CN102725690B - 感光性树脂组合物及其固化物、以及印刷电路板 - Google Patents
感光性树脂组合物及其固化物、以及印刷电路板 Download PDFInfo
- Publication number
- CN102725690B CN102725690B CN201080043075.8A CN201080043075A CN102725690B CN 102725690 B CN102725690 B CN 102725690B CN 201080043075 A CN201080043075 A CN 201080043075A CN 102725690 B CN102725690 B CN 102725690B
- Authority
- CN
- China
- Prior art keywords
- film
- photosensitive polymer
- colorant
- polymer combination
- dry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009225059A JP5306952B2 (ja) | 2009-09-29 | 2009-09-29 | 感光性樹脂組成物及びその硬化物、並びにプリント配線板 |
JP2009-225059 | 2009-09-29 | ||
PCT/JP2010/005776 WO2011039984A1 (ja) | 2009-09-29 | 2010-09-24 | 感光性樹脂組成物及びその硬化物、並びにプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102725690A CN102725690A (zh) | 2012-10-10 |
CN102725690B true CN102725690B (zh) | 2014-05-28 |
Family
ID=43825833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080043075.8A Active CN102725690B (zh) | 2009-09-29 | 2010-09-24 | 感光性树脂组合物及其固化物、以及印刷电路板 |
Country Status (8)
Country | Link |
---|---|
US (2) | US20130048357A1 (zh) |
JP (1) | JP5306952B2 (zh) |
KR (1) | KR101410086B1 (zh) |
CN (1) | CN102725690B (zh) |
HK (1) | HK1173507A1 (zh) |
MY (1) | MY155964A (zh) |
TW (1) | TWI485514B (zh) |
WO (1) | WO2011039984A1 (zh) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012003225A (ja) * | 2010-01-27 | 2012-01-05 | Fujifilm Corp | ソルダーレジスト用重合性組成物及びソルダーレジストパターンの形成方法 |
JP5007453B2 (ja) * | 2010-06-11 | 2012-08-22 | 株式会社タムラ製作所 | 黒色硬化性樹脂組成物 |
JP2012237864A (ja) * | 2011-05-11 | 2012-12-06 | Kaneka Corp | 新規な黒色感光性樹脂組成物及びその利用 |
JP5583091B2 (ja) * | 2011-08-31 | 2014-09-03 | 株式会社タムラ製作所 | 黒色硬化性樹脂組成物 |
JP5877690B2 (ja) * | 2011-11-15 | 2016-03-08 | 株式会社カネカ | 新規な感光性樹脂組成物作製キット及びその利用 |
CN103975274B (zh) * | 2011-12-06 | 2016-10-26 | 株式会社钟化 | 黑色感光性树脂组合物及其利用 |
WO2013171888A1 (ja) * | 2012-05-17 | 2013-11-21 | 太陽インキ製造株式会社 | アルカリ現像型の熱硬化性樹脂組成物、プリント配線板 |
JP5766671B2 (ja) * | 2012-09-05 | 2015-08-19 | 株式会社タムラ製作所 | 黒色硬化性樹脂組成物およびそれを用いたプリント配線基板 |
JP5695622B2 (ja) * | 2012-09-24 | 2015-04-08 | 株式会社タムラ製作所 | 黒色硬化性樹脂組成物 |
TW201423272A (zh) * | 2012-11-27 | 2014-06-16 | Jsr Corp | 感光性組成物、著色劑分散液、濾光片及光感應器 |
JP6170673B2 (ja) | 2012-12-27 | 2017-07-26 | 富士フイルム株式会社 | カラーフィルタ用組成物、赤外線透過フィルタ及びその製造方法、並びに赤外線センサー |
JP5809182B2 (ja) * | 2013-03-26 | 2015-11-10 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
JP6134188B2 (ja) * | 2013-04-03 | 2017-05-24 | 株式会社カネカ | 黒色感光性樹脂組成物及びその利用 |
DE102013211090A1 (de) * | 2013-06-14 | 2014-12-18 | Robert Bosch Gmbh | Erfassungssystem zum Erfassen einer Lötverbindung |
JP6185943B2 (ja) * | 2015-02-10 | 2017-08-23 | 互応化学工業株式会社 | ソルダーレジスト組成物、被覆プリント配線板 |
JP6421161B2 (ja) * | 2015-11-27 | 2018-11-07 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
