CN102690611B - 胶带组合物以及由其制备的胶带 - Google Patents
胶带组合物以及由其制备的胶带 Download PDFInfo
- Publication number
- CN102690611B CN102690611B CN201110444884.6A CN201110444884A CN102690611B CN 102690611 B CN102690611 B CN 102690611B CN 201110444884 A CN201110444884 A CN 201110444884A CN 102690611 B CN102690611 B CN 102690611B
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- weight
- tape compositions
- acrylate
- compositions according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 156
- 239000000203 mixture Substances 0.000 title claims abstract description 92
- 239000003822 epoxy resin Substances 0.000 claims abstract description 39
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 39
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 35
- 239000003999 initiator Substances 0.000 claims abstract description 23
- 125000002091 cationic group Chemical group 0.000 claims abstract description 21
- 239000000178 monomer Substances 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910021485 fumed silica Inorganic materials 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 3
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 claims description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 2
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 claims description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 2
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 34
- 238000012360 testing method Methods 0.000 description 34
- 239000011248 coating agent Substances 0.000 description 31
- 238000004321 preservation Methods 0.000 description 22
- 239000003292 glue Substances 0.000 description 20
- 239000004925 Acrylic resin Substances 0.000 description 18
- 229920006267 polyester film Polymers 0.000 description 16
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 13
- 150000003254 radicals Chemical class 0.000 description 12
- 238000010008 shearing Methods 0.000 description 11
- 238000007711 solidification Methods 0.000 description 11
- 230000008023 solidification Effects 0.000 description 11
- 238000001723 curing Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 230000001276 controlling effect Effects 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- 238000010422 painting Methods 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 238000013035 low temperature curing Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- -1 hydrogen dihydroxyphenyl propanes Chemical class 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000011819 refractory material Substances 0.000 description 2
- 238000007761 roller coating Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- WMNZJWSCGYPOTF-UHFFFAOYSA-N CC(C(C(C1=CC=CC=C1)(O)O)(C)C)C Chemical compound CC(C(C(C1=CC=CC=C1)(O)O)(C)C)C WMNZJWSCGYPOTF-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 150000002118 epoxides Chemical group 0.000 description 1
- 229920006130 high-performance polyamide Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
- Y10T428/1457—Silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Graft Or Block Polymers (AREA)
- Polymerisation Methods In General (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110444884.6A CN102690611B (zh) | 2011-12-27 | 2011-12-27 | 胶带组合物以及由其制备的胶带 |
| KR1020147020966A KR20140116444A (ko) | 2011-12-27 | 2012-12-21 | 접착 테이프 조성물 및 그로부터 제조된 접착 테이프 |
| JP2014550390A JP6188716B2 (ja) | 2011-12-27 | 2012-12-21 | 接着テープ組成物及びその組成物から製造される接着テープ |
| EP12813222.2A EP2797973B1 (en) | 2011-12-27 | 2012-12-21 | Adhesive tape composition and adhesive tape prepared from same |
| US14/368,118 US10273384B2 (en) | 2011-12-27 | 2012-12-21 | Adhesive tape composition and adhesive tape prepared from same |
