因在於被鏡面處理的反射板39，而在反射板39進行消光的白色塗抹處理(塗抹厚度為約0.03mm程度)的結果，獲得沒有波紋現象的良好影像。又，塗抹厚度為0.02～0.04mm的話，皆可獲得良好的結果。
如此，在本實施例中藉由排除攝影用的辨認用照相機的移動，不只可獲得處理能力較高的黏著劑塗抹作業，且可以將辨認用照相機的固定位置設在不會影響注射器取下的位置。
進一步，在本實施例中藉由可以防止被攝影的影像的波紋現象，就可以進行信賴性高的黏著劑的塗抹。
[實施例2]
第4圖是本發明的實施例2的預製部的概略構成圖。
在第4圖中，在導線架34的上部配置有注射器36。在此注射器36中被封入膠狀黏著劑37。辨認用照相機33是當注射器36上昇時用來觀察導線架34的位置和膠狀黏著劑37的塗抹量。在被安裝於辨認用照相機33的透鏡33a的外周安裝有環狀的照明38(對於此照明38如第5圖詳細說明)。此照明38是由複數個LED38a所構成。來自此照明38的光是透過被傾斜安裝在與照明38相面對的位置的反射板39來照射導線架34的圖型辨認面及膠狀黏著劑的塗抹面。
如以上的預製部31是如以下地動作來塗抹膠狀黏著劑。
即，若導線架34來到注射器36的正下的話就停止，從由被固定的辨認用照相機33被攝影的畫像確認導線架34的停止位置是否適切。確認停止位置是預定的位置的話，使注射器36降下並在導線架34的預定位置塗抹膠狀黏著劑37。由注射器36所進行的膠狀黏著劑37的塗抹若完成且注射器36上昇的話，藉由辨認用照相機33確認膠狀黏著劑37是否被塗抹適切量。確認為適切量的話，朝下一個塗抹作業前進。
又，在本圖中點線顯示的注射器36是將膠狀黏著劑塗抹時的位置，實線是注射器36朝上部(Z方向)上昇時的位置。因此，由本圖中的辨認用照相機33所進行的攝影是使注射器36不會遮住照明38的光的方式將注射器36上昇，並顯示觀察被塗抹的膠狀黏著劑的量的狀態。
第5圖是本發明的實施例2的照明裝置的前視圖。
在第5圖中，將辨認用照相機33的透鏡33a覆蓋的方式安裝有環狀的照明38。此環狀的照明38是在形成環狀的容器內配置複數LED的單體的照明裝置(本實施例中由6個LED進行檢討)。
當然，在本實施例中使由辨認用照相機33被攝影的畫像不會發生波紋現象的方式，在反射板39進行消光的白色塗抹。
由此依據本實施例，因為照明成為環狀而可以對於黏著劑的塗抹部分照射集中的光，所以可以獲得鮮明且無波紋現象的影像。
第6圖是顯示本發明的實施例的動作的流程圖。
在第6圖中，
(步驟101)：在預製部當導線架被搬運來到預定位置後，進入塗抹膠狀黏著劑用的準備。
(步驟102)：由辨認用照相機確認被搬運來的導線架是否被配置於預定位置。
(步驟103)：確認在照相機的視野內框的位置是否偏離，計算從預定的位置的偏離量當將膠狀黏著劑塗抹時進行位置的修正。另一方面，照相機的視野外和辨認不能的情況時，就作為錯誤停止作業(步驟104)。
(步驟105)：使注射器降下並將預定量的膠狀黏著劑塗抹在導線架上。
(步驟106)：膠狀黏著劑的塗抹終了的注射器若上昇的話，由辨認用照相機確認被塗抹的膠狀黏著劑的狀態。
(步驟107)：被確認膠狀黏著劑的量少、和有摩擦的情況時，作為塗抹不良錯誤停止作業(步驟108)。若確認問題已解決，就終了膠狀黏著劑的塗抹過程。
如此依據本實施例，膠狀黏著劑的塗抹作業因為時常被辨認用照相機監視，就不會有導線架的位置偏離，可塗抹預定量的膠狀黏著劑。假設即使具有導線架的位置偏離，在膠狀黏著劑塗抹時因為有進行偏離的修正，所以不會有由偏離所產生的塗抹作業的錯誤的發生。且辨認用照相機的視野外的位置偏離和膠狀黏著劑的塗抹量為預定量外、和因塗抹量少而發生的塗抹面的摩擦的情況時，因為立即作為塗抹錯誤將作業中斷，所以不良品不會流入市場。
如以上依據本發明，因為不會有辨認用照相機的移動，所以處理能力提高且生產性提高。且，因為注射器的噴嘴先端也可以由辨認用照相機確認，所以注射器的維修性也提高。
進一步，因為也可以確認膠狀黏著劑是否正常地被塗抹的確認、和液滴狀態，所以可以達成品質提高。且因為藉由本實施例的反射板，可以沒有由波紋現象所產生的變形和歪斜的畫像進行塗抹面的確認，所以可以達成品質的更提高。
1．．．晶圓供給部
2．．．框供給‧搬運部
3．．．晶片黏著部
11．．．晶圓卡匣昇降機
12．．．拾取裝置
21．．．堆疊裝載器
22．．．框進給機
23．．．卸載器
31．．．預製部
32．．．黏著頭部
33．．．辨認用照相機
33a．．．透鏡
34．．．導線架
35．．．晶片
36．．．注射器
37．．．膠狀黏著劑
38．．．照明
38a．．．LED
39．．．反射板
[第1圖]將本發明的實施例1的晶片黏著機從上所見的概念圖。
[第2圖]本發明的實施例1的預製部的外觀立體圖。
[第3圖]本發明的實施例1的預製部的概略構成圖。
[第4圖]本發明的實施例2的預製部的概略構成圖。
[第5圖]本發明的實施例2的照明裝置的前視圖。
[第6圖]顯示本發明的實施例的動作的流程圖。
33．．．辨認用照相機
33a．．．透鏡
34．．．導線架
36．．．注射器
37．．．膠狀黏著劑
38．．．照明
38a．．．LED
39．．．反射板