KR102025359B1 (ko) * | 2016-03-08 | 2019-09-25 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용한 블랙 컬럼 스페이서 및 컬러필터 |
JP6112691B1 (ja) | 2016-03-16 | 2017-04-12 | 互応化学工業株式会社 | 液状ソルダーレジスト組成物及びプリント配線板 |
JP5997860B1 (ja) * | 2016-03-16 | 2016-09-28 | 互応化学工業株式会社 | 液状ソルダーレジスト組成物及びプリント配線板 |
KR102080235B1 (ko) * | 2016-10-28 | 2020-02-21 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용한 흑색 감광성 수지막 및 컬러필터 |
KR101992009B1 (ko) * | 2017-02-03 | 2019-06-21 | 동우 화인켐 주식회사 | 자발광 감광성 수지 조성물, 이를 이용한 색변환층을 포함하는 컬러필터 및 화상표시장치 |
KR20180119475A (ko) * | 2017-04-25 | 2018-11-02 | 도오꾜오까고오교 가부시끼가이샤 | 블랙 칼럼 스페이서 형성용의 감광성 수지 조성물, 블랙 칼럼 스페이서, 표시 장치, 및 블랙 칼럼 스페이서의 형성 방법 |
CN109254498B (zh) * | 2017-07-14 | 2023-07-14 | 株式会社田村制作所 | 感光性树脂组合物 |
JP6596550B2 (ja) * | 2017-09-08 | 2019-10-23 | 株式会社タムラ製作所 | 感光性樹脂組成物、感光性樹脂組成物が塗工されたドライフィルム及び感光性樹脂組成物の光硬化膜を有するプリント配線板 |
JP6986476B2 (ja) * | 2018-03-29 | 2021-12-22 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
JP7324595B2 (ja) * | 2018-03-30 | 2023-08-10 | 太陽ホールディングス株式会社 | 黒色感光性樹脂組成物、その硬化物、およびリジッドフレキシブルプリント配線板 |
JP6764894B2 (ja) * | 2018-04-19 | 2020-10-07 | 富士フイルム株式会社 | 赤外線透過フィルタ用組成物、赤外線透過フィルタ、赤外線透過フィルタの製造方法、及び、赤外線センサー |
JP7300619B2 (ja) * | 2019-01-11 | 2023-06-30 | 太陽ホールディングス株式会社 | 積層構造体、ドライフィルム、その硬化物および電子部品 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06289602A (ja) * | 1993-03-31 | 1994-10-18 | Tokyo Ohka Kogyo Co Ltd | ペリレン系色素を用いた感光性樹脂組成物 |
JP4768924B2 (ja) * | 2001-03-30 | 2011-09-07 | 互応化学工業株式会社 | フォトソルダーレジストインク |
WO2002093255A2 (en) * | 2001-05-15 | 2002-11-21 | Showa Denko K. K. | Photosensitive coloring compositon, color filter using the compositon and method of producing the same |
JP2004317850A (ja) * | 2003-04-17 | 2004-11-11 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造方法およびプリント配線板の製造方法 |
JP4245510B2 (ja) * | 2004-05-10 | 2009-03-25 | 日本合成化学工業株式会社 | 感光性樹脂組成物及びそれを用いたフォトレジストフィルム |
JP4461005B2 (ja) * | 2004-12-06 | 2010-05-12 | 日本合成化学工業株式会社 | 感光性樹脂組成物及びそれを用いたフォトレジストフィルム、レジストパターン形成方法 |
JP4794870B2 (ja) * | 2005-02-24 | 2011-10-19 | 東京応化工業株式会社 | 遮光層形成用感光性樹脂組成物ならびに遮光層およびカラーフィルタ |
JP2007071994A (ja) * | 2005-09-05 | 2007-03-22 | Tokyo Ohka Kogyo Co Ltd | 黒色感光性樹脂組成物 |
KR100881860B1 (ko) * | 2007-01-17 | 2009-02-06 | 제일모직주식회사 | 컬러필터용 감광성 수지 조성물 및 이를 이용한 이미지센서컬러필터 |
JP4994923B2 (ja) * | 2007-04-06 | 2012-08-08 | 太陽ホールディングス株式会社 | 黒色ソルダーレジスト組成物およびその硬化物 |
JP5352175B2 (ja) * | 2008-03-26 | 2013-11-27 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びその硬化物、並びにその硬化物からなるソルダーレジスト層を有するプリント配線基板 |
-
2009
- 2009-09-29 JP JP2009225059A patent/JP5306952B2/ja active Active
-
2010
- 2010-09-21 TW TW099132023A patent/TWI485514B/zh active
- 2010-09-24 KR KR1020127004984A patent/KR101410086B1/ko active IP Right Grant