| PCT/US2012/071123 WO2013101693A1 (en) | 2011-12-27 | 2012-12-21 | Adhesive tape composition and adhesive tape prepared from same |
| IN4906CHN2014 IN2014CN04906A (enExample) | 2011-12-27 | 2014-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110444884.6A CN102690611B (zh) | 2011-12-27 | 2011-12-27 | 胶带组合物以及由其制备的胶带 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102690611A CN102690611A (zh) | 2012-09-26 |
| CN102690611B true CN102690611B (zh) | 2015-06-24 |
Family
ID=46856353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110444884.6A Active CN102690611B (zh) | 2011-12-27 | 2011-12-27 | 胶带组合物以及由其制备的胶带 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10273384B2 (enExample) |
| EP (1) | EP2797973B1 (enExample) |
| JP (1) | JP6188716B2 (enExample) |
| KR (1) | KR20140116444A (enExample) |
| CN (1) | CN102690611B (enExample) |
| IN (1) | IN2014CN04906A (enExample) |
| WO (1) | WO2013101693A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103590280B (zh) * | 2013-10-21 | 2016-11-02 | 惠州市长润发涂料有限公司 | 一种uv光固化的弹性手感纸品光油及其施工方法 |
| CN107683316A (zh) | 2015-06-04 | 2018-02-09 | 3M创新有限公司 | 将硬件粘结到车辆玻璃的方法 |
| US10350861B2 (en) * | 2015-07-31 | 2019-07-16 | Corning Incorporated | Laminate structures with enhanced damping properties |
| CN105441001A (zh) * | 2015-12-24 | 2016-03-30 | 深圳市浩力新材料技术有限公司 | 一种高性能光通讯器件用接着剂及其制备方法 |
| DE102016207548A1 (de) | 2016-05-02 | 2017-11-02 | Tesa Se | Härtbare Klebemasse und darauf basierende Reaktivklebebänder |
| DE102016207540A1 (de) | 2016-05-02 | 2017-11-02 | Tesa Se | Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat |
| DE102016207550A1 (de) | 2016-05-02 | 2017-11-02 | Tesa Se | Funktionalisierte (Co)Polymere für Klebesysteme und Klebebänder |
| JPWO2018020939A1 (ja) * | 2016-07-25 | 2019-05-09 | セメダイン株式会社 | 感圧接着剤 |
| DE102016220237A1 (de) | 2016-10-17 | 2018-04-19 | Tesa Se | Verfahren zur Herstellung einer versiegelten Falzverbindung |
| CN107163478B (zh) * | 2017-06-27 | 2022-03-08 | 江门盈骅光电科技有限公司 | 可先热固化、再光照射固化的不饱和树脂组合物及其制备方法和用途 |
| JP6709943B2 (ja) * | 2017-12-13 | 2020-06-17 | ナミックス株式会社 | 導電性ペースト |
| CN108676513A (zh) * | 2018-06-06 | 2018-10-19 | 芜湖夏鑫新型材料科技有限公司 | 一种手机玻璃保护膜及其制备方法 |
| DE102018213824A1 (de) | 2018-08-16 | 2020-02-20 | Tesa Se | Verfahren zur Herstellung einer versiegelten Falzverbindung |
| CN109694676A (zh) * | 2018-12-28 | 2019-04-30 | 福建友谊胶粘带集团有限公司 | 一种反射片保护胶水、胶带及其制备方法 |
| CN109666428A (zh) * | 2018-12-28 | 2019-04-23 | 福建友谊胶粘带集团有限公司 | 一种手机屏幕遮光胶水、胶带及其制备方法 |
| US11608452B2 (en) | 2019-02-20 | 2023-03-21 | Adhesives Research, Inc. | UV light curable adhesive and device with UV light curable adhesive |
| US12428582B2 (en) | 2019-05-28 | 2025-09-30 | 3M Innovative Properties Company | Curable pressure-sensitive adhesive composition, curable pressure-sensitive adhesive tape, and battery pack |
| CN111234713A (zh) * | 2019-05-29 | 2020-06-05 | 深圳市鑫东邦科技有限公司 | 一种底部填充胶及其制备方法 |
| US20220259471A1 (en) * | 2019-05-31 | 2022-08-18 | Sekisui Chemical Co., Ltd. | Adhesive composition, optical component, electronic component, and electronic module |
| CN110467890B (zh) * | 2019-07-16 | 2021-09-17 | 广州慧谷工程材料有限公司 | 压敏胶带及其制备方法、用于制备压敏胶带的树脂组合物 |
| CN110396374B (zh) * | 2019-09-11 | 2021-09-28 | 苏州赛伍应用技术股份有限公司 | 一种锂电池壳保护胶带及其制备方法和使用方法 |
| DE102019215890A1 (de) | 2019-10-16 | 2021-04-22 | Tesa Se | Härtbare Klebemasse und darauf basierende Reaktivklebebänder |
| EP4082677A4 (en) * | 2020-01-30 | 2024-01-24 | Toray Industries, Inc. | COATING AGENT, SHEET-TYPE INTERMEDIATE BASE MATERIAL, PHOTOCURABLE RESIN FILM, FIBER-REINFORCED COMPOSITE MATERIAL INTERMEDIATE, FIBER-REINFORCED COMPOSITE MATERIAL, METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL INTERMEDIATE, AND METHOD FOR MATERIAL PRODUCTION FIBER REINFORCED COMPOSITE |