Claims (9)

  1. 一種晶片黏著機，具備：位於導線架的上部並朝內部封入膠狀黏著劑的注射器、及被固定於此注射器的側方的辨認用照相機、及設在此辨認用照相機的附近的照明、及設在與此照明相面對位置的反射板，其特徵為：前述反射板是將來自前述照明的光照射於前述晶片的膠狀黏著劑的塗抹面。
  2. 如申請專利範圍第1項的晶片黏著機，其中，前述辨認用照相機及前述照明及反射板是在以朝X方向被搬運的導線架的上部中的前述注射器為境的-Y側配置反射板，在+Y側配置辨認用照相機及照明。
  3. 如申請專利範圍第1項的晶片黏著機，其中，前述照明是配置於前述辨認用照相機的下部。
  4. 如申請專利範圍第2項的晶片黏著機，其中，前述照明是配置於前述辨認用照相機的下部。
  5. 如申請專利範圍第1項的晶片黏著機，其中，由複數個LED呈環狀配置形成前述照明作為照明裝置，將此照明裝置配置於覆蓋前述辨認用照相機的透鏡的外周的位置。
  6. 如申請專利範圍第2項的晶片黏著機，其中，由複數個LED呈環狀配置形成前述照明作為照明裝置，將此照明裝置配置於覆蓋前述辨認用照相機的透鏡的外周的位置。
  7. 如申請專利範圍第3項的晶片黏著機，其中，由複數個LED呈環狀配置形成前述照明作為照明裝置，將此照明裝置配置於覆蓋前述辨認用照相機的透鏡的外周的位置。
  8. 如申請專利範圍第1項的晶片黏著機，其中，在前述反射板的反射面進行消光的白色塗抹。
  9. 如申請專利範圍第5項的晶片黏著機，其中，前述消光的白色塗抹的厚度為0.02mm以上0.04mm以下。
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CN102881613A (zh) 2013-01-16
CN102881613B (zh) 2016-04-13
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US20130016205A1 (en) 2013-01-17

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