CN102686013B - 功率半导体装置、印刷布线板和它们的连接机构 - Google Patents

功率半导体装置、印刷布线板和它们的连接机构 Download PDF

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Publication number
CN102686013B
CN102686013B CN201110296956.7A CN201110296956A CN102686013B CN 102686013 B CN102686013 B CN 102686013B CN 201110296956 A CN201110296956 A CN 201110296956A CN 102686013 B CN102686013 B CN 102686013B
Authority
CN
China
Prior art keywords
power semiconductor
semiconductor device
wiring board
printed wiring
fitting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110296956.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN102686013A (zh
Inventor
冈诚次
井高志织
吉田博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN102686013A publication Critical patent/CN102686013A/zh
Application granted granted Critical
Publication of CN102686013B publication Critical patent/CN102686013B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CN201110296956.7A 2011-01-20 2011-09-30 功率半导体装置、印刷布线板和它们的连接机构 Expired - Fee Related CN102686013B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011009539A JP5599328B2 (ja) 2011-01-20 2011-01-20 電力用半導体装置とプリント配線板との接続機構
JP2011-009539 2011-01-20

Publications (2)

Publication Number Publication Date
CN102686013A CN102686013A (zh) 2012-09-19
CN102686013B true CN102686013B (zh) 2016-02-03

Family

ID=46510898

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110296956.7A Expired - Fee Related CN102686013B (zh) 2011-01-20 2011-09-30 功率半导体装置、印刷布线板和它们的连接机构

Country Status (4)

Country Link
US (1) US8575745B2 (enExample)
JP (1) JP5599328B2 (enExample)
CN (1) CN102686013B (enExample)
DE (1) DE102011087414B4 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014049582A (ja) * 2012-08-31 2014-03-17 Mitsubishi Electric Corp 半導体装置
US9640453B2 (en) 2013-02-26 2017-05-02 Mitsubishi Electric Corporation Power semiconductor device
CN103367299B (zh) * 2013-07-03 2017-02-15 株洲南车时代电气股份有限公司 半导体模块功率互联装置及其方法
JP6117661B2 (ja) 2013-09-19 2017-04-19 日立オートモティブシステムズ株式会社 電子制御装置
US9706643B2 (en) 2014-06-19 2017-07-11 Panasonic Intellectual Property Management Co., Ltd. Electronic device and method for manufacturing the same
DE102014116793B4 (de) 2014-11-17 2018-03-08 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
CN107210279B (zh) * 2015-05-21 2019-07-19 三菱电机株式会社 电力用半导体装置
JP6380244B2 (ja) 2015-06-15 2018-08-29 三菱電機株式会社 半導体装置、電力変換装置
JP6455364B2 (ja) * 2015-08-28 2019-01-23 三菱電機株式会社 半導体装置、インテリジェントパワーモジュールおよび電力変換装置
JP6743542B2 (ja) 2016-07-15 2020-08-19 富士電機株式会社 半導体装置及び半導体装置用ケース
JP6445066B2 (ja) * 2017-03-22 2018-12-26 日立オートモティブシステムズ株式会社 電子制御装置
JP6445068B2 (ja) * 2017-03-23 2018-12-26 日立オートモティブシステムズ株式会社 電子制御装置
EP3442080A1 (de) * 2017-08-09 2019-02-13 HILTI Aktiengesellschaft Steckkupplung für eine akkueinheit
CN107946273A (zh) * 2017-12-22 2018-04-20 江苏宏微科技股份有限公司 一种插接功率模块封装装置
US10497635B2 (en) * 2018-03-27 2019-12-03 Linear Technology Holding Llc Stacked circuit package with molded base having laser drilled openings for upper package
US11901273B2 (en) * 2021-07-26 2024-02-13 Infineon Technologies Ag Power module with press-fit contacts
US12494418B2 (en) 2021-07-26 2025-12-09 Infineon Technologies Ag Power module with press-fit contacts
US12438068B2 (en) 2022-01-18 2025-10-07 Infineon Technologies Austria Ag Stacked module arrangement
DE102022118358A1 (de) * 2022-07-22 2024-01-25 HARTING Electronics GmbH Steckverbinder mit Transportsicherung für Gegenkontaktelemente

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1249122A (zh) * 1997-03-27 2000-03-29 福特汽车公司 用于电子元件安装的模制插座
CN101828310A (zh) * 2007-10-19 2010-09-08 日本发条株式会社 连接端子、半导体封装、布线基板、连接器及微接触器