- 2010-09-24 WO PCT/JP2010/005776 patent/WO2011039984A1/ja active Application Filing
- 2010-09-24 MY MYPI2012001368A patent/MY155964A/en unknown
- 2010-09-24 CN CN201080043075.8A patent/CN102725690B/zh active Active
- 2010-09-24 US US13/497,923 patent/US20130048357A1/en not_active Abandoned
-
2013
- 2013-01-16 HK HK13100672A patent/HK1173507A1/zh unknown
-
2014
- 2014-08-27 US US14/470,059 patent/US9282644B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
HK1173507A1 (zh) | 2013-05-16 |
TW201128306A (en) | 2011-08-16 |
JP2011075678A (ja) | 2011-04-14 |
WO2011039984A1 (ja) | 2011-04-07 |
TWI485514B (zh) | 2015-05-21 |
KR101410086B1 (ko) | 2014-06-25 |
JP5306952B2 (ja) | 2013-10-02 |
US9282644B2 (en) | 2016-03-08 |
US20140360758A1 (en) | 2014-12-11 |
MY155964A (en) | 2015-12-31 |
US20130048357A1 (en) | 2013-02-28 |
CN102725690A (zh) | 2012-10-10 |
KR20120044371A (ko) | 2012-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102725690B (zh) | 感光性树脂组合物及其固化物、以及印刷电路板 | |
CN101403859B (zh) | 感光性树脂组合物及其固化物 | |
CN101546123B (zh) | 感光性树脂组合物及其固化物以及具有该固化物形成的阻焊剂层的印刷线路基板 | |
CN101846882B (zh) | 光固化性热固化性树脂组合物、干膜、固化物、印刷电路板 | |
CN102112921B (zh) | 阻燃性光固化性树脂组合物、其干膜及固化物以及使用它们的印刷电路板 | |
CN103492950B (zh) | 光固化性热固化性树脂组合物 | |
CN101738858B (zh) | 阻燃性光固化性树脂组合物、干膜、固化物、印刷电路板 | |
CN102471424B (zh) | 光固化性树脂组合物 | |
CN101846881A (zh) | 固化性树脂组合物、使用其的干膜和印刷电路板 | |
CN102272677B (zh) | 光固化性树脂组合物、其干膜及固化物以及使用它们的印刷电路板 | |
CN103460132A (zh) | 感光性组合物、其固化皮膜以及使用了它们的印刷电路板 | |
CN102472965B (zh) | 光固化性树脂组合物 | |
CN101852988A (zh) | 感光性树脂组合物、使用其的干膜和印刷电路板 | |
CN103282828B (zh) | 光固化性树脂组合物 | |
CN102472970A (zh) | 光固化性热固化性树脂组合物 | |
CN102736415A (zh) | 光固化性热固化性树脂组合物、其干膜和固化物以及使用它们的印刷电路板 | |
CN101981131B (zh) | 固化性树脂组合物和其固化物、以及印刷电路板 | |
CN104808436A (zh) | 碱显影型感光性树脂组合物、干膜和固化物、以及印刷电路板 | |
CN102422224B (zh) | 感光性树脂组合物、其干膜和固化物以及使用了它们的印刷电路板 | |
CN102112920B (zh) | 阻燃性光固化性树脂组合物、其干膜及固化物以及使用它们的印刷电路板 | |
CN102414618A (zh) | 光固化性热固化性树脂组合物 | |
CN103869620A (zh) | 碱显影性的光固化性树脂组合物、其干膜及固化物以及使用其的印刷电路板 | |
JP5660690B2 (ja) | 感光性樹脂組成物及びその硬化物 | |
JP5433209B2 (ja) | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 | |
CN105425539A (zh) | 黑色光固化性热固化性树脂组合物、固化物、及印刷电路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1173507 Country of ref document: HK |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1173507 Country of ref document: HK |
|
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20121010 Assignee: Taiyo Ink Mfg.Co., Ltd. Assignor: Taiyo Holding Co., Ltd. Contract record no.: 2011990000116 Denomination of invention: Photosensitive resin composition and cured product thereof, and printed circuit board Granted publication date: 20140528 License type: Common License Record date: 20110302 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model |