| DE102022113506A1 (de) | 2022-05-30 | 2023-11-30 | Tesa Se | Verfahren zum Verbinden, Ablösen und Wiederverbinden von Substraten |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5453450A (en) * | 1993-06-16 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Stabilized curable adhesives |
| CN101080672A (zh) * | 2004-12-14 | 2007-11-28 | 荷兰聚合物研究所 | 多孔全息膜 |
| CN102015943A (zh) * | 2008-03-07 | 2011-04-13 | 3M创新有限公司 | 具有图案化背衬的切割带和晶粒附连粘合剂 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4677137A (en) * | 1985-05-31 | 1987-06-30 | Minnesota Mining And Manufacturing Company | Supported photoinitiator |
| JPH0794587B2 (ja) * | 1990-11-14 | 1995-10-11 | 日本ペイント株式会社 | 新規常温硬化性樹脂組成物及び塗料組成物 |
| US5262232A (en) | 1992-01-22 | 1993-11-16 | Minnesota Mining And Manufacturing Company | Vibration damping constructions using acrylate-containing damping materials |
| US5427638A (en) | 1992-06-04 | 1995-06-27 | Alliedsignal Inc. | Low temperature reaction bonding |
| WO1996009352A1 (en) | 1994-09-19 | 1996-03-28 | Minnesota Mining And Manufacturing Company | Epoxy adhesive composition |
| US5721289A (en) | 1994-11-04 | 1998-02-24 | Minnesota Mining And Manufacturing Company | Stable, low cure-temperature semi-structural pressure sensitive adhesive |
| US6057382A (en) | 1998-05-01 | 2000-05-02 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
| JP4573373B2 (ja) * | 1999-05-20 | 2010-11-04 | スリーエム イノベイティブ プロパティズ カンパニー | 接着構造体 |
| US6949297B2 (en) * | 2001-11-02 | 2005-09-27 | 3M Innovative Properties Company | Hybrid adhesives, articles, and methods |
| US7569634B2 (en) * | 2002-02-14 | 2009-08-04 | The Glidden Company | Curable adhesive composition, adhesive kit and method of adhering substrates |
| JP4201519B2 (ja) | 2002-04-01 | 2008-12-24 | スリーエム イノベイティブ プロパティズ カンパニー | カチオン重合性接着剤組成物及び異方導電性接着剤組成物 |
| JP2006199894A (ja) * | 2005-01-24 | 2006-08-03 | Sekisui Chem Co Ltd | 接着シート及び半導体装置 |
| US8535473B2 (en) | 2005-03-03 | 2013-09-17 | 3M Innovative Properties Company | Thermosettable adhesive tape, articles and methods |
| US20070213429A1 (en) * | 2006-03-10 | 2007-09-13 | Chih-Min Cheng | Anisotropic conductive adhesive |
| US20090104448A1 (en) * | 2007-10-17 | 2009-04-23 | Henkel Ag & Co. Kgaa | Preformed adhesive bodies useful for joining substrates |
| DE102008028638A1 (de) * | 2008-06-18 | 2009-12-24 | Henkel Ag & Co. Kgaa | Kleb- und Dichtstoff oder Strukturschaum auf Epoxidbasis enthaltend anorganische Nanopartikel mit Acrylsäureester-haltiger Hülle |
-
2011
- 2011-12-27 CN CN201110444884.6A patent/CN102690611B/zh active Active
-
2012
- 2012-12-21 KR KR1020147020966A patent/KR20140116444A/ko not_active Abandoned
- 2012-12-21 JP JP2014550390A patent/JP6188716B2/ja not_active Expired - Fee Related
- 2012-12-21 EP EP12813222.2A patent/EP2797973B1/en not_active Not-in-force
- 2012-12-21 WO PCT/US2012/071123 patent/WO2013101693A1/en not_active Ceased
- 2012-12-21 US US14/368,118 patent/US10273384B2/en not_active Expired - Fee Related
-
2014
- 2014-06-27 IN IN4906CHN2014 patent/IN2014CN04906A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5453450A (en) * | 1993-06-16 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Stabilized curable adhesives |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2797973B1 (en) | 2018-06-06 |
| US10273384B2 (en) | 2019-04-30 |
| US20140349054A1 (en) | 2014-11-27 |
| JP2015507680A (ja) | 2015-03-12 |
| JP6188716B2 (ja) | 2017-08-30 |
| CN102690611A (zh) | 2012-09-26 |
| IN2014CN04906A (enExample) | 2015-09-18 |
| KR20140116444A (ko) | 2014-10-02 |
| WO2013101693A1 (en) | 2013-07-04 |
| EP2797973A1 (en) | 2014-11-05 |
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