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS507277B1 (enExample) * 1969-01-28 1975-03-24
JPS52118595A (en) * 1976-03-31 1977-10-05 Matsushita Electric Works Ltd Wiring track
JPS56104074U (enExample) * 1980-01-12 1981-08-14
JPS58169878A (ja) 1982-03-31 1983-10-06 ケル株式会社 Ｉｃソケツト用コンタクト
DE3675321D1 (de) * 1985-08-16 1990-12-06 Dai Ichi Seiko Co Ltd Halbleiteranordnung mit packung vom steckerstifttyp.
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
US4890152A (en) * 1986-02-14 1989-12-26 Matsushita Electric Works, Ltd. Plastic molded chip carrier package and method of fabricating the same
EP0268181B1 (en) * 1986-11-15 1992-07-29 Matsushita Electric Works, Ltd. Plastic molded pin grid chip carrier package
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
JPH01159369U (enExample) 1988-04-22 1989-11-06
JPH0619169Y2 (ja) * 1989-05-23 1994-05-18 住友電装株式会社 ウェッジベースバルブ用ターミナル端子
JPH0481365U (enExample) * 1990-11-27 1992-07-15
JPH062594U (ja) * 1992-06-16 1994-01-14 矢崎総業株式会社 プラグターミナル
JPH07130417A (ja) * 1993-10-29 1995-05-19 Matsushita Electric Works Ltd 電気接続装置
JP2798605B2 (ja) 1994-04-27 1998-09-17 日本電気株式会社 実装装置の製造方法
JP2970463B2 (ja) * 1995-03-31 1999-11-02 日本電気株式会社 コネクタ
JP3908810B2 (ja) * 1996-10-18 2007-04-25 富士通株式会社 光モジュール
JPH10123372A (ja) * 1996-10-18 1998-05-15 Fujitsu Ltd 光モジュール
WO1999002022A1 (en) 1997-07-01 1999-01-14 Koninklijke Philips Electronics N.V. Printed circuit board with a leaded component and method of securing the component
JP3716108B2 (ja) * 1998-10-20 2005-11-16 住友電装株式会社 ウェッジベースバルブ装置
DE10008572B4 (de) * 2000-02-24 2007-08-09 Infineon Technologies Ag Verbindungseinrichtung für Leistungshalbleitermodule
JP2001351712A (ja) * 2000-06-07 2001-12-21 Auto Network Gijutsu Kenkyusho:Kk 端子の構造
TW515579U (en) 2001-12-21 2002-12-21 Hon Hai Prec Ind Co Ltd Socket connector terminal
US7144792B2 (en) * 2004-10-28 2006-12-05 Woodward Governor Company Method and apparatus for fabricating and connecting a semiconductor power switching device
JP4364135B2 (ja) * 2005-02-07 2009-11-11 矢崎総業株式会社 ジョイントコネクタの組み立て方法
JP4444852B2 (ja) * 2005-02-24 2010-03-31 三菱電機株式会社 同期電動機の固定子の製造方法及び同期電動機の固定子及び送風機
JP2007109499A (ja) * 2005-10-13 2007-04-26 Fujitsu Ltd コンタクト部材、コネクタ、基板、およびコネクタシステム
DE112008000229B4 (de) * 2007-01-22 2014-10-30 Mitsubishi Electric Corp. Leistungshalbleitervorrichtung
DE102007006212B4 (de) 2007-02-08 2012-09-13 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Kontaktfedern
JP4879069B2 (ja) * 2007-03-30 2012-02-15 矢崎総業株式会社 メタルコア基板
JP4567773B2 (ja) * 2008-07-18 2010-10-20 三菱電機株式会社 電力用半導体装置
JP4607995B2 (ja) * 2008-11-28 2011-01-05 三菱電機株式会社 電力用半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1249122A (zh) * 1997-03-27 2000-03-29 福特汽车公司 用于电子元件安装的模制插座
CN101828310A (zh) * 2007-10-19 2010-09-08 日本发条株式会社 连接端子、半导体封装、布线基板、连接器及微接触器

Also Published As

Publication number Publication date
JP2012151019A (ja) 2012-08-09
US20120187554A1 (en) 2012-07-26
CN102686013A (zh) 2012-09-19
DE102011087414A1 (de) 2012-07-26
DE102011087414B4 (de) 2021-12-09
US8575745B2 (en) 2013-11-05
JP5599328B2 (ja) 2014-10-01

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160203

Termination date: 20190930

CF01 Termination of patent right due to non-payment of annual fee